Microsemi Corporation M2GL025-1FCSG325I
- Part Number:
- M2GL025-1FCSG325I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3821612-M2GL025-1FCSG325I
- Description:
- IC FPGA 180 I/O 325FCBGA
- ECAD Model:
-
- Datasheet:
- M2GL025-1FCSG325I
Microsemi Corporation M2GL025-1FCSG325I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2GL025-1FCSG325I.
- Factory Lead Time9 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Mounting TypeSurface Mount
- Package / Case324-LFBGA, CSPBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2015
- SeriesIGLOO2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations325
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Reflow Temperature-Max (s)30
- JESD-30 CodeS-PBGA-B325
- Number of Outputs180
- Qualification StatusNot Qualified
- Power Supplies1.2V
- Number of I/O180
- Number of Inputs180
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells27696
- Total RAM Bits1130496
- RoHS StatusRoHS Compliant
M2GL025-1FCSG325I Overview
This particular component is manufactured by Microsemi Corporation and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is currently in production, with the most recent update being made 1 month ago. The operating temperature range for this chip is -40°C to 100°C TJ. It utilizes CMOS technology and has a bottom terminal position with a ball terminal form. The peak reflow temperature for this chip is 260 degrees Celsius and it is classified under JESD-30 Code S-PBGA-B325. It has a total of 180 input/output connections and is a type of programmable logic known as a FIELD PROGRAMMABLE GATE ARRAY. This component is also compliant with RoHS regulations.
M2GL025-1FCSG325I Features
180 I/Os
Up to 1130496 RAM bits
M2GL025-1FCSG325I Applications
There are a lot of Microsemi Corporation M2GL025-1FCSG325I FPGAs applications.
Automotive driver's assistance
Automotive
ADAS
Security systems
Broadcast
Ecosystem
Cryptography
Industrial Ethernet
Consumer Electronics
Medical ultrasounds
This particular component is manufactured by Microsemi Corporation and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It is currently in production, with the most recent update being made 1 month ago. The operating temperature range for this chip is -40°C to 100°C TJ. It utilizes CMOS technology and has a bottom terminal position with a ball terminal form. The peak reflow temperature for this chip is 260 degrees Celsius and it is classified under JESD-30 Code S-PBGA-B325. It has a total of 180 input/output connections and is a type of programmable logic known as a FIELD PROGRAMMABLE GATE ARRAY. This component is also compliant with RoHS regulations.
M2GL025-1FCSG325I Features
180 I/Os
Up to 1130496 RAM bits
M2GL025-1FCSG325I Applications
There are a lot of Microsemi Corporation M2GL025-1FCSG325I FPGAs applications.
Automotive driver's assistance
Automotive
ADAS
Security systems
Broadcast
Ecosystem
Cryptography
Industrial Ethernet
Consumer Electronics
Medical ultrasounds
M2GL025-1FCSG325I More Descriptions
M2Gl025-1Fcsg325I 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2GL025-1FCSG325I
IGLOO2 Low Density FPGA, 27.6KLEs
FPGA - Field Programmable Gate Array IGLOO 2
IGLOO2 Low Density FPGA, 27.6KLEs
FPGA - Field Programmable Gate Array IGLOO 2
The three parts on the right have similar specifications to M2GL025-1FCSG325I.
-
ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusPower SuppliesNumber of I/ONumber of InputsProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsRoHS StatusTerminal PitchTime@Peak Reflow Temperature-Max (s)LengthHeight Seated (Max)WidthBase Part NumberRAM SizeView Compare
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M2GL025-1FCSG325I9 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount324-LFBGA, CSPBGAYES-40°C~100°C TJTray2015IGLOO2Active3 (168 Hours)3258542.39.00.01Field Programmable Gate ArraysCMOS1.14V~2.625VBOTTOMBALL2601.2V30S-PBGA-B325180Not Qualified1.2V180180FIELD PROGRAMMABLE GATE ARRAY276961130496RoHS Compliant-------- -
10 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount400-LFBGAYES0°C~85°C TJTray2015IGLOO2Active3 (168 Hours)4008542.39.00.01Field Programmable Gate ArraysCMOS1.14V~2.625VBOTTOMBALL2601.2V-S-PBGA-B400171Not Qualified1.2V169171FIELD PROGRAMMABLE GATE ARRAY6060719872RoHS Compliant0.8mm3017mm1.51mm17mm--
-
12 WeeksIN PRODUCTION (Last Updated: 3 weeks ago)Surface Mount1152-BBGA, FCBGAYES0°C~85°C TJTray2013IGLOO2Active3 (168 Hours)-8542.39.00.01Field Programmable Gate Arrays-1.14V~2.625VBOTTOMBALL2601.2V30S-PBGA-B1152574Not Qualified1.2V574574FIELD PROGRAMMABLE GATE ARRAY1461245120000RoHS Compliant1mm-35mm2.9mm35mmM2GL150625kB
-
9 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount256-LFBGAYES0°C~85°C TJTray2015IGLOO2Active3 (168 Hours)2568542.39.00.01--1.14V~2.625VBOTTOMBALL2401.2V-S-PBGA-B256---138-FIELD PROGRAMMABLE GATE ARRAY276961130496Non-RoHS Compliant0.8mm2014mm1.56mm14mm--
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