M2S090T-1FGG676

Microsemi Corporation M2S090T-1FGG676

Part Number:
M2S090T-1FGG676
Manufacturer:
Microsemi Corporation
Ventron No:
3828195-M2S090T-1FGG676
Description:
IC FPGA SOC 90K LUTS 676FBGA
ECAD Model:
Datasheet:
SmartFusion2 Datasheet SmartFusion2 Pin Descriptions

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Specifications
Microsemi Corporation M2S090T-1FGG676 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S090T-1FGG676.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Package / Case
    676-BGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Frequency
    166MHz
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    M2S090T
  • JESD-30 Code
    S-PBGA-B676
  • Number of Outputs
    425
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Interface
    CAN, Ethernet, I2C, SPI, UART, USART, USB
  • Number of I/O
    425
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    425
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Core Architecture
    ARM
  • Primary Attributes
    FPGA - 90K Logic Modules
  • Number of Logic Cells
    86316
  • Flash Size
    512KB
  • Height Seated (Max)
    2.44mm
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The M2S090T is a highly advanced microcontroller that boasts an impressive array of features and capabilities. Its Lifecycle Status is currently listed as IN PRODUCTION, meaning that it is actively being manufactured and available for purchase. The JESD-609 Code for this device is e3, indicating that it meets the industry's highest standards for reliability and performance. With a Supply Voltage of 1.2V and a Frequency of 166MHz, the M2S090T is able to handle complex tasks with ease. This powerful microcontroller is equipped with a ARM® Cortex®-M3 Core Processor, providing efficient and reliable processing power. It also offers a wide range of connectivity options, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. Despite its impressive capabilities, the M2S090T has a compact form factor, with a Height Seated (Max) of only 2.44mm and a Width of 27mm. However, it should be noted that this device has not yet been qualified, meaning that it has not undergone the necessary testing and certification processes. Overall, the M2S090T is a cutting-edge microcontroller that offers a perfect balance of performance, connectivity, and size.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
M2S090T-1FGG676 System On Chip (SoC) applications.

Functional safety for critical applications in the industrial sectors
Level
Digital Signal Processing
Industrial sectors
Samsung galaxy gear
Remote control
Personal Computers
Measurement testers
USB hard disk enclosure
Automotive
M2S090T-1FGG676 More Descriptions
M2S090T-1Fgg676 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-1FGG676
SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
Product Comparison
The three parts on the right have similar specifications to M2S090T-1FGG676.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Number of I/O
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Core Architecture
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Speed
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    View Compare
  • M2S090T-1FGG676
    M2S090T-1FGG676
    10 Weeks
    IN PRODUCTION (Last Updated: 3 weeks ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    166MHz
    NOT SPECIFIED
    M2S090T
    S-PBGA-B676
    425
    Not Qualified
    1.26V
    1.2V
    1.14V
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    425
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    425
    FIELD PROGRAMMABLE GATE ARRAY
    ARM
    FPGA - 90K Logic Modules
    86316
    512KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    -
    -
    -
    -
    -
  • M2S060T-1FGG676
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    -
    NOT SPECIFIED
    -
    S-PBGA-B676
    387
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    387
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    387
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 60K Logic Modules
    56520
    256KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    166MHz
    -
    -
    -
  • M2S010-1TQG144
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    144-LQFP
    YES
    0°C~85°C TJ
    Tray
    2015
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    -
    NOT SPECIFIED
    -
    S-PQFP-G144
    84
    Not Qualified
    1.26V
    1.2V
    1.14V
    -
    84
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    84
    FIELD PROGRAMMABLE GATE ARRAY
    -
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    166MHz
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    166MHz
    -
    M2S025
    -
    -
    -
    -
    -
    -
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    267
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    ARM
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    166MHz
    484-FPBGA (23x23)
    85°C
    0°C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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