MB90F543GSPF-GS-BI24
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Cypress Semiconductor Corp MB90F543GSPF-GS-BI24

Part Number:
MB90F543GSPF-GS-BI24
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3154627-MB90F543GSPF-GS-BI24
Description:
IC MCU 16BIT 128KB FLASH 100QFP
ECAD Model:
Datasheet:
MB90F543GSPF-GS-BI24
Payment:
Payment
Delivery:
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  • 1

    $2.3531

    $2.35

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    $182.38

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    $0.8795

    $439.75

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Part Overview
Description
The MB90540G/545G series is a 16-bit proprietary microcontroller with FULL-CAN and Flash ROM. It is designed for automotive and industrial applications. The main features of the series are its on-board CAN Interfaces (MB90540G series: 2 channels, MB90545G series: 1 channel), which conform to CAN V2.0A and V2.08 specifications. The series also supports a flexible message buffer scheme, offering more functions than a normal full CAN approach.

Features
Embedded PLL clock multiplication circuit
Minimum instruction execution time: 62.5 ns
Subsystem Clock: 32 kHz
Rich data types (bit, byte, word, long word)
Rich addressing mode (23 types)
Enhanced signed multiplication/division instruction and RETI instruction functions
Enhanced precision calculation realized by the 32-bit accumulator
Instruction set designed for high level language (C language) and multi-task operations
Embedded ROM size and types:
MASK ROM: 256 Kbytes / 64 Kbytes/128 Kbytes
Flash ROM: 128 Kbytes/256 Kbytes
Embedded RAM size: 2 Kbytes/4 Kbytes/6 Kbytes/8 Kbytes (evaluation chip)
Flash ROM:
Supports automatic programming, Embedded Algorithm
Write/Erase/Erase-Suspend/Resume commands
A flag indicating completion of the algorithm
Hard-wired reset vector available in order to point to a fixed boot sector in Flash Memory
Erase can be performed on each block
Block protection with external programming voltage
Low-power consumption (stand-by) mode:
Sleep mode (mode in which CPU operating clock is stopped)
Stop mode (mode in which oscillation is stopped)
CPU intermittent operation mode
Watch mode
Hardware stand-by mode
Process: 0.5 μm CMOS technology
VO port: General-purpose I/O ports: 81 ports
Timer:
Watchdog timer: 1 channel
8/16-bit PPG timer: 8/16-bit x 4 channels
16-bit reload timer: 2 channels
16-bit I/O timer:
16-bit free-run timer: 1 channel
Input capture: 8 channels
Output compare: 4 channels
Extended I/O serial interface: 1 channel
UART0:
With full-duplex double buffer (8-bit length)
Clock asynchronized or clock synchronized (with start/stop bit) transmission can be selectively used.
UART1 (SCI):
With full-duplex double buffer (8-bit length)
Clock asynchronized or clock synchronized serial (extended I/O serial) can be used.
External interrupt circuit (8 channels):
A module for starting an extended intelligent I/O service (EOS) and generating an external interrupt which is triggered by an external input.
Delayed interrupt generation module: Generates an interrupt request for switching tasks.
8/10-bit A/D converter (8 channels): 8/10-bit resolution can be selectively used.

Applications
The MB90540G/545G series is suitable for a wide range of automotive and industrial applications, including:
Engine control
Transmission control
Body control
Safety systems
Industrial automation
Robotics
Specifications
Cypress Semiconductor Corp MB90F543GSPF-GS-BI24 technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp MB90F543GSPF-GS-BI24.
  • Factory Lead Time
    13 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    100-BQFP
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    100
  • Supplier Device Package
    100-QFP (14x20)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~105°C TA
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    F2MC-16LX MB90540G
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Max Operating Temperature
    105°C
  • Min Operating Temperature
    -40°C
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    16MHz
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    CAN, EBI/EMI, SCI, Serial, UART, USART
  • Memory Size
    128kB
  • Oscillator Type
    External
  • Number of I/O
    81
  • Speed

    Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.

    16MHz
  • RAM Size
    6K x 8
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    FLASH
  • Voltage - Supply (Vcc/Vdd)
    4.5V~5.5V
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    F2MC-16LX
  • Peripherals
    POR, WDT
  • Program Memory Type
    FLASH
  • Core Size

    Core Size refers to the physical dimensions of the magnetic core used in an electronic component, such as an inductor or transformer. It is typically expressed in terms of its length, width, and height, or as a diameter and height for cylindrical cores. The core size determines the inductance, current-carrying capacity, and other electrical characteristics of the component. Larger core sizes generally result in higher inductance and current-handling capabilities.

    16-Bit
  • Program Memory Size
    128KB 128K x 8
  • Connectivity

    Connectivity refers to the number of terminals or pins on an electronic component that allow it to connect to other components in a circuit. It determines the component's ability to interact and exchange signals with other elements in the system. Higher connectivity indicates more connection points, enabling the component to perform complex functions and integrate with various circuits.

    CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
  • Data Converter
    A/D 8x8/10b
  • RoHS Status
    ROHS3 Compliant
Product Comparison
The three parts on the right have similar specifications to MB90F543GSPF-GS-BI24.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Interface
    Memory Size
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Memory Type
    Voltage - Supply (Vcc/Vdd)
    Core Processor
    Peripherals
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Data Converter
    RoHS Status
    Capacitance
    View Compare
  • MB90F543GSPF-GS-BI24
    MB90F543GSPF-GS-BI24
    13 Weeks
    Surface Mount
    100-BQFP
    100
    100-QFP (14x20)
    -40°C~105°C TA
    Tray
    F2MC-16LX MB90540G
    Active
    3 (168 Hours)
    105°C
    -40°C
    16MHz
    CAN, EBI/EMI, SCI, Serial, UART, USART
    128kB
    External
    81
    16MHz
    6K x 8
    FLASH
    4.5V~5.5V
    F2MC-16LX
    POR, WDT
    FLASH
    16-Bit
    128KB 128K x 8
    CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
    A/D 8x8/10b
    ROHS3 Compliant
    -
    -
  • MB90349CASPFV-GS-426E1
    -
    Surface Mount
    100-LQFP
    -
    100-LQFP (14x14)
    -40°C~105°C TA
    Tray
    F2MC-16LX MB90340
    Obsolete
    3 (168 Hours)
    105°C
    -40°C
    24MHz
    CAN, EBI/EMI, I2C, LIN, SCI, UART, USART
    256kB
    External
    82
    24MHz
    16K x 8
    Mask ROM
    3.5V~5.5V
    F2MC-16LX
    DMA, POR, WDT
    Mask ROM
    16-Bit
    256KB 256K x 8
    CANbus, EBI/EMI, I2C, LINbus, SCI, UART/USART
    A/D 24x8/10b
    ROHS3 Compliant
    -16F
  • MB90349ASPMC-GS-361E1
    -
    Surface Mount
    100-LQFP
    -
    100-LQFP (14x14)
    -40°C~105°C TA
    Tray
    F2MC-16LX MB90340
    Obsolete
    3 (168 Hours)
    105°C
    -40°C
    24MHz
    CAN, EBI/EMI, LIN, SCI, UART, USART
    256kB
    External
    82
    24MHz
    16K x 8
    Mask ROM
    3.5V~5.5V
    F2MC-16LX
    DMA, POR, WDT
    Mask ROM
    16-Bit
    256KB 256K x 8
    CANbus, EBI/EMI, LINbus, SCI, UART/USART
    A/D 16x8/10b
    ROHS3 Compliant
    -16F
  • MB90347DASPFV-GS-478E1
    -
    Surface Mount
    100-LQFP
    -
    100-LQFP (14x14)
    -40°C~105°C TA
    Tray
    F2MC-16LX MB90340
    Obsolete
    3 (168 Hours)
    105°C
    -40°C
    24MHz
    CAN, EBI/EMI, LIN, SCI, UART, USART
    128kB
    External
    82
    24MHz
    6K x 8
    Mask ROM
    3.5V~5.5V
    F2MC-16LX
    DMA, POR, WDT
    Mask ROM
    16-Bit
    128KB 128K x 8
    CANbus, EBI/EMI, LINbus, SCI, UART/USART
    A/D 16x8/10b
    ROHS3 Compliant
    -16F
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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