Harwin Inc. M20-1060800

Contact Material refers to the material used to make the electrical contacts in a component. It determines the electrical conductivity, durability, and resistance to corrosion and wear of the contacts. Common contact materials include copper, silver, gold, and alloys of these metals. The choice of contact material depends on the specific application and the required performance characteristics.

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Housing Material refers to the material used to construct the outer casing or enclosure of an electronic component.

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Contact Type refers to the physical construction and materials used in the electrical contacts of a component. It describes the type of connection made between two or more conductors.

Pitch, in the context of electronic components, refers to the distance between the centers of adjacent pins or terminals on a component. It is typically measured in millimeters (mm) or inches (in). The pitch determines the spacing between components on a printed circuit board (PCB) and affects the overall size and layout of the board. A smaller pitch allows for more components to be placed on a given area, but it also increases the risk of shorts and other manufacturing defects.

Current Rating is the maximum amount of current that an electronic component can safely handle without overheating or failing. It is typically expressed in amperes (A) or milliamperes (mA). Exceeding the current rating can damage the component and potentially create a safety hazard. The current rating is determined by the physical characteristics of the component, such as its size, material, and construction.

Contact resistance is the electrical resistance between two electrical contacts. It is caused by the imperfect contact between the two surfaces, which results in a small amount of resistance to the flow of current. Contact resistance can be a significant factor in the performance of electrical circuits, especially in high-power applications. It can cause power loss, heating, and even damage to components.