Microsemi Corporation M1A3P400-FGG256
- Part Number:
- M1A3P400-FGG256
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3632881-M1A3P400-FGG256
- Description:
- IC FPGA 178 I/O 256FBGA
- Datasheet:
- M1A3P400-FGG256
Microsemi Corporation M1A3P400-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M1A3P400-FGG256.
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Factory Lead Time12 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Supplier Device Package256-FPBGA (17x17)
- Operating Temperature0°C~85°C TJ
- PackagingTray
- SeriesProASIC3
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature70°C
- Min Operating Temperature0°C
- Voltage - Supply1.425V~1.575V
- Base Part NumberM1A3P400
- Number of I/O178
- RAM Size6.8kB
- Total RAM Bits55296
- Number of Gates400000
- RoHS StatusRoHS Compliant
M1A3P400-FGG256 Overview
In the package 256-LBGA, this product is provided. A total of 178 I/Os are programmed to ensure a more coherent data transfer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the ProASIC3 series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 55296 bfpga electronics s of RAM. M1A3P400 is the base part number that can be used to identify related parts. The RAM si6.8kBe of this FPGA module reaches 6.8kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This module can reach a maximum operating temperature of 70°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. A basic building block for this type of building block consists of 400000 gates. As a supplier, 256-FPBGA (17x17) is responsible for the package of its devices.
M1A3P400-FGG256 Features
178 I/Os
Up to 55296 RAM bits
256 LABs/CLBs
70°C gates
M1A3P400-FGG256 Applications
There are a lot of Microsemi Corporation
M1A3P400-FGG256 FPGAs applications.
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
Data Center
In the package 256-LBGA, this product is provided. A total of 178 I/Os are programmed to ensure a more coherent data transfer. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the ProASIC3 series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. As a result of space limitations, this FPGA model has been included in Tray. Fpga electronics is worth mentioning that this device provides 55296 bfpga electronics s of RAM. M1A3P400 is the base part number that can be used to identify related parts. The RAM si6.8kBe of this FPGA module reaches 6.8kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This module can reach a maximum operating temperature of 70°C when operating at its maximum power. Fpga electronics is necessary to maintain an operating temperature higher than 0°C. A basic building block for this type of building block consists of 400000 gates. As a supplier, 256-FPBGA (17x17) is responsible for the package of its devices.
M1A3P400-FGG256 Features
178 I/Os
Up to 55296 RAM bits
256 LABs/CLBs
70°C gates
M1A3P400-FGG256 Applications
There are a lot of Microsemi Corporation
M1A3P400-FGG256 FPGAs applications.
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
Data Center
M1A3P400-FGG256 More Descriptions
M1A3P400-Fgg256 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip M1A3P400-FGG256
ProASIC3 FPGA, ARM Cortex-M1, 5KLEs
IC FPGA 1KB FLASH 400K 256-FBGA
ProASIC3 FPGA, ARM Cortex-M1, 5KLEs
IC FPGA 1KB FLASH 400K 256-FBGA
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