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STMicroelectronics M24LR64E-RMC6T/2

Part Number:

M24LR64E-RMC6T/2

Manufacturer:

STMicroelectronics

Ventron No:

4409831-M24LR64E-RMC6T/2

Description:

NFC/RFID 64KBIT EEPROM 13.56MHZ

Datasheet:

M24LR64E-RMC6T/2

Payment:

Payment

Delivery:

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Specifications

STMicroelectronics M24LR64E-RMC6T/2 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics M24LR64E-RMC6T/2.

  • Lifecycle Status
    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    8 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-UFDFN Exposed Pad
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e4
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.8V~5.5V
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    2.5V
  • Terminal Pitch
    0.5mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    13.56MHz
  • Base Part Number
    M24LR64
  • Supply Voltage-Max (Vsup)
    5.5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C
  • Nominal Supply Current
    400μA
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    900 ns
  • Organization
    2KX32
  • Memory Width
    32
  • Density
    64 kb
  • Parallel/Serial
    SERIAL
  • Write Cycle Time-Max (tWC)
    5ms
  • Standards
    ISO 15693, ISO 18000-3, NFC
  • Alternate Memory Width
    8
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    3mm
  • Height Seated (Max)
    0.6mm
  • Width
    2mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

The M24LR64E-RMC6T/2 is NFC/RFID 64KBIT EEPROM 13.56MHZ , it is part of - series. they are designed to work as RFID, RF Access, Monitoring ICs.M24LR64E-RMC6T/2 with pin details manufactured by STMicroelectronics. The M24LR64E-RMC6T/2 is available in 8-MLP (2x3) Package,it is part of the electronic component Chips.that includes - Series. they are designed to operate as RFID, RF Access, Monitoring ICs.it is with Operating Temperature -40°C ~ 85°C.M24LR64E-RMC6T/2 with original stock manufactured by STMicroelectronics. The M24LR64E-RMC6T/2 is available in 8-MLP (2x3) Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of M24LR64E-RMC6T/2is designed to work in 8-UFDFN Exposed Pad, it's Operating Temperature is -40°C ~ 85°C.The M24LR64E-RMC6T/2 is available in 8-UFDFN Exposed Pad Package, is part of the RFID, RF Access, Monitoring ICs and belong to RF/IF and RFID.M24LR64E-RMC6T/2 with EDA / CAD Models manufactured by STMicroelectronics. The M24LR64E-RMC6T/2 is available in 8-MLP (2x3)Package, is part of the RF/IF and RFID.The M24LR64E-RMC6T/2 is RFID, RF Access, Monitoring ICs with package 8-UFDFN Exposed Pad manufactured by STMicroelectronics. The M24LR64E-RMC6T/2 is available in 8-MLP (2x3) Package, is part of the NFC/RFID 64KBIT EEPROM 13.56MHZ.
M24LR64E-RMC6T/2 More Descriptions
EEPROM Serial-I2C 64K-bit 8K x 8 2.5V/3.3V/5V 8-Pin UFDFPN EP T/R
NFC/RFID Tag and Transponder IC 13553kHz to 13567kHz 64Kbit 8-Pin UFDFPN EP Tape and Reel
RFID Transponders 64Kbit EEProm 400kHz 13.56Mhz 1.8 to 5.5V
64-Kbit Dynamic NFC/RFID tag with password protection, energy harvesting and RF status functions
EEPROM, 2KX32, Serial, CMOS, PDSO8
St25 Dynamic Tags Hf |Stmicroelectronics M24LR64E-RMC6T/2
TAG IC R/W 13,56MHz I2C 64Kbit
DYNAMIC NFC/RFID TAG IC, UFDFPN-8; Frequency Min: 13.553MHz; Frequency Max: 13.567MHz; RFID IC Type: Read, Write; Programmable Memory: 64Kbit; Output Power: -; RF IC Case Style: UFDFPN; No. of Pins: 8Pins; Supply Voltage Min: 1.

Product Comparison

The three parts on the right have similar specifications to M24LR64E-RMC6T/2.
  • Image
    Part Number
    Manufacturer
    Lifecycle Status
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Frequency
    Base Part Number
    Supply Voltage-Max (Vsup)
    Interface
    Nominal Supply Current
    Access Time
    Organization
    Memory Width
    Density
    Parallel/Serial
    Write Cycle Time-Max (tWC)
    Standards
    Alternate Memory Width
    Length
    Height Seated (Max)
    Width
    Radiation Hardening
    RoHS Status
    Lead Free
    Depth
    Memory Size
    Manufacturer Package Identifier
    Terminal Form
    Height
    REACH SVHC
    Subcategory
    Peak Reflow Temperature (Cel)
    Pin Count
    Power Supplies
    Standby Current-Max
    Endurance
    Data Retention Time-Min
    Write Protection
    I2C Control Byte
    View Compare
  • M24LR64E-RMC6T/2
    M24LR64E-RMC6T/2
    ACTIVE (Last Updated: 7 months ago)
    8 Weeks
    Surface Mount
    Surface Mount
    8-UFDFN Exposed Pad
    8
    -40°C~85°C
    Tape & Reel (TR)
    e4
    Active
    1 (Unlimited)
    8
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    CMOS
    1.8V~5.5V
    DUAL
    1
    2.5V
    0.5mm
    13.56MHz
    M24LR64
    5.5V
    I2C
    400μA
    900 ns
    2KX32
    32
    64 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    8
    3mm
    0.6mm
    2mm
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M24LR04E-RMC6T/2
    ACTIVE (Last Updated: 7 months ago)
    8 Weeks
    Surface Mount
    Surface Mount
    8-UFDFN Exposed Pad
    8
    -40°C~85°C
    Tape & Reel (TR)
    -
    Active
    1 (Unlimited)
    8
    EAR99
    -
    CMOS
    1.8V~5.5V
    DUAL
    1
    2.5V
    0.5mm
    13.56MHz
    M24LR04
    5.5V
    I2C
    -
    900 ns
    -
    32
    4 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    8
    2mm
    0.6mm
    -
    No
    ROHS3 Compliant
    Lead Free
    3mm
    512B
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M24LR64E-RDW6T/2
    ACTIVE (Last Updated: 7 months ago)
    13 Weeks
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    8
    -40°C~85°C
    Tape & Reel (TR)
    -
    Active
    1 (Unlimited)
    8
    EAR99
    -
    CMOS
    1.8V~5.5V
    DUAL
    1
    2.5V
    0.65mm
    13.56MHz
    M24LR64
    5.5V
    I2C
    400μA
    900 ns
    2KX32
    -
    64 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    -
    3.1mm
    -
    4.5mm
    No
    ROHS3 Compliant
    Lead Free
    -
    8kB
    TSSOP8AM
    GULL WING
    1.05mm
    No SVHC
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M24LR64-RDW6T/2
    -
    -
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    8
    -40°C~85°C
    Tape & Reel (TR)
    e4
    Obsolete
    1 (Unlimited)
    8
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    CMOS
    1.8V~5.5V
    DUAL
    1
    2.5V
    0.5mm
    13.56MHz
    M24LR64
    5.5V
    I2C
    700μA
    900 ns
    2KX32
    -
    64 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    -
    3mm
    -
    4.5mm
    No
    ROHS3 Compliant
    Lead Free
    4.4mm
    8kB
    -
    GULL WING
    1.05mm
    No SVHC
    EEPROMs
    260
    8
    2/5V
    0.00003A
    1000000 Write/Erase Cycles
    40
    SOFTWARE
    1010CDDR

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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