M2GL060TS-FG676I

Microsemi Corporation M2GL060TS-FG676I

Part Number:
M2GL060TS-FG676I
Manufacturer:
Microsemi Corporation
Ventron No:
3129373-M2GL060TS-FG676I
Description:
IC FPGA 387 I/O 676FBGA
ECAD Model:
Datasheet:
M2GL060TS-FG676I

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Specifications
Microsemi Corporation M2GL060TS-FG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2GL060TS-FG676I.
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    676-BGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    IGLOO2
  • Published
    2015
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    676
  • HTS Code
    8542.39.00.01
  • Voltage - Supply
    1.14V~2.625V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    240
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    20
  • JESD-30 Code
    S-PBGA-B676
  • Number of I/O
    387
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    56520
  • Total RAM Bits
    1869824
  • Length
    27mm
  • Height Seated (Max)
    2.44mm
  • Width
    27mm
  • RoHS Status
    Non-RoHS Compliant
Description
M2GL060TS-FG676I Overview
The package that contains this software is called 676-BGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 387 I/Os for better data transfer. In order to construct a fundamental building block, 56520 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~2.625V battery. There are many types of FPGAs in the IGLOO2 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 676 terminations. As far as the RAM bits are concerned, this device offers you a total of 1869824.

M2GL060TS-FG676I Features
387 I/Os
Up to 1869824 RAM bits


M2GL060TS-FG676I Applications
There are a lot of Microsemi Corporation
M2GL060TS-FG676I FPGAs applications.


Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
M2GL060TS-FG676I More Descriptions
M2Gl060Ts-Fg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2GL060TS-FG676I
Field Programmable Gate Array, PBGA676
IGLOO2 Low Density FPGA, 56.5KLEs
Product Comparison
The three parts on the right have similar specifications to M2GL060TS-FG676I.
  • Image
    Part Number
    Manufacturer
    Lifecycle Status
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of I/O
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Subcategory
    Technology
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of Inputs
    Reflow Temperature-Max (s)
    View Compare
  • M2GL060TS-FG676I
    M2GL060TS-FG676I
    IN PRODUCTION (Last Updated: 1 month ago)
    12 Weeks
    Surface Mount
    676-BGA
    YES
    -40°C~100°C TJ
    Tray
    IGLOO2
    2015
    Active
    3 (168 Hours)
    676
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    240
    1.2V
    1mm
    20
    S-PBGA-B676
    387
    FIELD PROGRAMMABLE GATE ARRAY
    56520
    1869824
    27mm
    2.44mm
    27mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
  • M2GL005S-VFG400
    IN PRODUCTION (Last Updated: 1 month ago)
    10 Weeks
    Surface Mount
    400-LFBGA
    YES
    0°C~85°C TJ
    Tray
    IGLOO2
    2015
    Active
    3 (168 Hours)
    400
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    0.8mm
    30
    S-PBGA-B400
    169
    FIELD PROGRAMMABLE GATE ARRAY
    6060
    719872
    17mm
    1.51mm
    17mm
    RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    171
    Not Qualified
    1.2V
    171
    -
  • M2GL050TS-FG484
    IN PRODUCTION (Last Updated: 1 month ago)
    12 Weeks
    Surface Mount
    484-BGA
    YES
    0°C~85°C TJ
    Tray
    IGLOO2
    2015
    Active
    3 (168 Hours)
    484
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    240
    1.2V
    1mm
    20
    S-PBGA-B484
    267
    FIELD PROGRAMMABLE GATE ARRAY
    56340
    1869824
    23mm
    2.44mm
    23mm
    Non-RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    267
    Not Qualified
    1.2V
    267
    -
  • M2GL025T-1FCSG325I
    IN PRODUCTION (Last Updated: 1 month ago)
    12 Weeks
    Surface Mount
    324-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    IGLOO2
    2015
    Active
    3 (168 Hours)
    325
    8542.39.00.01
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    -
    -
    S-PBGA-B325
    180
    FIELD PROGRAMMABLE GATE ARRAY
    27696
    1130496
    -
    -
    -
    RoHS Compliant
    Field Programmable Gate Arrays
    CMOS
    180
    Not Qualified
    1.2V
    180
    30
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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