Microsemi Corporation M2S060TS-VFG400
- Part Number:
- M2S060TS-VFG400
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544250-M2S060TS-VFG400
- Description:
- IC FPGA SOC 60K LUTS
- Datasheet:
- M2S060TS-VFG400
Microsemi Corporation M2S060TS-VFG400 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S060TS-VFG400.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case400-LFBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations400
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.8mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B400
- Number of Outputs207
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O207
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs207
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 60K Logic Modules
- Number of Logic Cells56520
- Flash Size256KB
- Height Seated (Max)1.51mm
- Length17mm
- Width17mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 400-LFBGA to this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 207 I/Os in total.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.It is really beneficial to have system on a chip since there are 400 terminations in total.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.There are 207 outputs available on this SoC.This system on chip SoC requires 1.2V power supply at all.This SoC chip has a total of 207 inputs that can be used.System on chips of logic are comprised of 56520 logic cells.There is a flash of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-VFG400 System On Chip (SoC) applications.
Industrial transport
Mobile market
Smart appliances
Cyber security for critical applications in the aerospace
Temperature Sensors
ARM Cortex M4 microcontroller
Healthcare
CNC control
Networked sensors
PC peripherals
A ARM? Cortex?-M3 core processor(s) is built into this SoC.Manufacturer assigns package 400-LFBGA to this system on a chip.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.There is one thing to note about this SoC security: it combines FPGA - 60K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 207 I/Os in total.A 1.2V power supply should be used.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.It can feed on a power supply of at least 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.It is really beneficial to have system on a chip since there are 400 terminations in total.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.There are 207 outputs available on this SoC.This system on chip SoC requires 1.2V power supply at all.This SoC chip has a total of 207 inputs that can be used.System on chips of logic are comprised of 56520 logic cells.There is a flash of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-VFG400 System On Chip (SoC) applications.
Industrial transport
Mobile market
Smart appliances
Cyber security for critical applications in the aerospace
Temperature Sensors
ARM Cortex M4 microcontroller
Healthcare
CNC control
Networked sensors
PC peripherals
M2S060TS-VFG400 More Descriptions
M2S060Ts-Vfg400 400 Lfbga 17X17X1.51Mm Tray Rohs Compliant: Yes |Microchip M2S060TS-VFG400
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
The three parts on the right have similar specifications to M2S060TS-VFG400.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPbfree CodeReach Compliance CodeSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
-
M2S060TS-VFG40010 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)400-LFBGAYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)400MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.8mmNOT SPECIFIEDS-PBGA-B400207Not Qualified1.26V1.2V1.14V207166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA207FIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules56520256KB1.51mm17mm17mmRoHS Compliant----------
-
-OBSOLETE (Last Updated: 3 weeks ago)144-LQFPYES-40°C~100°C TJTray2015SmartFusion®2e0Obsolete3 (168 Hours)144Tin/Lead (Sn/Pb)8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 5K Logic Modules-128KB1.6mm20mm20mmNon-RoHS Compliantnonot_compliant-------
-
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFPYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliantyes--------
-
8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---Non-RoHS Compliant--484-FPBGA (23x23)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
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