Microsemi Corporation M2S010-FGG484I
- Part Number:
- M2S010-FGG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3162331-M2S010-FGG484I
- Description:
- IC FPGA SOC 10K LUT 484FBGA
- Datasheet:
- SmartFusion2 Pin Descriptions
Microsemi Corporation M2S010-FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010-FGG484I.
- Factory Lead Time8 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case484-BGA
- Surface MountYES
- Number of Pins484
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2014
- SeriesSmartFusion®2
- JESD-609 Codee3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- Terminal FinishMATTE TIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Number of Outputs233
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Supply Voltage-Max (Vsup)1.26V
- Memory Size256kB
- Number of I/O233
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- Data Rate667 Mbps
- ArchitectureMCU, FPGA
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells12084
- Max Frequency400MHz
- Number of Logic Blocks (LABs)1007
- Primary AttributesFPGA - 10K Logic Modules
- Flash Size256KB
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.Assigned with the package 484-BGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.In addition, this SoC security combines FPGA - 10K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part has a total of 233 I/Os.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.There are 484 terminations in total and that really benefits system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 233 outputs.There is a flash of 256KB.The computer SoC has a pin count of 484.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010-FGG484I System On Chip (SoC) applications.
Automotive gateway
Functional safety for critical applications in the industrial sectors
Microcontroller
sequence controllers
DC-input BLDC motor drive
ARM processors
Robotics
Body control module
Communication interfaces ( I2C, SPI )
Apple smart watch
There are ARM? Cortex?-M3 core processors in this SoC.Assigned with the package 484-BGA, this system on a chip comes from the manufacturer.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ when it is operating normally.In addition, this SoC security combines FPGA - 10K Logic Modules.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.This SoC part has a total of 233 I/Os.A 1.2V power supply is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.There are 484 terminations in total and that really benefits system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 233 outputs.There is a flash of 256KB.The computer SoC has a pin count of 484.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010-FGG484I System On Chip (SoC) applications.
Automotive gateway
Functional safety for critical applications in the industrial sectors
Microcontroller
sequence controllers
DC-input BLDC motor drive
ARM processors
Robotics
Body control module
Communication interfaces ( I2C, SPI )
Apple smart watch
M2S010-FGG484I More Descriptions
FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 484-Pin FPBGA Tray
M2S010-Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S010-FGG484I
Field Programmable Gate Array, 12084-Cell, CMOS, PBGA484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
FPGA - Field Programmable Gate Array SmartFusion2
IC SOC CORTEX-M3 166MHZ 484FBGA
M2S010-Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S010-FGG484I
Field Programmable Gate Array, 12084-Cell, CMOS, PBGA484
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
FPGA - Field Programmable Gate Array SmartFusion2
IC SOC CORTEX-M3 166MHZ 484FBGA
The three parts on the right have similar specifications to M2S010-FGG484I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Number of OutputsQualification StatusOperating Supply VoltageSupply Voltage-Max (Vsup)Memory SizeNumber of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityData RateArchitectureProgrammable Logic TypeNumber of Logic Elements/CellsMax FrequencyNumber of Logic Blocks (LABs)Primary AttributesFlash SizeHeight Seated (Max)LengthWidthRoHS StatusPbfree CodeJESD-30 CodeSupply Voltage-Min (Vsup)Supplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
-
M2S010-FGG484I8 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGAYES484-40°C~100°C TJTray2014SmartFusion®2e3Active3 (168 Hours)484MATTE TIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmNOT SPECIFIED233Not Qualified1.2V1.26V256kB233166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USB667 MbpsMCU, FPGAFIELD PROGRAMMABLE GATE ARRAY12084400MHz1007FPGA - 10K Logic Modules256KB2.44mm23mm23mmRoHS Compliant-----------
-
8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFPYES--40°C~100°C TJTray2015SmartFusion®2e3Active3 (168 Hours)144MATTE TIN8542.39.00.01--QUADGULL WINGNOT SPECIFIED1.2V0.5mmNOT SPECIFIED---1.26V-84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USB-MCU, FPGAFIELD PROGRAMMABLE GATE ARRAY---FPGA - 10K Logic Modules256KB1.6mm20mm20mmRoHS CompliantyesS-PQFP-G1441.14V-------
-
--484-BGA---40°C~100°C TJTray-SmartFusion®2-Obsolete3 (168 Hours)----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USB-MCU, FPGA----FPGA - 90K Logic Modules512KB---RoHS Compliant---484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA---40°C~100°C TJTray2009SmartFusion®2-Active3 (168 Hours)----------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USB-MCU, FPGA----FPGA - 25K Logic Modules256KB---RoHS Compliant---484-FPBGA (23x23)100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
27 September 2023
BC640 PNP Transistor: Features, Package and Other Details
Ⅰ. Overview of BC640Ⅱ. Symbol and footprint of BC640Ⅲ. Technical parametersⅣ. Features of BC640Ⅴ. Pinout and package of BC640Ⅵ. Application of BC640Ⅶ. How to optimize the performance of... -
27 September 2023
Introduction to the BTS7960B Motor Drive Module
Ⅰ. What is BTS7960B?Ⅱ. BTS7960B symbol, footprint and pin configurationⅢ. Technical parametersⅣ. Features of BTS7960BⅤ. What are the advantages and disadvantages of BTS7960B?Ⅵ. How to optimize the BTS7960B... -
28 September 2023
MPSA56 PNP General Purpose Transistor: Features, Working Principle and Application
Ⅰ. Overview of MPSA56Ⅱ. Symbol and footprint of MPSA56Ⅲ. Technical parametersⅣ. Features of MPSA56Ⅴ. Pinout and package of MPSA56Ⅵ. How does MPSA56 work?Ⅶ. How does the MPSA56 transistor... -
28 September 2023
TIP35C Footprint, Package, Application and Other Details
Ⅰ. Overview of TIP35CⅡ. Symbol and footprint of TIP35CⅢ. Technical parametersⅣ. Features of TIP35CⅤ. Pinout and package of TIP35CⅥ. Working principle of TIP35C audio power amplifierⅦ. Application of...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.