Micron Technology Inc. M39L0R8090U3ZE6F TR

M39L0R8090U3ZE6F TR Overview
The package or case for this particular electronic component is a 133-VFBGA, which is a type of ball grid array package that has 133 balls arranged in a grid on the bottom of the package. The packaging method used for this component is Tape & Reel (TR), which is a common method for shipping and handling electronic components. However, despite its advanced technology, this component is now considered obsolete, meaning it is no longer in production. It has a Moisture Sensitivity Level (MSL) of 3, which means it can withstand exposure to moisture for up to 168 hours. This component utilizes FLASH - NOR and Mobile LPDDR SDRAM technology, providing non-volatile memory with a size of 256Mb 16M x 16 512M 32M x 16. Its access time is 70ns, and it has a memory format of FLASH and RAM, with a parallel memory interface.

M39L0R8090U3ZE6F TR Features
Package / Case: 133-VFBGA


M39L0R8090U3ZE6F TR Applications
There are a lot of Micron Technology Inc.
M39L0R8090U3ZE6F TR Memory applications.


telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)