Microsemi Corporation M2S025TS-FCSG325
- Part Number:
- M2S025TS-FCSG325
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 4544258-M2S025TS-FCSG325
- Description:
- IC FPGA SOC 25K LUTS
- Datasheet:
- M2S025TS-FCSG325
Microsemi Corporation M2S025TS-FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S025TS-FCSG325.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 2 weeks ago)
- Package / Case325-TFBGA, CSPBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations325
- Terminal FinishMATTE TIN
- Additional FeatureLG-MIN, WD-MIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.5mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B325
- Number of Outputs180
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O180
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs180
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 25K Logic Modules
- Number of Logic Cells27696
- Flash Size256KB
- Height Seated (Max)1.01mm
- Length11mm
- Width11mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.The SmartFusion?2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.In total, this SoC part has 180 I/Os.It is recommended to use a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.Power supplies of at least 1.14V are required.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 325 terminations, which makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 180 outputs is available.As far as power supplies are concerned, system on chip requires 1.2V.The SoC chip is equipped with 180 inputs.In logic system on chips, there are 27696 logic cells.The flash is set to 256KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025TS-FCSG325 System On Chip (SoC) applications.
Central inverter
POS Terminals
Microcontroller based SoC ( RISC-V, ARM)
ARM processors
AC-input BLDC motor drive
Temperature
Central alarm system
Central alarm system
Smart appliances
Level
There are ARM? Cortex?-M3 core processors in this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.The SmartFusion?2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.In total, this SoC part has 180 I/Os.It is recommended to use a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.Power supplies of at least 1.14V are required.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 325 terminations, which makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 180 outputs is available.As far as power supplies are concerned, system on chip requires 1.2V.The SoC chip is equipped with 180 inputs.In logic system on chips, there are 27696 logic cells.The flash is set to 256KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025TS-FCSG325 System On Chip (SoC) applications.
Central inverter
POS Terminals
Microcontroller based SoC ( RISC-V, ARM)
ARM processors
AC-input BLDC motor drive
Temperature
Central alarm system
Central alarm system
Smart appliances
Level
M2S025TS-FCSG325 More Descriptions
M2S025Ts-Fcsg325 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2S025TS-FCSG325
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
The three parts on the right have similar specifications to M2S025TS-FCSG325.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPublishedPbfree CodeReach Compliance CodeSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S025TS-FCSG32510 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)325-TFBGA, CSPBGAYES0°C~85°C TJTraySmartFusion®2e3Active3 (168 Hours)325MATTE TINLG-MIN, WD-MIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PBGA-B325180Not Qualified1.26V1.2V1.14V180166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA180FIELD PROGRAMMABLE GATE ARRAYFPGA - 25K Logic Modules27696256KB1.01mm11mm11mmRoHS Compliant-----------
-
-OBSOLETE (Last Updated: 3 weeks ago)144-LQFPYES-40°C~100°C TJTraySmartFusion®2e0Obsolete3 (168 Hours)144Tin/Lead (Sn/Pb)-8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 5K Logic Modules-128KB1.6mm20mm20mmNon-RoHS Compliant2015nonot_compliant-------
-
--484-BGA--40°C~100°C TJTraySmartFusion®2-Obsolete3 (168 Hours)------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 90K Logic Modules-512KB---RoHS Compliant---484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA--40°C~100°C TJTraySmartFusion®2-Active3 (168 Hours)------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---RoHS Compliant2009--484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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