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NXP USA Inc. MC17XSF400EK

Part Number:

MC17XSF400EK

Manufacturer:

NXP USA Inc.

Ventron No:

3840143-MC17XSF400EK

Description:

IC SWITCH HIGH SIDE 32SOIC

Datasheet:

MC17XSF400EK

Payment:

Payment

Delivery:

Delivery

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Part Overview

Description
The 12XSFD1 is a high-side switch family that offers advanced control and diagnostics for DC motors and lighting drivers. It features daisy chainable SPI 5.0 MHz control, extended digital and analog feedbacks, and enhanced safety and robustness.

Features
Quad or penta high-side switches with high transient capability
16-bit 5.0 MHz SPI control for overcurrent profiles, channel control, output-ON and -OFF open load detections, thermal shutdown and prewarning, and fault reporting
Output current monitoring with programmable synchronization signal and supply voltage feedback
Limp home mode
External smart power switch control
Operating voltage range: 7.0 V to 18 V with sleep current < 5.0 μA, extended mode from 6.0 V to 28 V
-16 V reverse polarity and ground disconnect protections
Compatible PCB footprint and SPI software driver among the family

Applications
Low-voltage exterior lighting
Low-voltage industrial lighting
Halogen lamps
Incandescent bulbs
Light-emitting diodes (LEDs)
HID Xenon ballasts
DC motors
Low voltage automation systems

Specifications

NXP USA Inc. MC17XSF400EK technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MC17XSF400EK.

  • Factory Lead Time
    18 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    32-SSOP (0.295, 7.50mm Width) Exposed Pad
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~125°C TA
  • Packaging
    Tube
  • Published
    2014
  • JESD-609 Code
    e3
  • Feature
    Slew Rate Controlled
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Peak Reflow Temperature (Cel)
    260
  • Reflow Temperature-Max (s)
    40
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    4
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    N-Channel
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    SPI
  • Current - Output (Max)
    5.5A
  • Output Configuration

    Output Configuration refers to the arrangement of output terminals or pins on an electronic component. It specifies the number, type, and arrangement of these terminals, allowing for various connection options. This parameter is crucial for determining the component's compatibility with other devices and ensuring proper signal flow within a circuit.

    High Side
  • Voltage - Supply (Vcc/Vdd)
    4.5V~5.5V
  • Switch Type

    Switch Type refers to the type of switching mechanism used in an electronic switch. It indicates the technology or design employed to control the flow of electrical signals or power.

    General Purpose
  • Ratio - Input:Output
    1:1
  • Voltage - Load
    7V~18V
  • Fault Protection

    Fault Protection is an electronic component parameter that indicates the component's ability to withstand and protect against electrical faults or abnormal conditions. It specifies the maximum fault current or voltage that the component can safely handle without sustaining damage or compromising its functionality. This parameter is crucial for ensuring the reliability and safety of electronic systems by preventing catastrophic failures and protecting sensitive components from damage.

    Current Limiting (Fixed), Open Load Detect, Over Temperature
  • Rds On (Typ)
    17m Ω
  • RoHS Status
    ROHS3 Compliant

Product Comparison

The three parts on the right have similar specifications to MC17XSF400EK.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Feature
    Part Status
    Moisture Sensitivity Level (MSL)
    ECCN Code
    Terminal Finish
    Peak Reflow Temperature (Cel)
    Reflow Temperature-Max (s)
    Number of Outputs
    Output Type
    Interface
    Current - Output (Max)
    Output Configuration
    Voltage - Supply (Vcc/Vdd)
    Switch Type
    Ratio - Input:Output
    Voltage - Load
    Fault Protection
    Rds On (Typ)
    RoHS Status
    Pbfree Code
    Base Part Number
    Surface Mount
    Number of Terminations
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    JESD-30 Code
    Qualification Status
    Driver Number of Bits
    View Compare
  • MC17XSF400EK
    MC17XSF400EK
    18 Weeks
    Surface Mount
    32-SSOP (0.295, 7.50mm Width) Exposed Pad
    -40°C~125°C TA
    Tube
    2014
    e3
    Slew Rate Controlled
    Obsolete
    3 (168 Hours)
    EAR99
    Matte Tin (Sn)
    260
    40
    4
    N-Channel
    SPI
    5.5A
    High Side
    4.5V~5.5V
    General Purpose
    1:1
    7V~18V
    Current Limiting (Fixed), Open Load Detect, Over Temperature
    17m Ω
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MC17XS6400BEKR2
    -
    Surface Mount
    32-SSOP (0.295, 7.50mm Width) Exposed Pad
    -40°C~125°C TA
    Tape & Reel (TR)
    -
    -
    Slew Rate Controlled
    Obsolete
    3 (168 Hours)
    -
    -
    260
    NOT SPECIFIED
    4
    N-Channel
    SPI
    5.5A
    High Side
    4.5V~5.5V
    General Purpose
    1:1
    7V~18V
    Current Limiting (Fixed), Open Load Detect, Over Temperature
    17m Ω
    ROHS3 Compliant
    yes
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MC17XS6500EKR2
    -
    Surface Mount
    32-SSOP (0.295, 7.50mm Width) Exposed Pad
    -40°C~125°C TA
    Tape & Reel (TR)
    2011
    -
    Internal PWM
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    6
    N-Channel
    SPI
    -
    High Side
    4.5V~5.5V
    General Purpose
    1:1
    7V~18V
    Current Limiting (Fixed), Open Load Detect, Over Temperature
    17m Ω
    ROHS3 Compliant
    -
    MC17XS6500
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • MC17XSF500EK
    18 Weeks
    Surface Mount
    32-SSOP (0.295, 7.50mm Width) Exposed Pad
    -40°C~125°C TA
    Tube
    2011
    e3
    -
    Obsolete
    3 (168 Hours)
    EAR99
    Matte Tin (Sn)
    260
    40
    5
    N-Channel
    SPI
    5.5A
    High Side
    4.5V~5.5V
    General Purpose
    1:1
    7V~18V
    Current Limiting (Fixed), Open Load Detect, Over Temperature
    17m Ω
    ROHS3 Compliant
    -
    MC17XSF500
    YES
    32
    Peripheral Drivers
    BICMOS
    DUAL
    GULL WING
    R-PDSO-G32
    Not Qualified
    5

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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