MC100LVE222FAR2G
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ON Semiconductor MC100LVE222FAR2G

Part Number:
MC100LVE222FAR2G
Manufacturer:
ON Semiconductor
Ventron No:
2975156-MC100LVE222FAR2G
Description:
IC CLK BUFFER 2:15 1.5GHZ 52LQFP
ECAD Model:
Datasheet:
MC100LVE222 Series
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

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Qty

Unit Price

Ext Price

  • 1

    $10.3311

    $10.33

  • 200

    $3.9988

    $799.76

  • 500

    $3.8579

    $1928.95

  • 1500

    $3.7883

    $5682.45

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Part Overview
Description
The MC100LVE222 is a low skew 1:15 differential 1/ 2 ECL fanout buffer designed for clock distribution. It supports both differential and singleended LVECL/LVPECL input signals. The device features two fully differential clock inputs, and each of the four output banks (2, 3, 4, and 6 differential pairs) can be independently configured to fanout 1X or 1/2X of the input frequency. The LVE222 guarantees low outputtooutput skew, minimizing skew within a device and from lot to lot.

Features
200 ps ParttoPart Skew
50 ps OutputtoOutput Skew
Selectable 1x or 1/2x Frequency Outputs
ESD Protection: >2 kV HBM, >200 V MM
Internal Input Pulldown Resistors
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 2
Flammability Rating: UL 94 V0 @ 0.125 in.
Oxygen Index: 28 to 34
Transistor Count: 684 devices
PbFree Packages Available

Applications
Highperformance clock distribution in 3.3 V systems
Clock distribution across backplanes or boards
PECL mode operation with series or Thevenin line terminations
Specifications
ON Semiconductor MC100LVE222FAR2G technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor MC100LVE222FAR2G.
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    52-LQFP
  • Surface Mount
    YES
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    100LVE
  • JESD-609 Code
    e3
  • Pbfree Code
    no
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    2 (1 Year)
  • Number of Terminations
    52
  • Terminal Finish
    MATTE TIN
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    ECL
  • Voltage - Supply
    3V~5.25V
  • Terminal Position
    QUAD
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    40
  • Output
    ECL
  • Pin Count
    52
  • JESD-30 Code
    S-PQFP-G52
  • Qualification Status
    COMMERCIAL
  • Supply Voltage-Max (Vsup)
    3.8V
  • Supply Voltage-Min (Vsup)
    3V
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Frequency (Max)
    1.5GHz
  • Input
    LVECL, LVPECL
  • Ratio - Input:Output
    2:15
  • Differential - Input:Output
    Yes/Yes
  • Same Edge Skew-Max (tskwd)
    0.05 ns
  • RoHS Status
    Non-RoHS Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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