Microsemi Corporation M2S050-VFG400I
- Part Number:
- M2S050-VFG400I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3162368-M2S050-VFG400I
- Description:
- IC FPGA SOC 50K LUT 400VFBGA
- Datasheet:
- M2S050-VFG400I
Microsemi Corporation M2S050-VFG400I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050-VFG400I.
- Factory Lead Time7 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case400-LFBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2014
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations400
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.8mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B400
- Number of Outputs207
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O207
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs207
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 50K Logic Modules
- Number of Logic Cells56340
- Flash Size256KB
- Height Seated (Max)1.51mm
- Length17mm
- Width17mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.It has been assigned a package 400-LFBGA by its manufacturer for this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 207.It is advised to utilize a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.At least 1.14V can be supplied as a power source.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.In total, there are 400 terminations, which is great for system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.This SoC chip is capable of having 207 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.This SoC chip is equipped with 207 inputs for the user to choose from.A logic SoC has 56340 logic cells.As for its flash size, it is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050-VFG400I System On Chip (SoC) applications.
Industrial AC-DC
Temperature Sensors
Defense
Industrial Pressure
Servo drive control module
ARM
Efficient hardware for inference of neural networks
Robotics
Vending machines
External USB hard disk/SSD
There are ARM? Cortex?-M3 core processors in this SoC.It has been assigned a package 400-LFBGA by its manufacturer for this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 207.It is advised to utilize a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.At least 1.14V can be supplied as a power source.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.In total, there are 400 terminations, which is great for system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.This SoC chip is capable of having 207 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.This SoC chip is equipped with 207 inputs for the user to choose from.A logic SoC has 56340 logic cells.As for its flash size, it is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050-VFG400I System On Chip (SoC) applications.
Industrial AC-DC
Temperature Sensors
Defense
Industrial Pressure
Servo drive control module
ARM
Efficient hardware for inference of neural networks
Robotics
Vending machines
External USB hard disk/SSD
M2S050-VFG400I More Descriptions
M2S050-Vfg400I 400 Lfbga 17X17X1.51Mm Tray Rohs Compliant: Yes |Microchip M2S050-VFG400I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
The three parts on the right have similar specifications to M2S050-VFG400I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S050-VFG400I7 WeeksIN PRODUCTION (Last Updated: 1 month ago)400-LFBGAYES-40°C~100°C TJTray2014SmartFusion®2e3Active3 (168 Hours)400MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.8mmNOT SPECIFIEDS-PBGA-B400207Not Qualified1.26V1.2V1.14V207166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA207FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB1.51mm17mm17mmRoHS Compliant--------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)676-BGAYES0°C~85°C TJTray-SmartFusion®2e3Active3 (168 Hours)676MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B676387Not Qualified1.26V1.2V1.14V387166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA387FIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules56520256KB2.44mm27mm27mmRoHS Compliant-------
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8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---Non-RoHS Compliant484-FPBGA (23x23)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)-----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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