MAX1165BCUI+

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Maxim Integrated MAX1165BCUI+

Part Number:

MAX1165BCUI+

Manufacturer:

Maxim Integrated

Ventron No:

3012192-MAX1165BCUI+

Description:

IC ADC 16BIT PARALLEL 28-TSSOP

ECAD Model:

Datasheet:

MAX1165BCUI+

Payment:

Payment

Delivery:

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Reference Price ( In US Dollars )

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Unit Price

Ext Price

  • 1

    $39.0955

    $39.10

  • 200

    $15.5999

    $3119.98

  • 500

    $15.0785

    $7539.25

  • 1000

    $14.8217

    $14821.70

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    One Stop Service

  • Competitive Price

    Competitive Price

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    Same Day Delivery

Part Overview

Description
The MAX1165/MAX1166 are 16-bit, low-power, successive-approximation analog-to-digital converters (ADCs) with automatic power-down, factory-trimmed internal clock, and a 16-bit wide (MAX1165) or byte wide (MAX1166) parallel interface. They operate from a single 4.75V to 5.25V analog supply and a 2.7V to 5.25V digital supply. The MAX1165/MAX1166 use an internal 4.096V reference or an external reference. They consume only 1.8mA at a sampling rate of 165ksps with external reference and 2.7mA with internal reference. AutoShutdown™ reduces supply current to 0.1mA at 10ksps.

Features
16-Bit Wide (MAX1165) and Byte Wide (MAX1166) Parallel Interface
High Speed: 165ksps Sample Rate
Accurate: ±2.5 LSB INL, 16 Bit No Missing Codes
4.096V, 25ppm/°C Internal Reference
External Reference Range: 3.8V to 5.25V
Single 4.75V to 5.25V Analog Supply Voltage
2.7V to 5.25V Digital Supply Voltage
Low Supply Current
1.8mA (External Reference)
2.7mA (Internal Reference)
0.1μA (10ksps, External Reference)
Small Footprint
28-Pin TSSOP Package (16-Bit Wide)
20-Pin TSSOP Package (Byte Wide)

Applications
Temperature Sensor/Monitor
Industrial Process Control
I/O Boards
Data-Acquisition Systems
Cable/Harness Tester
Accelerometer Measurements
Digital Signal Processing

Specifications

Maxim Integrated MAX1165BCUI+ technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated MAX1165BCUI+.

  • Factory Lead Time
    6 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    28-TSSOP (0.173, 4.40mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    28
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C
  • Packaging
    Tube
  • Published
    2008
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    28
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Subcategory
    Analog to Digital Converters
  • Max Power Dissipation
    16mW
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    BICMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MAX1165
  • Pin Count
    28
  • Polarity

    Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

    Unipolar
  • Power Supplies
    3/55V
  • Configuration
    S/H-ADC
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    1
  • Max Supply Voltage
    5.25V
  • Min Supply Voltage
    4.75V
  • Number of Bits
    16
  • Input Type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Single Ended
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    SAR
  • Converter Type

    Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.

    ADC, SUCCESSIVE APPROXIMATION
  • Supply Type
    Single
  • Reference Type

    Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

    External, Internal
  • Data Interface

    Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

    Parallel
  • Resolution
    2 B
  • Sampling Rate

    Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.

    165 ksps
  • Voltage - Supply, Analog
    5V
  • Voltage - Supply, Digital
    2.7V~5.25V
  • Number of Analog In Channels
    1
  • Sampling Rate (Per Second)
    165k
  • Output Bit Code
    BINARY
  • Sample and Hold / Track and Hold
    TRACK
  • Conversion Rate
    165 ksps
  • Ratio - S/H:ADC

    Ratio - S/H:ADC is an electronic component parameter that specifies the ratio of the output voltage of a sample-and-hold (S/H) circuit to the input voltage of the analog-to-digital converter (ADC). It is expressed as a percentage and indicates the accuracy of the ADC's conversion process. A higher ratio indicates better accuracy, as it means that the ADC is able to convert the analog input signal into a digital representation with less error.

    1:1
  • Analog Input Voltage-Max
    4.096V
  • Signal to Noise Ratio (SNR)
    90 dB
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    9.7mm
  • Width
    4.4mm
  • Radiation Hardening
    No
  • REACH SVHC
    Unknown
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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