M2S010T-1FGG484M

Microsemi Corporation M2S010T-1FGG484M

Part Number:
M2S010T-1FGG484M
Manufacturer:
Microsemi Corporation
Ventron No:
3668693-M2S010T-1FGG484M
Description:
IC FPGA SOC 10K LUTS
ECAD Model:
Datasheet:
M2GL0xx Product Brief

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Specifications
Microsemi Corporation M2S010T-1FGG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010T-1FGG484M.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 days ago)
  • Package / Case
    484-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -55°C~125°C TJ
  • Packaging
    Tray
  • Series
    SmartFusion®2
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    3A001.A.2.C
  • Terminal Finish
    MATTE TIN
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B484
  • Number of Outputs
    233
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.26V
  • Power Supplies
    1.2V
  • Supply Voltage-Min (Vsup)
    1.14V
  • Number of I/O
    233
  • Speed
    166MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DDR, PCIe, SERDES
  • Connectivity
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
  • Architecture
    MCU, FPGA
  • Number of Inputs
    233
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 10K Logic Modules
  • Number of Logic Cells
    12084
  • Flash Size
    256KB
  • Height Seated (Max)
    2.44mm
  • Length
    23mm
  • Width
    23mm
  • RoHS Status
    RoHS Compliant
Description
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Operating Temperature range for the TJ Series of SmartFusion®2 is -55°C to 125°C, making it suitable for use in a wide range of environments. With an ECCN Code of 3A001.A.2.C, this series is designed for high-performance applications that require secure and reliable processing. The Terminal Finish of MATTE TIN ensures a durable and long-lasting connection. With 233 Outputs, this series offers a high level of flexibility and versatility. The Supply Voltage-Min (Vsup) of 1.14V allows for efficient power consumption. The Peripherals available in this series, such as DDR, PCIe, and SERDES, provide additional capabilities for complex designs. With 12084 Logic Cells and a Height Seated (Max) of 2.44mm, this series offers a powerful and compact solution. The Width of 23mm makes it suitable for a variety of applications.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation
M2S010T-1FGG484M System On Chip (SoC) applications.

POS Terminals
Industrial robot
Medical Pressure
Special Issue Information
Microcontroller based SoC ( RISC-V, ARM)
Functional safety for critical applications in the industrial sectors
Transmitters
Print Special Issue Flyer
Central alarm system
Mobile computing
M2S010T-1FGG484M More Descriptions
M2S010T-1Fgg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S010T-1FGG484M
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 484-Pin FPBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
Product Comparison
The three parts on the right have similar specifications to M2S010T-1FGG484M.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Number of I/O
    Speed
    RAM Size
    Core Processor
    Peripherals
    Connectivity
    Architecture
    Number of Inputs
    Programmable Logic Type
    Primary Attributes
    Number of Logic Cells
    Flash Size
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    Pbfree Code
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Base Part Number
    Interface
    Core Architecture
    View Compare
  • M2S010T-1FGG484M
    M2S010T-1FGG484M
    10 Weeks
    IN PRODUCTION (Last Updated: 3 days ago)
    484-BGA
    YES
    -55°C~125°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    484
    3A001.A.2.C
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B484
    233
    Not Qualified
    1.26V
    1.2V
    1.14V
    233
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    233
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    12084
    256KB
    2.44mm
    23mm
    23mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S060T-1FGG676
    10 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    676-BGA
    YES
    0°C~85°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    676
    -
    MATTE TIN
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    S-PBGA-B676
    387
    Not Qualified
    1.26V
    1.2V
    1.14V
    387
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    387
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 60K Logic Modules
    56520
    256KB
    2.44mm
    27mm
    27mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M2S010-TQG144I
    8 Weeks
    IN PRODUCTION (Last Updated: 2 days ago)
    144-LQFP
    YES
    -40°C~100°C TJ
    Tray
    SmartFusion®2
    e3
    Active
    3 (168 Hours)
    144
    -
    MATTE TIN
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    NOT SPECIFIED
    1.2V
    0.5mm
    NOT SPECIFIED
    S-PQFP-G144
    -
    -
    1.26V
    -
    1.14V
    84
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    FIELD PROGRAMMABLE GATE ARRAY
    FPGA - 10K Logic Modules
    -
    256KB
    1.6mm
    20mm
    20mm
    RoHS Compliant
    2015
    yes
    -
    -
    -
    -
    -
    -
    -
  • M2S025-1FG484
    8 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    484-BGA
    -
    0°C~85°C TJ
    Tray
    SmartFusion®2
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    267
    166MHz
    64KB
    ARM® Cortex®-M3
    DDR, PCIe, SERDES
    CANbus, Ethernet, I2C, SPI, UART/USART, USB
    MCU, FPGA
    -
    -
    FPGA - 25K Logic Modules
    -
    256KB
    -
    -
    -
    Non-RoHS Compliant
    2009
    -
    484-FPBGA (23x23)
    85°C
    0°C
    166MHz
    M2S025
    CAN, Ethernet, I2C, SPI, UART, USART, USB
    ARM
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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