M2S025TS-FCSG325

Microsemi Corporation M2S025TS-FCSG325

Part Number:
M2S025TS-FCSG325
Manufacturer:
Microsemi Corporation
Ventron No:
4544258-M2S025TS-FCSG325
Description:
IC FPGA SOC 25K LUTS
ECAD Model:
Datasheet:
M2S025TS-FCSG325

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Specifications
Microsemi Corporation M2S025TS-FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S025TS-FCSG325.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 2 weeks ago)
  • Package / Case
    325-TFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    325
  • Terminal Finish
    MATTE TIN
  • Additional Feature
    LG-MIN, WD-MIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    0.5mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B325
  • Number of Outputs
    180
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    180
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    180
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 25K Logic Modules
  • Number of Logic Cells
    27696
  • Flash Size
    256KB
  • Height Seated (Max)
    1.01mm
  • Length
    11mm
  • Width
    11mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.The SmartFusion?2 series contains this system on chip SoC.It is expected that this SoC meaning will operate at 0°C~85°C TJ on average.There is one thing to note about this SoC security: it combines FPGA - 25K Logic Modules.A state-of-the-art Tray package houses this SoC system on a chip.In total, this SoC part has 180 I/Os.It is recommended to use a 1.2V power supply.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.Power supplies of at least 1.14V are required.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.In total, there are 325 terminations, which makes system on a chip possible.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.A SoC chip with 180 outputs is available.As far as power supplies are concerned, system on chip requires 1.2V.The SoC chip is equipped with 180 inputs.In logic system on chips, there are 27696 logic cells.The flash is set to 256KB.Aside from that, this SoC processor is also equipped with some additional features that are present in LG-MIN, WD-MIN.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation
M2S025TS-FCSG325 System On Chip (SoC) applications.

Central inverter
POS Terminals
Microcontroller based SoC ( RISC-V, ARM)
ARM processors
AC-input BLDC motor drive
Temperature
Central alarm system
Central alarm system
Smart appliances
Level
M2S025TS-FCSG325 More Descriptions
M2S025Ts-Fcsg325 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2S025TS-FCSG325
SmartFusion2 SoC FPGA, ARM Cortex-M3, 27.6KLEs
IC SOC CORTEX-M3 166MHZ 325BGA
Product Comparison
The three parts on the right have similar specifications to M2S025TS-FCSG325.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Pbfree Code
    Reach Compliance Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S025TS-FCSG325
    M2S025TS-FCSG325
    10 Weeks
    IN PRODUCTION (Last Updated: 2 weeks ago)
    325-TFBGA, CSPBGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    325
    MATTE TIN
    LG-MIN, WD-MIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PBGA-B325
    180
    Not Qualified
    1.26V
    1.2V
    1.14V
    180
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    180
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 25K Logic Modules
    27696
    256KB
    1.01mm
    11mm
    11mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S005-1TQ144I
    -
    OBSOLETE (Last Updated: 3 weeks ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e0
    Obsolete
    3 (168 Hours)
    144
    Tin/Lead (Sn/Pb)
    -
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 5K Logic Modules
    -
    128KB
    1.6mm
    20mm
    20mm
    Non-RoHS Compliant
    2015
    no
    not_compliant
    -
    -
    -
    -
    -
    -
    -
  • M2S090S-1FGG484I
    -
    -
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 90K Logic Modules
    -
    512KB
    -
    -
    -
    RoHS Compliant
    -
    -
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S090S
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
  • M2S025T-1FGG484I
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    RoHS Compliant
    2009
    -
    -
    484-FPBGA (23x23)
    100°C
    -40°C
    166MHz
    M2S025T
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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