LTC2313ITS8-12#TRPBF

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Linear Technology LTC2313ITS8-12#TRPBF

Part Number:

LTC2313ITS8-12#TRPBF

Manufacturer:

Linear Technology

Ventron No:

3012046-LTC2313ITS8-12#TRPBF

Description:

IC ADC 12BIT 2.5MSPS TSOT23-8

ECAD Model:

Datasheet:

LTC2313ITS8-12#TRPBF

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Unit Price

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  • 1

    $53.3711

    $53.37

  • 200

    $20.6554

    $4131.08

  • 500

    $19.9283

    $9964.15

  • 1000

    $19.5694

    $19569.40

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Part Overview

Description
The LTC2313-12 is a 12-bit, 2.5Msps serial sampling ADC that operates from a single 3V or 5V supply. It features an integrated low-drift reference and reference buffer, providing a cost-effective and space-saving solution. The LTC2313-12 achieves outstanding AC performance with a 72.6dB SINAD and -84dB THD while sampling at 2.5Msps. Its high sample rate-to-power ratio makes it ideal for compact, low-power, high-speed systems. The device automatically enters nap mode after conversions, reducing supply current at lower sampling rates.

Features
2.5Msps throughput rate
No cycle latency
Guaranteed 12-bit no missing codes
Single 3V or 5V supply
Low noise: 73dB SNR
Low power: 14mW at 2.5Msps and 3V supply
Low drift (20ppm/°C maximum)
2.048V or 4.096V internal reference
Sleep mode with <1μA typical supply current
Nap mode with quick wake-up (<1 conversion)
Separate 1.8V to 5V digital I/O supply
High-speed SPI-compatible serial I/O
Guaranteed operation from -40°C to 125°C
8-lead TSOT-23 package

Applications
Communication systems
High-speed data acquisition
Handheld terminal interface
Medical imaging
Uninterrupted power supplies
Battery-operated systems
Automotive

Specifications

Linear Technology LTC2313ITS8-12#TRPBF technical specifications, attributes, parameters and parts with similar specifications to Linear Technology LTC2313ITS8-12#TRPBF.

  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    SOT-23-8 Thin, TSOT-23-8
  • Surface Mount
    YES
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2013
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • Terminal Finish
    Matte Tin (Sn)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3V
  • Terminal Pitch
    0.65mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    LTC2313
  • Pin Count
    8
  • JESD-30 Code
    R-PDSO-G8
  • Configuration
    S/H-ADC
  • Number of Bits
    12
  • Input Type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Single Ended
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    SAR
  • Number of Inputs

    The number of inputs of an electronic component refers to the number of separate signals or data streams that the component can receive and process simultaneously. It indicates the maximum number of external connections that can be made to the component to provide input signals. This parameter is crucial for determining the functionality and connectivity of the component within a circuit or system.

    1
  • Converter Type

    Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.

    ADC, SUCCESSIVE APPROXIMATION
  • Reference Type

    Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

    Internal
  • Data Interface

    Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

    SPI
  • Sampling Rate

    Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.

    2.5 MHz
  • Voltage - Supply, Analog
    2.7V~3.6V 5V
  • Voltage - Supply, Digital
    2.7V~3.6V 5V
  • Number of Analog In Channels
    1
  • Sampling Rate (Per Second)
    2.5M
  • Output Bit Code
    BINARY
  • Linearity Error-Max (EL)
    0.0366%
  • Sample and Hold / Track and Hold
    SAMPLE
  • Ratio - S/H:ADC

    Ratio - S/H:ADC is an electronic component parameter that specifies the ratio of the output voltage of a sample-and-hold (S/H) circuit to the input voltage of the analog-to-digital converter (ADC). It is expressed as a percentage and indicates the accuracy of the ADC's conversion process. A higher ratio indicates better accuracy, as it means that the ADC is able to convert the analog input signal into a digital representation with less error.

    1:1
  • Analog Input Voltage-Max
    2.056V
  • Output Format
    SERIAL
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    2.9mm
  • RoHS Status
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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