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Maxim Integrated MAX620CPN+

Part Number:

MAX620CPN+

Manufacturer:

Maxim Integrated

Ventron No:

3254445-MAX620CPN+

Description:

IC DRVR MOSFET QUAD 18-DIP

ECAD Model:

Datasheet:

MAX620CPN+

Payment:

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Delivery:

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Reference Price ( In US Dollars )

Pricing

Qty

Unit Price

Ext Price

  • 1

    $6.1137

    $6.11

  • 200

    $2.3660

    $473.20

  • 500

    $2.2840

    $1142.00

  • 1000

    $2.2422

    $2242.20

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Part Overview

Description
The MAX620/MAX621 are quad, high-side MOSFET drivers with a charge-pump high-side power supply. They incorporate four MOSFET drivers and a charge-pump high-side power supply to power high-side switching and control circuits. The charge pump delivers a regulated output voltage 11V greater than VCC to the drivers, which then translate a TTL/CMOS input signal to a non-inverted output that swings from ground to the high-side voltage. The outputs drive channel FETs in high-side or low-side switching applications, including a wide range of line- and battery-powered applications.

Features
Output Voltage Regulated to Vcc Plus 11V (Typ)
Low Quiescent Current - 70µA (Typ)
Undervoltage Lockout
Power-Ready Output
Internal Quad Latch

Applications
Portable Computer Battery Load Management
High-Side Power, N-Channel MOSFET Switching
Low-Side Switching from Low Supply Voltages
Quad-Latching Level Translators
H-Bridge Motor Drivers
Stepper Motor Drivers

Specifications

Maxim Integrated MAX620CPN+ technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated MAX620CPN+.

  • Factory Lead Time
    6 Weeks
  • Mount
    Through Hole
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    18-DIP (0.300, 7.62mm)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    18
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C TA
  • Packaging
    Tube
  • Published
    1996
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    18
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Max Power Dissipation
    640mW
  • Voltage - Supply
    4.5V~16.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    4
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Base Part Number
    MAX620
  • Pin Count
    18
  • Max Output Current
    25mA
  • Operating Supply Voltage
    5V
  • Nominal Supply Current
    500μA
  • Output Current

    Output Current is the maximum amount of current that an electronic component can deliver to a load without exceeding its specified operating limits. It is typically measured in amperes (A) or milliamperes (mA). Output Current is a critical parameter for selecting electronic components, as it determines the amount of power that the component can provide to a load.

    25mA
  • Max Supply Current
    500μA
  • Input Type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Non-Inverting
  • Rise Time
    1.7μs
  • Fall Time (Typ)
    2.5 μs
  • Rise / Fall Time (Typ)
    1.7μs 2.5μs
  • Interface IC Type
    BUFFER OR INVERTER BASED MOSFET DRIVER
  • Channel Type

    Channel Type refers to the type of semiconductor material used in the construction of a field-effect transistor (FET). The two main types of channel materials are n-type and p-type. N-type channels are made from materials with an excess of electrons, while p-type channels are made from materials with an excess of holes. The type of channel material determines the polarity of the FET and its operating characteristics.

    Independent
  • Number of Drivers
    4
  • Output Peak Current Limit-Nom
    0.025A
  • Driven Configuration
    High-Side
  • Gate Type
    N-Channel MOSFET
  • High Side Driver
    YES
  • Logic Voltage - VIL, VIH

    In digital electronics, logic voltage refers to the voltage levels that represent logical states.

    0.8V 2.4V
  • Height Seated (Max)
    5.72mm
  • Width
    7.62mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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