Microsemi Corporation M2S060T-1FGG676I
- Part Number:
- M2S060T-1FGG676I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544255-M2S060T-1FGG676I
- Description:
- IC FPGA SOC 60K LUTS
- Datasheet:
- M2S060T-1FGG676I
Microsemi Corporation M2S060T-1FGG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S060T-1FGG676I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Package / Case676-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B676
- Number of Outputs387
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O387
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs387
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 60K Logic Modules
- Number of Logic Cells56520
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length27mm
- Width27mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
On this SoC, there is ARM? Cortex?-M3 core processor.There is a 676-BGA package assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 387 I/Os.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.It can feed on a power supply of at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 676 terminations, so system on a chip is really aided by this.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There are 387 outputs available on this SoC.There is 1.2V power supply required for system on chip.This SoC chip is equipped with 387 inputs for the user to choose from.56520 logic cells are included in logic system on chips.A flashing 256KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-1FGG676I System On Chip (SoC) applications.
Temperature Sensors
Communication interfaces ( I2C, SPI )
sequence controllers
Special Issue Editors
CNC control
Smartphone accessories
Medical
Digital Media
Functional safety for critical applications in the aerospace
Industrial AC-DC
On this SoC, there is ARM? Cortex?-M3 core processor.There is a 676-BGA package assigned to this system on a chip by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series in which this system on chip SoC falls under.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.A key point to note is that this SoC security combines FPGA - 60K Logic Modules.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 387 I/Os.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.It can feed on a power supply of at least 1.14V.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.In total, there are 676 terminations, so system on a chip is really aided by this.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.There are 387 outputs available on this SoC.There is 1.2V power supply required for system on chip.This SoC chip is equipped with 387 inputs for the user to choose from.56520 logic cells are included in logic system on chips.A flashing 256KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-1FGG676I System On Chip (SoC) applications.
Temperature Sensors
Communication interfaces ( I2C, SPI )
sequence controllers
Special Issue Editors
CNC control
Smartphone accessories
Medical
Digital Media
Functional safety for critical applications in the aerospace
Industrial AC-DC
M2S060T-1FGG676I More Descriptions
M2S060T-1Fgg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S060T-1FGG676I
FPGA SmartFusion2 56520 Cells 166MHz 65nm Technology 1.2V 676-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
FPGA SmartFusion2 56520 Cells 166MHz 65nm Technology 1.2V 676-Pin FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56.5KLEs
IC SOC CORTEX-M3 166MHZ 676FBGA
The three parts on the right have similar specifications to M2S060T-1FGG676I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S060T-1FGG676I10 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)676-BGAYES-40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)676MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B676387Not Qualified1.26V1.2V1.14V387166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA387FIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules56520256KB2.44mm27mm27mmRoHS Compliant--------
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10 WeeksIN PRODUCTION (Last Updated: 1 month ago)144-LQFPYES0°C~85°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSQUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G14484Not Qualified1.26V1.2V1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA84FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliant-------
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--484-BGA--40°C~100°C TJTray-SmartFusion®2-Obsolete3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 90K Logic Modules-512KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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