Microsemi Corporation M1A3P1000-1FGG256I
- Part Number:
- M1A3P1000-1FGG256I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3126904-M1A3P1000-1FGG256I
- Description:
- IC FPGA 177 I/O 256FBGA
- ECAD Model:
-
- Datasheet:
- M1A3P1000-1FGG256I
Microsemi Corporation M1A3P1000-1FGG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M1A3P1000-1FGG256I.
- Factory Lead Time12 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Weight400.011771mg
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2003
- SeriesProASIC3
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- TechnologyCMOS
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.5V
- Reflow Temperature-Max (s)40
- Base Part NumberM1A3P1000
- Operating Supply Voltage1.5V
- Number of I/O177
- RAM Size18kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits147456
- Number of Gates1000000
- Max Frequency272MHz
- Speed Grade1
- Number of Registers24576
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
M1A3P1000-1FGG256I Overview
This part is manufactured by Microsemi Corporation and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It has a surface mount mount and a package/case of 256-LBGA. The specific series is ProASIC3 and it has a moisture sensitivity level of 3 (168 hours). The technology used is CMOS and the terminal form is BALL. It has a total of 147456 RAM bits and a maximum frequency of 272MHz. Additionally, it has 24576 registers and is not radiation hardened.
M1A3P1000-1FGG256I Features
177 I/Os
Up to 147456 RAM bits
256 LABs/CLBs
24576 registers
M1A3P1000-1FGG256I Applications
There are a lot of Microsemi Corporation M1A3P1000-1FGG256I FPGAs applications.
Wireless Communications
Aircraft navigation
Military DSP
Secure Communication
ASIC prototyping
Enterprise networking
Computer hardware emulation
Digital signal processing
Automotive
Audio
This part is manufactured by Microsemi Corporation and falls under the category of Embedded - FPGAs (Field Programmable Gate Array) chips. It has a surface mount mount and a package/case of 256-LBGA. The specific series is ProASIC3 and it has a moisture sensitivity level of 3 (168 hours). The technology used is CMOS and the terminal form is BALL. It has a total of 147456 RAM bits and a maximum frequency of 272MHz. Additionally, it has 24576 registers and is not radiation hardened.
M1A3P1000-1FGG256I Features
177 I/Os
Up to 147456 RAM bits
256 LABs/CLBs
24576 registers
M1A3P1000-1FGG256I Applications
There are a lot of Microsemi Corporation M1A3P1000-1FGG256I FPGAs applications.
Wireless Communications
Aircraft navigation
Military DSP
Secure Communication
ASIC prototyping
Enterprise networking
Computer hardware emulation
Digital signal processing
Automotive
Audio
M1A3P1000-1FGG256I More Descriptions
FPGA ProASIC3 Family 1M Gates 272MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
M1A3P1000-1Fgg256I 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip M1A3P1000-1FGG256I
ProASIC3 FPGA, ARM Cortex-M1, 11KLEs
M1A3P1000-1Fgg256I 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip M1A3P1000-1FGG256I
ProASIC3 FPGA, ARM Cortex-M1, 11KLEs
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