Microsemi Corporation M2S010-1VF256I
- Part Number:
- M2S010-1VF256I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3668566-M2S010-1VF256I
- Description:
- IC FPGA SOC 10K LUTS
- Datasheet:
- SmartFusion2 Datasheet
Microsemi Corporation M2S010-1VF256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S010-1VF256I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case256-LFBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- JESD-609 Codee0
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTin/Lead (Sn/Pb)
- Additional FeatureLG-MIN, WD-MIN
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage1.2V
- Terminal Pitch0.8mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)NOT SPECIFIED
- JESD-30 CodeS-PBGA-B256
- Number of Outputs138
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.26V
- Power Supplies1.2V
- Supply Voltage-Min (Vsup)1.14V
- Number of I/O138
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR, PCIe, SERDES
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Number of Inputs138
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Primary AttributesFPGA - 10K Logic Modules
- Number of Logic Cells12084
- Flash Size256KB
- Height Seated (Max)1.56mm
- Length14mm
- Width14mm
- RoHS StatusNon-RoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
The product being offered is a tray-packaged electronic component, first published in 2015. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to high levels of moisture for up to 168 hours without any damage. The terminal finish is Tin/Lead (Sn/Pb), and the technology used is CMOS. The supply voltage required for this product is 1.2V. It is classified under the JESD-30 Code S-PBGA-B256, indicating its package type. This component offers a wide range of connectivity options, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. It is a versatile product, suitable for use in both microcontroller (MCU) and field-programmable gate array (FPGA) architectures. With a total of 138 inputs, this product offers a high level of functionality for various electronic applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-1VF256I System On Chip (SoC) applications.
DC-input BLDC motor drive
USB hard disk enclosure
Industrial sectors
Keyboard
Industrial Pressure
sequence controllers
Flow Sensors
Medical
ARM processors
ARM support modules
The product being offered is a tray-packaged electronic component, first published in 2015. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to high levels of moisture for up to 168 hours without any damage. The terminal finish is Tin/Lead (Sn/Pb), and the technology used is CMOS. The supply voltage required for this product is 1.2V. It is classified under the JESD-30 Code S-PBGA-B256, indicating its package type. This component offers a wide range of connectivity options, including CANbus, Ethernet, I2C, SPI, UART/USART, and USB. It is a versatile product, suitable for use in both microcontroller (MCU) and field-programmable gate array (FPGA) architectures. With a total of 138 inputs, this product offers a high level of functionality for various electronic applications.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S010-1VF256I System On Chip (SoC) applications.
DC-input BLDC motor drive
USB hard disk enclosure
Industrial sectors
Keyboard
Industrial Pressure
sequence controllers
Flow Sensors
Medical
ARM processors
ARM support modules
M2S010-1VF256I More Descriptions
M2S010-1Vf256I 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2S010-1VF256I
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs
IC SOC CORTEX-M3 166MHZ 256FBGA
The three parts on the right have similar specifications to M2S010-1VF256I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishAdditional FeatureHTS CodeSubcategoryTechnologyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitectureNumber of InputsProgrammable Logic TypePrimary AttributesNumber of Logic CellsFlash SizeHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S010-1VF256I10 WeeksIN PRODUCTION (Last Updated: 1 month ago)256-LFBGAYES-40°C~100°C TJTray2015SmartFusion®2e0Active3 (168 Hours)256Tin/Lead (Sn/Pb)LG-MIN, WD-MIN8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V0.8mmnot_compliantNOT SPECIFIEDS-PBGA-B256138Not Qualified1.26V1.2V1.14V138166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA138FIELD PROGRAMMABLE GATE ARRAYFPGA - 10K Logic Modules12084256KB1.56mm14mm14mmNon-RoHS Compliant--------
-
4 WeeksIN PRODUCTION (Last Updated: 2 weeks ago)896-BGAYES0°C~85°C TJTray2015SmartFusion®2e0Active3 (168 Hours)896Tin/Lead (Sn/Pb)-8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mmnot_compliantNOT SPECIFIEDS-PBGA-B896377Not Qualified1.26V1.2V1.14V377166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA377FIELD PROGRAMMABLE GATE ARRAYFPGA - 50K Logic Modules56340256KB2.44mm31mm31mmNon-RoHS Compliant-------
-
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)676-BGAYES0°C~85°C TJTray-SmartFusion®2e3Active3 (168 Hours)676MATTE TIN-8542.39.00.01Field Programmable Gate ArraysCMOSBOTTOMBALLNOT SPECIFIED1.2V1mm-NOT SPECIFIEDS-PBGA-B676387Not Qualified1.26V1.2V1.14V387166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA387FIELD PROGRAMMABLE GATE ARRAYFPGA - 60K Logic Modules56520256KB2.44mm27mm27mmRoHS Compliant-------
-
--484-BGA--40°C~100°C TJTray-SmartFusion®2-Obsolete3 (168 Hours)-------------------267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGA--FPGA - 90K Logic Modules-512KB---RoHS Compliant484-FPBGA (23x23)100°C-40°C166MHzM2S090SCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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