Microsemi Corporation M2GL060TS-FG676I
- Part Number:
- M2GL060TS-FG676I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3129373-M2GL060TS-FG676I
- Description:
- IC FPGA 387 I/O 676FBGA
- Datasheet:
- M2GL060TS-FG676I
Microsemi Corporation M2GL060TS-FG676I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2GL060TS-FG676I.
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Factory Lead Time12 Weeks
- Mounting TypeSurface Mount
- Package / Case676-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- SeriesIGLOO2
- Published2015
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations676
- HTS Code8542.39.00.01
- Voltage - Supply1.14V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)240
- Supply Voltage1.2V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)20
- JESD-30 CodeS-PBGA-B676
- Number of I/O387
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells56520
- Total RAM Bits1869824
- Length27mm
- Height Seated (Max)2.44mm
- Width27mm
- RoHS StatusNon-RoHS Compliant
M2GL060TS-FG676I Overview
The package that contains this software is called 676-BGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 387 I/Os for better data transfer. In order to construct a fundamental building block, 56520 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~2.625V battery. There are many types of FPGAs in the IGLOO2 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 676 terminations. As far as the RAM bits are concerned, this device offers you a total of 1869824.
M2GL060TS-FG676I Features
387 I/Os
Up to 1869824 RAM bits
M2GL060TS-FG676I Applications
There are a lot of Microsemi Corporation
M2GL060TS-FG676I FPGAs applications.
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
The package that contains this software is called 676-BGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. There are 387 I/Os for better data transfer. In order to construct a fundamental building block, 56520 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~2.625V battery. There are many types of FPGAs in the IGLOO2 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 676 terminations. As far as the RAM bits are concerned, this device offers you a total of 1869824.
M2GL060TS-FG676I Features
387 I/Os
Up to 1869824 RAM bits
M2GL060TS-FG676I Applications
There are a lot of Microsemi Corporation
M2GL060TS-FG676I FPGAs applications.
Random logic
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
M2GL060TS-FG676I More Descriptions
M2Gl060Ts-Fg676I 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2GL060TS-FG676I
Field Programmable Gate Array, PBGA676
IGLOO2 Low Density FPGA, 56.5KLEs
Field Programmable Gate Array, PBGA676
IGLOO2 Low Density FPGA, 56.5KLEs
The three parts on the right have similar specifications to M2GL060TS-FG676I.
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ImagePart NumberManufacturerLifecycle StatusFactory Lead TimeMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeNumber of I/OProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsLengthHeight Seated (Max)WidthRoHS StatusSubcategoryTechnologyNumber of OutputsQualification StatusPower SuppliesNumber of InputsReflow Temperature-Max (s)View Compare
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M2GL060TS-FG676IIN PRODUCTION (Last Updated: 1 month ago)12 WeeksSurface Mount676-BGAYES-40°C~100°C TJTrayIGLOO22015Active3 (168 Hours)6768542.39.00.011.14V~2.625VBOTTOMBALL2401.2V1mm20S-PBGA-B676387FIELD PROGRAMMABLE GATE ARRAY56520186982427mm2.44mm27mmNon-RoHS Compliant--------
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IN PRODUCTION (Last Updated: 1 month ago)10 WeeksSurface Mount400-LFBGAYES0°C~85°C TJTrayIGLOO22015Active3 (168 Hours)4008542.39.00.011.14V~2.625VBOTTOMBALL2601.2V0.8mm30S-PBGA-B400169FIELD PROGRAMMABLE GATE ARRAY606071987217mm1.51mm17mmRoHS CompliantField Programmable Gate ArraysCMOS171Not Qualified1.2V171-
-
IN PRODUCTION (Last Updated: 1 month ago)12 WeeksSurface Mount484-BGAYES0°C~85°C TJTrayIGLOO22015Active3 (168 Hours)4848542.39.00.011.14V~2.625VBOTTOMBALL2401.2V1mm20S-PBGA-B484267FIELD PROGRAMMABLE GATE ARRAY56340186982423mm2.44mm23mmNon-RoHS CompliantField Programmable Gate ArraysCMOS267Not Qualified1.2V267-
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IN PRODUCTION (Last Updated: 1 month ago)12 WeeksSurface Mount324-LFBGA, CSPBGAYES-40°C~100°C TJTrayIGLOO22015Active3 (168 Hours)3258542.39.00.011.14V~2.625VBOTTOMBALL2601.2V--S-PBGA-B325180FIELD PROGRAMMABLE GATE ARRAY276961130496---RoHS CompliantField Programmable Gate ArraysCMOS180Not Qualified1.2V18030
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