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STMicroelectronics M24M02-DRMN6TP

Part Number:

M24M02-DRMN6TP

Manufacturer:

STMicroelectronics

Ventron No:

3226819-M24M02-DRMN6TP

Description:

IC EEPROM 2MBIT 1MHZ 8SO

ECAD Model:

Datasheet:

M24M02-DRMN6TP

Quantity:

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Total Price: $0.99

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    $0.7733

    $23.20

  • 100

    $0.6946

    $69.46

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    $0.6637

    $331.85

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    $646.70

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Part Pictures

  • M24M02-DRMN6TP Detail Images

Specifications

STMicroelectronics M24M02-DRMN6TP technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics M24M02-DRMN6TP.

  • Factory Lead Time
    13 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 7 months ago)
  • Contact Plating
    Gold
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-SOIC (0.154, 3.90mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e4
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    3A991.B.1.B.1
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.8V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    2.5V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    M24M02
  • Supply Voltage-Max (Vsup)
    5.5V
  • Power Supplies
    2/5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    2-Wire, I2C, Serial
  • Memory Size
    2Mb 256K x 8
  • Nominal Supply Current
    2.5mA
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Non-Volatile
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    1MHz
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    450ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    EEPROM
  • Memory Interface
    I2C
  • Write Cycle Time - Word, Page
    10ms
  • Density
    2 Mb
  • Standby Current-Max
    0.000002A
  • Serial Bus Type
    I2C
  • Endurance
    1000000 Write/Erase Cycles
  • Write Cycle Time-Max (tWC)
    10ms
  • Data Retention Time-Min
    40
  • Write Protection
    HARDWARE
  • I2C Control Byte
    1010DMMR
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    1.25mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    5mm
  • Width
    4mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

M24M02-DRMN6TP Overview
The specific component in question is produced by the company STMicroelectronics and falls under the category of Memory. Its current status is ACTIVE, with the last update being 7 months ago. It is designed to be mounted on a surface and comes in a package or case with 8-SOIC dimensions measuring 0.154 and 3.90mm in width. The ECCN Code for this part is 3A991.B.1.B.1, indicating its export control classification. It utilizes CMOS technology and has a maximum reflow temperature of 30 seconds. Its interface is 2-Wire, I2C, Serial, and its write cycle time for a word or page is 10 milliseconds. The I2C control byte for this component is 1010DMMR. It is not designed for radiation hardening.

M24M02-DRMN6TP Features
Package / Case: 8-SOIC (0.154, 3.90mm Width)
8 Pins

M24M02-DRMN6TP Applications
There are a lot of STMicroelectronics M24M02-DRMN6TP Memory applications.

nonvolatile BIOS memory
graphics card
Camcorders
main computer memory
eSRAM
networks
personal digital assistants
supercomputers
eDRAM
DVD disk buffer
M24M02-DRMN6TP More Descriptions
M24M02-DR Series 2 Mb (256 K x 8) 5.5 V Serial I²C bus EEPROM - SOIC-8
IC EEPROM 2MBIT 1MHZ 8SO / EEPROM Serial-I2C 2M-bit 256K x 8 2.5V/3.3V/5V 8-Pin SO N T/R
EEPROM, Serial I2C, 2 Mbit, 256K x 8bit, 1 MHz, 8 Pins, NSOIC
Standard Serial EEPROM I2C 4M Cycles, 1.8V, SO8, Tape and ReelSTMicroelectronics SCT
EEPROM, 2MBIT, I2C, 1MHZ, SOIC-8; Memory Size: 2Mbit; EEPROM Memory Configuration: 256K x 8bit; Memory Interface Type: Serial I2C (2-Wire); Clock Frequency: 1MHz; Memory Case Style: SOIC; No. of Pins: 8Pins; Supply Voltage Min: 1.8V; Supply Voltage Max: 5.5V; Operating Temperature Min: -40°C; Operating Temperature Max: 85°C; Product Range: 2Mbit I2C Serial EEPROM; MSL: MSL 1 - Unlimited; SVHC: No SVHC (15-Jan-2018); IC Interface Type: Serial I2C
Memory Size KB = 256 / Organisation = 256 k x 8 Bit / Interfaces = I²C / Interfaces = Serial / Clock Frequency Max. MHz = 1 / Access Time ns = 450 / Data Retention Years = 200 / Supply Current mA = 2.5 / Supply Voltage Min. V = 1.8 / Supply Voltage Max. V = 5.5 / Operating Temperature Min. °C = -40 / Operating Temperature Max. °C = 85 / Package Type = SO-8 / Pins = 8 / Mounting Type = SMD / Packaging = Tape & Reel / Length mm = 5 / Width mm = 6.2 / Height mm = 1.75 / Reflow Temperature Max. °C = 260
M24M02-DRMN6TP Detail Images

Product Comparison

The three parts on the right have similar specifications to M24M02-DRMN6TP.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Supply Voltage-Max (Vsup)
    Power Supplies
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    I2C Control Byte
    Height
    Length
    Width
    Radiation Hardening
    RoHS Status
    Lead Free
    Manufacturer Package Identifier
    Memory Width
    Parallel/Serial
    Ambient Temperature Range High
    Surface Mount
    Terminal Finish
    Supply Current-Max
    View Compare
  • M24M02-DRMN6TP
    M24M02-DRMN6TP
    13 Weeks
    ACTIVE (Last Updated: 7 months ago)
    Gold
    Surface Mount
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    8
    -40°C~85°C TA
    Tape & Reel (TR)
    e4
    Active
    1 (Unlimited)
    8
    3A991.B.1.B.1
    CMOS
    1.8V~5.5V
    DUAL
    260
    1
    2.5V
    1.27mm
    30
    M24M02
    5.5V
    2/5V
    2-Wire, I2C, Serial
    2Mb 256K x 8
    2.5mA
    Non-Volatile
    1MHz
    450ns
    EEPROM
    I2C
    10ms
    2 Mb
    0.000002A
    I2C
    1000000 Write/Erase Cycles
    10ms
    40
    HARDWARE
    1010DMMR
    1.25mm
    5mm
    4mm
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
  • M24M01-RDW6TP
    13 Weeks
    ACTIVE (Last Updated: 7 months ago)
    Gold
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    8
    -40°C~85°C TA
    Tape & Reel (TR)
    e4
    Active
    1 (Unlimited)
    8
    EAR99
    CMOS
    1.8V~5.5V
    DUAL
    -
    1
    2.5V
    0.65mm
    -
    M24M01
    5.5V
    -
    -
    1Mb 128K x 8
    2mA
    Non-Volatile
    1MHz
    500ns
    EEPROM
    I2C
    5ms
    1 Mb
    -
    I2C
    -
    5ms
    -
    -
    -
    1.2mm
    4.4mm
    3mm
    No
    ROHS3 Compliant
    -
    TSSOP8-TSSOP8AM
    8
    SERIAL
    85°C
    -
    -
    -
  • M24M02-DRCS6TP/K
    10 Weeks
    ACTIVE (Last Updated: 7 months ago)
    -
    -
    Surface Mount
    8-UBGA, WLCSP
    8
    -40°C~85°C TA
    Cut Tape (CT)
    e1
    Active
    1 (Unlimited)
    8
    3A991.B.1.B.1
    CMOS
    1.8V~5.5V
    BOTTOM
    -
    1
    2.5V
    -
    -
    M24M02
    5.5V
    2/5V
    2-Wire, I2C, Serial
    2Mb 256K x 8
    -
    Non-Volatile
    1MHz
    450ns
    EEPROM
    I2C
    10ms
    2 Mb
    0.000003A
    I2C
    4000000 Write/Erase Cycles
    10ms
    200
    HARDWARE
    1010DMMR
    -
    3.556mm
    2.011mm
    No
    ROHS3 Compliant
    Lead Free
    -
    8
    -
    -
    YES
    Tin/Silver/Copper (Sn/Ag/Cu)
    0.0025mA
  • M24M01-RCS6TP/A
    -
    -
    -
    Surface Mount
    Surface Mount
    8-UFBGA, WLCSP
    8
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    Obsolete
    1 (Unlimited)
    8
    -
    CMOS
    1.8V~5.5V
    BOTTOM
    -
    -
    -
    0.6mm
    -
    M24M01
    -
    2/5V
    I2C, Serial
    1Mb 128K x 8
    5mA
    Non-Volatile
    1MHz
    500ns
    EEPROM
    I2C
    5ms
    1 Mb
    0.000001A
    I2C
    1000000 Write/Erase Cycles
    -
    40
    HARDWARE
    1010DDMR
    -
    -
    -
    No
    ROHS3 Compliant
    -
    -
    8
    -
    -
    -
    -
    -

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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