Microsemi Corporation M2S010T-1FGG484M
- Part Number:
- M2S010T-1FGG484M
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668693-M2S010T-1FGG484M
- Description:
- IC FPGA SOC 10K LUTS
- Datasheet:
- M2GL0xx Product Brief
Microsemi Corporation M2S010T-1FGG484M technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010T-1FGG484M.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 days ago)
- Package / Case484-BGA
- Surface MountYES
- Operating Temperature-55°C~125°C TJ
- PackagingTray
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- ECCN Code3A001.A.2.C
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B484
- Number of Outputs233
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O233
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs233
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 10K Logic Modules
- Number of Logic Cells12084
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The Operating Temperature range for the TJ Series of SmartFusion®2 is -55°C to 125°C, making it suitable for use in a wide range of environments. With an ECCN Code of 3A001.A.2.C, this series is designed for high-performance applications that require secure and reliable processing. The Terminal Finish of MATTE TIN ensures a durable and long-lasting connection. With 233 Outputs, this series offers a high level of flexibility and versatility. The Supply Voltage-Min (Vsup) of 1.14V allows for efficient power consumption. The Peripherals available in this series, such as DDR, PCIe, and SERDES, provide additional capabilities for complex designs. With 12084 Logic Cells and a Height Seated (Max) of 2.44mm, this series offers a powerful and compact solution. The Width of 23mm makes it suitable for a variety of applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010T-1FGG484M System On Chip (SoC) applications.
POS Terminals
Industrial robot
Medical Pressure
Special Issue Information
Microcontroller based SoC ( RISC-V, ARM)
Functional safety for critical applications in the industrial sectors
Transmitters
Print Special Issue Flyer
Central alarm system
Mobile computing
The Operating Temperature range for the TJ Series of SmartFusion®2 is -55°C to 125°C, making it suitable for use in a wide range of environments. With an ECCN Code of 3A001.A.2.C, this series is designed for high-performance applications that require secure and reliable processing. The Terminal Finish of MATTE TIN ensures a durable and long-lasting connection. With 233 Outputs, this series offers a high level of flexibility and versatility. The Supply Voltage-Min (Vsup) of 1.14V allows for efficient power consumption. The Peripherals available in this series, such as DDR, PCIe, and SERDES, provide additional capabilities for complex designs. With 12084 Logic Cells and a Height Seated (Max) of 2.44mm, this series offers a powerful and compact solution. The Width of 23mm makes it suitable for a variety of applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010T-1FGG484M System On Chip (SoC) applications.
POS Terminals
Industrial robot
Medical Pressure
Special Issue Information
Microcontroller based SoC ( RISC-V, ARM)
Functional safety for critical applications in the industrial sectors
Transmitters
Print Special Issue Flyer
Central alarm system
Mobile computing
M2S010T-1FGG484M More Descriptions
M2S010T-1Fgg484M 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S010T-1FGG484M
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 484-Pin FPBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 484-Pin FPBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S010T-1FGG484M.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPublishedPbfree CodeSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S010T-1FGG484M10 WeeksIN PRODUCTION (Last Updated: 3 days ago)484-BGAYES-55°C~125°C TJTraySmartFusion®2e3Active3 (168 Hours)4843A001.A.2.CMATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B484233Not Qualified1.26V1.2V1.14V233166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA233FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules12084256KB2.44mm23mm23mmRoHS Compliant----------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)676-BGAYES0°C~85°C TJTraySmartFusion®2e3Active3 (168 Hours)676-MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIEDS-PBGA-B676387Not Qualified1.26V1.2V1.14V387166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA387FIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules56520256KB2.44mm27mm27mmRoHS Compliant---------
-
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFPYES-40°C~100°C TJTraySmartFusion®2e3Active3 (168 Hours)144-MATTE TIN8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIEDS-PQFP-G144--1.26V-1.14V84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA-FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules-256KB1.6mm20mm20mmRoHS Compliant2015yes-------
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8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA-0°C~85°C TJTraySmartFusion®2-Active3 (168 Hours)------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 25K Logic Modules-256KB---Non-RoHS Compliant2009-484-FPBGA (23x23)85°C0°C166MHzM2S025CAN, Ethernet, I2C, SPI, UART, USART, USBARM
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