Micron Technology Inc. M58LT256KST8ZA6F TR

M58LT256KST8ZA6F TR Overview
The mounting type for this particular electronic component is surface mount, which is a common method used for attaching electronic components to printed circuit boards. The package or case for this component is a 64-TBGA, which stands for Thin Ball Grid Array, and is a type of integrated circuit package. It has a wide operating temperature range of -40°C to 85°C TA, making it suitable for use in various environments. The packaging for this component is tape and reel, which is a popular method for shipping and handling electronic components. With a memory size of 256Mb 16M x 16, this component has a large storage capacity. It is a non-volatile memory type, meaning it retains data even when power is turned off. The clock frequency for this component is 52MHz, indicating its fast processing speed. It has a FLASH memory format and a parallel memory interface, allowing for efficient data transfer. Additionally, this component is ROHS3 compliant, meaning it meets the Restriction of Hazardous Substances directive for environmental safety.

M58LT256KST8ZA6F TR Features
Package / Case: 64-TBGA


M58LT256KST8ZA6F TR Applications
There are a lot of Micron Technology Inc.
M58LT256KST8ZA6F TR Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory