M2S050-VFG400I

Microsemi Corporation M2S050-VFG400I

Part Number:
M2S050-VFG400I
Manufacturer:
Microsemi Corporation
Ventron No:
3162368-M2S050-VFG400I
Description:
IC FPGA SOC 50K LUT 400VFBGA
ECAD Model:
Datasheet:
M2S050-VFG400I

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Specifications
Microsemi Corporation M2S050-VFG400I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S050-VFG400I.
  • Factory Lead Time
    7 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Package / Case
    400-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2014
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    400
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B400
  • Number of Outputs
    207
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    207
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    207
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 50K Logic Modules
  • Number of Logic Cells
    56340
  • Flash Size
    256KB
  • Height Seated (Max)
    1.51mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.It has been assigned a package 400-LFBGA by its manufacturer for this system on a chip.A 64KB RAM SoC chip provides reliable performance to users.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series number of this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.Taking note of the fact that this SoC security combines FPGA - 50K Logic Modules is important.In the state-of-the-art Tray package, this SoC system on a chip is housed.Total I/Os on this SoC part are 207.It is advised to utilize a 1.2V power supply.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.At least 1.14V can be supplied as a power source.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.In total, there are 400 terminations, which is great for system on a chip.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.This SoC chip is capable of having 207 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.This SoC chip is equipped with 207 inputs for the user to choose from.A logic SoC has 56340 logic cells.As for its flash size, it is 256KB.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S050-VFG400I System On Chip (SoC) applications.

Industrial AC-DC
Temperature Sensors
Defense
Industrial Pressure
Servo drive control module
ARM
Efficient hardware for inference of neural networks
Robotics
Vending machines
External USB hard disk/SSD
M2S050-VFG400I More Descriptions
M2S050-Vfg400I 400 Lfbga 17X17X1.51Mm Tray Rohs Compliant: Yes |Microchip M2S050-VFG400I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 56KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
Product Comparison
The three parts on the right have similar specifications to M2S050-VFG400I.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S050-VFG400I
    M2S050-VFG400I
    7 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    400-LFBGA
    YES
    -40°C~100°C TJ
    Tray
    2014
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    400
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.8mm
    NOT SPECIFIED
    S-PBGA-B400
    207
    Not Qualified
    1.26V
    1.2V
    1.14V
    207
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    207
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 50K Logic Modules
    56340
    256KB
    1.51mm
    17mm
    17mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S060T-1FGG676
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    -
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B676
    387
    Not Qualified
    1.26V
    1.2V
    1.14V
    387
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    387
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 60K Logic Modules
    56520
    256KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S025T-1FGG484I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    2009
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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