Microsemi Corporation M2GL025-1FGG484
- Part Number:
- M2GL025-1FGG484
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3126514-M2GL025-1FGG484
- Description:
- IC FPGA 267 I/O 484FBGA
- ECAD Model:
-
- Datasheet:
- IGLOO2 FPGAs Product Brief
Microsemi Corporation M2GL025-1FGG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2GL025-1FGG484.
- Factory Lead Time9 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- Mounting TypeSurface Mount
- Package / Case484-BGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2013
- SeriesIGLOO2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations484
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- Voltage - Supply1.14V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)30
- Base Part NumberM2GL025
- JESD-30 CodeS-PBGA-B484
- Number of Outputs267
- Qualification StatusNot Qualified
- Power Supplies1.2V
- Number of I/O267
- RAM Size138kB
- Number of Inputs267
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells27696
- Total RAM Bits1130496
- Height Seated (Max)2.44mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
M2GL025-1FGG484 Overview
The packaging for this particular product is a tray, which is designed to hold and protect the delicate components inside. The peak reflow temperature, measured in degrees Celsius, is set at 260 to ensure the components are properly soldered onto the board. The terminal pitch, which refers to the distance between the center of one terminal to the center of the adjacent terminal, is 1mm. This product is classified under JESD-30 Code S-PBGA-B484, indicating its specific type of ball grid array package. It boasts an impressive 267 outputs and requires a single 1.2V power supply. With a RAM size of 138kB and 267 inputs, this product is equipped with 27696 logic elements or cells. Its width measures at 23mm, making it compact and efficient for its purpose.
M2GL025-1FGG484 Features
267 I/Os
Up to 1130496 RAM bits
M2GL025-1FGG484 Applications
There are a lot of Microsemi Corporation M2GL025-1FGG484 FPGAs applications.
Automotive driver's assistance
ASIC prototyping
OpenCL
Military DSP
Development Boards and Shields for Microcontrollers
Random logic
Medical ultrasounds
Data Center
Data center hardware accelerators
Bioinformatics
The packaging for this particular product is a tray, which is designed to hold and protect the delicate components inside. The peak reflow temperature, measured in degrees Celsius, is set at 260 to ensure the components are properly soldered onto the board. The terminal pitch, which refers to the distance between the center of one terminal to the center of the adjacent terminal, is 1mm. This product is classified under JESD-30 Code S-PBGA-B484, indicating its specific type of ball grid array package. It boasts an impressive 267 outputs and requires a single 1.2V power supply. With a RAM size of 138kB and 267 inputs, this product is equipped with 27696 logic elements or cells. Its width measures at 23mm, making it compact and efficient for its purpose.
M2GL025-1FGG484 Features
267 I/Os
Up to 1130496 RAM bits
M2GL025-1FGG484 Applications
There are a lot of Microsemi Corporation M2GL025-1FGG484 FPGAs applications.
Automotive driver's assistance
ASIC prototyping
OpenCL
Military DSP
Development Boards and Shields for Microcontrollers
Random logic
Medical ultrasounds
Data Center
Data center hardware accelerators
Bioinformatics
M2GL025-1FGG484 More Descriptions
M2Gl025-1Fgg484 484 Pbga 23X23X2.44Mm Tray Rohs Compliant: Yes |Microchip M2GL025-1FGG484
M2GL Series 1104kb RAM 267 I/O IGLOO2 & SmartFusion2 SoC FPGA - FPBGA-484
IGLOO2 Low Density FPGA, 27.6KLEs
IGLOO2 FPGA, GPIO, 5G SERDES, PCI EXPRESS
M2GL Series 1104kb RAM 267 I/O IGLOO2 & SmartFusion2 SoC FPGA - FPBGA-484
IGLOO2 Low Density FPGA, 27.6KLEs
IGLOO2 FPGA, GPIO, 5G SERDES, PCI EXPRESS
The three parts on the right have similar specifications to M2GL025-1FGG484.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeSubcategoryVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of OutputsQualification StatusPower SuppliesNumber of I/ORAM SizeNumber of InputsProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsHeight Seated (Max)LengthWidthRoHS StatusTechnologyTime@Peak Reflow Temperature-Max (s)View Compare
-
M2GL025-1FGG4849 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)Surface Mount484-BGAYES0°C~85°C TJTray2013IGLOO2Active3 (168 Hours)4848542.39.00.01Field Programmable Gate Arrays1.14V~2.625VBOTTOMBALL2601.2V1mm30M2GL025S-PBGA-B484267Not Qualified1.2V267138kB267FIELD PROGRAMMABLE GATE ARRAY2769611304962.44mm23mm23mmRoHS Compliant--- -
12 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)Surface Mount1152-BBGA, FCBGAYES0°C~85°C TJTray2013IGLOO2Active3 (168 Hours)-8542.39.00.01Field Programmable Gate Arrays1.14V~2.625VBOTTOMBALL2601.2V1mm30M2GL150S-PBGA-B1152574Not Qualified1.2V574625kB574FIELD PROGRAMMABLE GATE ARRAY14612451200002.9mm35mm35mmRoHS Compliant--
-
12 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount676-BGAYES-40°C~100°C TJTray2015IGLOO2Active3 (168 Hours)6768542.39.00.01-1.14V~2.625VBOTTOMBALL2601.2V1mm30-S-PBGA-B676---387--FIELD PROGRAMMABLE GATE ARRAY5652018698242.44mm27mm27mmRoHS Compliant--
-
12 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount484-BGAYES0°C~85°C TJTray2015IGLOO2Active3 (168 Hours)4848542.39.00.01Field Programmable Gate Arrays1.14V~2.625VBOTTOMBALL2401.2V1mm--S-PBGA-B484267Not Qualified1.2V267-267FIELD PROGRAMMABLE GATE ARRAY5634018698242.44mm23mm23mmNon-RoHS CompliantCMOS20
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
22 February 2024
L293D Motor Driver Characteristics, Technical Parameters, Advantages and Working Principle
Ⅰ. L293D descriptionⅡ. Characteristics of L293DⅢ. Technical parameters of L293DⅣ. Advantages of L293DⅤ. L293D motor driving principleⅥ. Circuit diagram of L293DⅦ. Applications of L293DⅧ. Wiring method of L293D... -
22 February 2024
L7805CV Specifications, Applications and Design Considerations
Ⅰ. Introduction to L7805CVⅡ. Specifications of L7805CVⅢ. L7805CV symbol, footprint and pin configurationⅣ. Applications of L7805CVⅤ. Precautions for using L7805CVⅥ. Absolute maximum ratings of L7805CVⅦ. Design considerations for... -
23 February 2024
ADM2483BRWZ Alternatives, Symbol, Advantages and Disadvantages and Package
Ⅰ. Overview of ADM2483BRWZⅡ. Technical parameters of ADM2483BRWZⅢ. ADM2483BRWZ symbol, footprint and pin configurationⅣ. Circuit description of ADM2483BRWZⅤ. What are the advantages and disadvantages of ADM2483BRWZ?Ⅵ. Dimensions and... -
23 February 2024
LM386 Audio Amplifier IC Structure, Working Principle, Manufacturer, Function and Applications
Ⅰ. Overview of LM386Ⅱ. Internal structure and working principle of LM386Ⅲ. Pins and functions of LM386Ⅳ. Manufacturer of LM386Ⅴ. What is the function of LM386?Ⅵ. How to use...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.