Microsemi Corporation M2S005S-1VFG400
- Part Number:
- M2S005S-1VFG400
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3162363-M2S005S-1VFG400
- Description:
- IC FPGA SOC 5K LUTS
- Datasheet:
- SmartFusion2 Datasheet
Microsemi Corporation M2S005S-1VFG400 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2S005S-1VFG400.
- Factory Lead Time12 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Package / Case400-LFBGA
- Supplier Device Package400-VFBGA (17x17)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2015
- SeriesSmartFusion®2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of I/O171
- Speed166MHz
- RAM Size64KB
- Core ProcessorARM® Cortex®-M3
- PeripheralsDDR
- ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
- ArchitectureMCU, FPGA
- Primary AttributesFPGA - 5K Logic Modules
- Flash Size128KB
- RoHS StatusRoHS Compliant
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 400-LFBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.One important thing to mark down is that this SoC meaning combines FPGA - 5K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 171 I/Os in total.This flash has a size of 128KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
There are a lot of Microsemi Corporation
M2S005S-1VFG400 System On Chip (SoC) applications.
Networked sensors
Functional safety for critical applications in the automotive
Video Imaging
External USB hard disk/SSD
Remote control
Industrial automation devices
Robotics
ARM
Central inverter
Fitness
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 400-LFBGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.One important thing to mark down is that this SoC meaning combines FPGA - 5K Logic Modules.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 171 I/Os in total.This flash has a size of 128KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
128KB extended flash.
There are a lot of Microsemi Corporation
M2S005S-1VFG400 System On Chip (SoC) applications.
Networked sensors
Functional safety for critical applications in the automotive
Video Imaging
External USB hard disk/SSD
Remote control
Industrial automation devices
Robotics
ARM
Central inverter
Fitness
M2S005S-1VFG400 More Descriptions
M2S005S-1Vfg400 400 Lfbga 17X17X1.51Mm Tray Rohs Compliant: Yes |Microchip M2S005S-1VFG400
Field Programmable Gate Array, 6060-Cell, PBGA400
SmartFusion2 SoC FPGA, ARM Cortex-M3, 6KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
Field Programmable Gate Array, 6060-Cell, PBGA400
SmartFusion2 SoC FPGA, ARM Cortex-M3, 6KLEs
IC SOC CORTEX-M3 166MHZ 400VFBGA
The three parts on the right have similar specifications to M2S005S-1VFG400.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusPackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of I/OSpeedRAM SizeCore ProcessorPeripheralsConnectivityArchitecturePrimary AttributesFlash SizeRoHS StatusSurface MountJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishHTS CodeTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Programmable Logic TypeHeight Seated (Max)LengthWidthMax Operating TemperatureMin Operating TemperatureFrequencyBase Part NumberInterfaceCore ArchitectureView Compare
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M2S005S-1VFG40012 WeeksIN PRODUCTION (Last Updated: 1 month ago)400-LFBGA400-VFBGA (17x17)0°C~85°C TJTray2015SmartFusion®2Active3 (168 Hours)171166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFPGA - 5K Logic Modules128KBRoHS Compliant---------------------------
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-OBSOLETE (Last Updated: 3 weeks ago)144-LQFP--40°C~100°C TJTray2015SmartFusion®2Obsolete3 (168 Hours)84166MHz64KBARM® Cortex®-M3DDRCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFPGA - 5K Logic Modules128KBNon-RoHS CompliantYESe0no144Tin/Lead (Sn/Pb)8542.39.00.01QUADGULL WINGNOT SPECIFIED1.2V0.5mmnot_compliantNOT SPECIFIEDS-PQFP-G1441.26V1.14VFIELD PROGRAMMABLE GATE ARRAY1.6mm20mm20mm------
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8 WeeksIN PRODUCTION (Last Updated: 2 days ago)144-LQFP--40°C~100°C TJTray2015SmartFusion®2Active3 (168 Hours)84166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFPGA - 10K Logic Modules256KBRoHS CompliantYESe3yes144MATTE TIN8542.39.00.01QUADGULL WINGNOT SPECIFIED1.2V0.5mm-NOT SPECIFIEDS-PQFP-G1441.26V1.14VFIELD PROGRAMMABLE GATE ARRAY1.6mm20mm20mm------
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10 WeeksIN PRODUCTION (Last Updated: 1 month ago)484-BGA484-FPBGA (23x23)-40°C~100°C TJTray2009SmartFusion®2Active3 (168 Hours)267166MHz64KBARM® Cortex®-M3DDR, PCIe, SERDESCANbus, Ethernet, I2C, SPI, UART/USART, USBMCU, FPGAFPGA - 25K Logic Modules256KBRoHS Compliant--------------------100°C-40°C166MHzM2S025TCAN, Ethernet, I2C, SPI, UART, USART, USBARM
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