0 Shopping Cart

STMicroelectronics M24SR64-YMC6T/2

Part Number:

M24SR64-YMC6T/2

Manufacturer:

STMicroelectronics

Ventron No:

4409928-M24SR64-YMC6T/2

Description:

IC NFC/RFID TAG 64KB EEPROM 8MLP

Datasheet:

M24SR64-YMC6T/2

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
  • One Stop Service

    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

  • Same Day Delivery

    Same Day Delivery

Specifications

STMicroelectronics M24SR64-YMC6T/2 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics M24SR64-YMC6T/2.

  • Lifecycle Status
    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-UFDFN Exposed Pad
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Cut Tape (CT)
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    2.7V~5.5V
  • Terminal Position
    DUAL
  • Terminal Form
    NO LEAD
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    0.5mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    13.56MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    M24SR64
  • Supply Voltage-Max (Vsup)
    5.5V
  • Supply Voltage-Min (Vsup)
    2.7V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C
  • Memory Size
    8kB
  • Operating Mode
    SYNCHRONOUS
  • Memory Width
    8
  • Memory Density
    65536 bit
  • Standards
    ISO 14443, NFC
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    3mm
  • Height Seated (Max)
    0.6mm
  • Width
    2mm
  • REACH SVHC
    No SVHC
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

Images are for reference only.See Product Specifications for product details.If you are interested to buy STMicroelectronics M24SR64-YMC6T/2.
M24SR64-YMC6T/2 More Descriptions
64-Kbit Dynamic NFC/RFID tag NFC forum Type 4 with I2C interface and password protection
NFC/RFID Tag and Transponder Chip 13553kHz to 13567kHz 64Kbit 8-Pin UFDFPN EP Tape and Reel
NFC/RFID TAG, 8KB, 13.56MHZ, QFN-8; Frequency Min: 13.553MHz; Frequency Max: 13.567MHz; RFID IC Type: Read, Write; Programmable Memory: 8KB; Output Power: -; RF IC Case Style: QFN; No. of Pins: 8Pins; Supply Voltage Min: 2.7V; Supply Voltage Max: 5.5V; Current Consumption: 100mA; Product Range: M24SR Series; RoHS Phthalates Compliant: To Be Advised; MSL: MSL 1 - Unlimited; SVHC: No SVHC (17-Dec-2015)

Product Comparison

The three parts on the right have similar specifications to M24SR64-YMC6T/2.
  • Image
    Part Number
    Manufacturer
    Lifecycle Status
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Frequency
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Operating Mode
    Memory Width
    Memory Density
    Standards
    Length
    Height Seated (Max)
    Width
    REACH SVHC
    RoHS Status
    Lead Free
    HTS Code
    JESD-30 Code
    Organization
    Reach Compliance Code
    Mount
    Weight
    Access Time
    Height
    View Compare
  • M24SR64-YMC6T/2
    M24SR64-YMC6T/2
    ACTIVE (Last Updated: 7 months ago)
    8 Weeks
    Surface Mount
    8-UFDFN Exposed Pad
    YES
    8
    -40°C~85°C
    Cut Tape (CT)
    Active
    1 (Unlimited)
    8
    EAR99
    CMOS
    2.7V~5.5V
    DUAL
    NO LEAD
    NOT SPECIFIED
    1
    3.3V
    0.5mm
    13.56MHz
    NOT SPECIFIED
    M24SR64
    5.5V
    2.7V
    I2C
    8kB
    SYNCHRONOUS
    8
    65536 bit
    ISO 14443, NFC
    3mm
    0.6mm
    2mm
    No SVHC
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M24SR64-YMN8T/2
    -
    13 Weeks
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    YES
    -
    -40°C~105°C TA
    Tape & Reel (TR)
    Active
    1 (Unlimited)
    8
    -
    CMOS
    2.7V~5.5V
    DUAL
    GULL WING
    NOT SPECIFIED
    1
    -
    1.27mm
    13.56MHz
    NOT SPECIFIED
    M24SR64
    5.5V
    2.7V
    I2C
    -
    SYNCHRONOUS
    1
    65536 bit
    ISO 14443, NFC
    4.9mm
    1.75mm
    3.9mm
    -
    ROHS3 Compliant
    -
    8542.32.00.71
    R-PDSO-G8
    64KX1
    -
    -
    -
    -
    -
  • M24SR02-YSG12I/2
    -
    6 Weeks
    Surface Mount
    Die
    YES
    -
    -40°C~85°C TA
    -
    Active
    -
    -
    -
    CMOS
    2.7V~5.5V
    UPPER
    NO LEAD
    -
    1
    3.3V
    -
    13.56MHz
    -
    -
    5.5V
    2.7V
    I2C
    -
    SYNCHRONOUS
    1
    2048 bit
    ISO 14443, NFC
    -
    -
    -
    -
    -
    -
    8542.32.00.71
    X-XUUC-N
    2KX1
    compliant
    -
    -
    -
    -
  • M24SR02-YMN6T/2
    ACTIVE (Last Updated: 7 months ago)
    13 Weeks
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    -
    8
    -40°C~85°C
    Cut Tape (CT)
    Active
    1 (Unlimited)
    8
    EAR99
    CMOS
    2.7V~5.5V
    DUAL
    GULL WING
    NOT SPECIFIED
    1
    3.3V
    1.27mm
    13.56MHz
    NOT SPECIFIED
    M24SR02
    5.5V
    2.7V
    I2C
    256B
    SYNCHRONOUS
    -
    -
    ISO 14443, NFC
    5mm
    -
    4mm
    No SVHC
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    Surface Mount
    506.605978mg
    900 ns
    1.5mm

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News