Microsemi Corporation M2GL060TS-1FGG484I
- Part Number:
- M2GL060TS-1FGG484I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3127832-M2GL060TS-1FGG484I
- Description:
- IC FPGA 267 I/O 484FBGA
- ECAD Model:
-
- Datasheet:
- M2GL060TS-1FGG484I
Microsemi Corporation M2GL060TS-1FGG484I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2GL060TS-1FGG484I.
- Factory Lead Time12 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Mounting TypeSurface Mount
- Package / Case484-BGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesIGLOO2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- HTS Code8542.39.00.01
- Voltage - Supply1.14V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- JESD-30 CodeS-PBGA-B484
- Number of I/O267
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells56520
- Total RAM Bits1869824
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
M2GL060TS-1FGG484I Overview
The IGLOO2 series, published in 2015, offers a wide range of advanced packaging options for its components. One such option is the 484-BGA package, which boasts a high number of terminations at 484, providing a robust and reliable connection for the integrated circuits within. This package is also designed to withstand high levels of moisture, with a Moisture Sensitivity Level (MSL) of 3, lasting up to 168 hours. In addition, the packaging for this series comes in a tray format, making it easy to handle and transport. The HTS code for this package is 8542.39.00.01, while the JESD-30 code is S-PBGA-B484, indicating its classification as a small plastic ball grid array. With a width of 23mm and 267 I/Os, this package is a compact and efficient choice for electronic components.
M2GL060TS-1FGG484I Features
267 I/Os
Up to 1869824 RAM bits
M2GL060TS-1FGG484I Applications
There are a lot of Microsemi Corporation M2GL060TS-1FGG484I FPGAs applications.
Consumer Electronics
Solar Energy
Integrating multiple SPLDs
Data Mining
Computer hardware emulation
Military Temperature
Space Applications
DO-254
Video & Image Processing
Medical Applications
The IGLOO2 series, published in 2015, offers a wide range of advanced packaging options for its components. One such option is the 484-BGA package, which boasts a high number of terminations at 484, providing a robust and reliable connection for the integrated circuits within. This package is also designed to withstand high levels of moisture, with a Moisture Sensitivity Level (MSL) of 3, lasting up to 168 hours. In addition, the packaging for this series comes in a tray format, making it easy to handle and transport. The HTS code for this package is 8542.39.00.01, while the JESD-30 code is S-PBGA-B484, indicating its classification as a small plastic ball grid array. With a width of 23mm and 267 I/Os, this package is a compact and efficient choice for electronic components.
M2GL060TS-1FGG484I Features
267 I/Os
Up to 1869824 RAM bits
M2GL060TS-1FGG484I Applications
There are a lot of Microsemi Corporation M2GL060TS-1FGG484I FPGAs applications.
Consumer Electronics
Solar Energy
Integrating multiple SPLDs
Data Mining
Computer hardware emulation
Military Temperature
Space Applications
DO-254
Video & Image Processing
Medical Applications
M2GL060TS-1FGG484I More Descriptions
FPGA IGLOO2 56520 Cells 400MHz 65nm Technology 1.2V 484-Pin FBGA
M2Gl060Ts-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2GL060TS-1FGG484I
IGLOO2 Low Density FPGA, 56.5KLEs
M2Gl060Ts-1Fgg484I 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2GL060TS-1FGG484I
IGLOO2 Low Density FPGA, 56.5KLEs
The three parts on the right have similar specifications to M2GL060TS-1FGG484I.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)JESD-30 CodeNumber of I/OProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsHeight Seated (Max)LengthWidthRoHS StatusSubcategoryBase Part NumberNumber of OutputsQualification StatusPower SuppliesRAM SizeNumber of InputsNumber of PinsTime@Peak Reflow Temperature-Max (s)Memory SizeData RateMax FrequencyNumber of Logic Blocks (LABs)View Compare
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M2GL060TS-1FGG484I12 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount484-BGAYES-40°C~100°C TJTray2015IGLOO2Active3 (168 Hours)4848542.39.00.011.14V~2.625VBOTTOMBALL2601.2V1mm30S-PBGA-B484267FIELD PROGRAMMABLE GATE ARRAY5652018698242.44mm23mm23mmRoHS Compliant-------------- -
12 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)Surface Mount1152-BBGA, FCBGAYES0°C~85°C TJTray2013IGLOO2Active3 (168 Hours)-8542.39.00.011.14V~2.625VBOTTOMBALL2601.2V1mm30S-PBGA-B1152574FIELD PROGRAMMABLE GATE ARRAY14612451200002.9mm35mm35mmRoHS CompliantField Programmable Gate ArraysM2GL150574Not Qualified1.2V625kB574------
-
12 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount676-BGAYES-40°C~100°C TJTray2015IGLOO2Active3 (168 Hours)6768542.39.00.011.14V~2.625VBOTTOMBALL2601.2V1mm30S-PBGA-B676387FIELD PROGRAMMABLE GATE ARRAY5652018698242.44mm27mm27mmRoHS Compliant-------------
-
11 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)Surface Mount484-BGAYES0°C~85°C TJTray2013IGLOO2Active3 (168 Hours)4848542.39.00.011.14V~2.625VBOTTOMBALL2401.2V1mm--209FIELD PROGRAMMABLE GATE ARRAY60607198722.44mm23mm23mmNon-RoHS CompliantField Programmable Gate ArraysM2GL005209Not Qualified1.2V87.9kB-48420128kB667 Mbps400MHz11
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