LTC2321CUFD-12#TRPBF

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Linear Technology LTC2321CUFD-12#TRPBF

Part Number:

LTC2321CUFD-12#TRPBF

Manufacturer:

Linear Technology

Ventron No:

3011507-LTC2321CUFD-12#TRPBF

Description:

IC ADC 12BIT 2MSPS 28QFN

ECAD Model:

Datasheet:

LTC2321CUFD-12#TRPBF

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  • 1

    $9.0561

    $9.06

  • 200

    $3.5055

    $701.10

  • 500

    $3.3818

    $1690.90

  • 1000

    $3.3214

    $3321.40

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Part Overview

Description
The LTC2321-12 is a dual, 12-bit sign, 2Msps differential input ADC with a wide input common mode range. It operates from a single 3.3V or 5V supply and has an 8Vp.p differential input range. The LTC2321-12 achieves ±0.5LSB INL typical, no missing codes at 12 bits, and 73dB SNR. It has an onboard low drift (20ppm/°C max) 2.048V or 4.096V internal reference and a high speed SPI-compatible serial interface that supports CMOS or LVDS. The LTC2321-12 dissipates only 30mW per channel and offers nap and sleep modes to reduce power consumption to 5μW during inactive periods.

Features
2Msps throughput rate
±0.5LSB INL (Typ)
Guaranteed 12-Bit, No Missing Codes
8Vp.p Differential Inputs with Wide Input Common Mode Range
73dB SNR (Typ) at fiN = 500kHz
-85dB THD (Typ) at fiN = 500kHz
Guaranteed Operation to 125°C
Single 3.3V or 5V Supply
Low Drift (20ppm/°C Max) 2.048V or 4.096V Internal Reference
1.8V to 2.5V I/O Voltages
CMOS or LVDS SPI-Compatible Serial I/O
Power Dissipation 30mW/Ch (Typ)
Small 28-Lead (4mm x 5mm) QFN Package

Applications
High Speed Data Acquisition Systems
Communications
Remote Data Acquisition
Imaging
Optical Networking
Automotive
Multiphase Motor Control

Specifications

Linear Technology LTC2321CUFD-12#TRPBF technical specifications, attributes, parameters and parts with similar specifications to Linear Technology LTC2321CUFD-12#TRPBF.

  • Factory Lead Time
    18 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    28-WFQFN Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2014
  • JESD-609 Code
    e3
  • Feature
    Simultaneous Sampling
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    28
  • Terminal Finish
    Matte Tin (Sn)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    QUAD
  • Terminal Form
    NO LEAD
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    0.5mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    LTC2321
  • Pin Count
    28
  • Configuration
    S/H-ADC
  • Number of Bits
    12
  • Input Type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Differential, Pseudo-Differential
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    SAR
  • Number of Inputs

    The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

    2
  • Converter Type

    Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.

    ADC, SUCCESSIVE APPROXIMATION
  • Reference Type

    Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

    External, Internal
  • Data Interface

    Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

    LVDS - Serial, Serial
  • Voltage - Supply, Analog
    3.13V~3.47V 5V
  • Voltage - Supply, Digital
    3.13V~3.47V 5V
  • Number of Analog In Channels
    2
  • Sampling Rate (Per Second)
    2M
  • Sample and Hold / Track and Hold
    SAMPLE
  • Ratio - S/H:ADC

    Ratio - S/H:ADC is an electronic component parameter that specifies the ratio of the output voltage of a sample-and-hold (S/H) circuit to the input voltage of the analog-to-digital converter (ADC). It is expressed as a percentage and indicates the accuracy of the ADC's conversion process. A higher ratio indicates better accuracy, as it means that the ADC is able to convert the analog input signal into a digital representation with less error.

    1:1
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    5mm
  • Height Seated (Max)
    0.8mm
  • Width
    4mm
  • RoHS Status
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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