Linear Technology LTC2000CY-14#PBF

LTC2000CY-14#PBF Overview
The package or case of the product is BGA, which stands for Ball Grid Array. This type of packaging is commonly used for integrated circuits and offers a high number of connections in a compact size. The packaging for this particular product is cut tape, which means that the individual units are separated by cutting a continuous strip of packaging material. The minimum operating temperature for this product is 0°C, making it suitable for use in a wide range of environments. The interface for this product is LVDS, Parallel, and SPI, providing multiple options for connecting to other devices. It has a 14-bit resolution and offers differential output, ensuring accurate and stable signal transmission. The sampling rate for this product is 2.5 Gsps, allowing for fast and precise data acquisition. The settling time is 2.2 μs, meaning that the output settles to its final value within this time frame. This product has one D/A converter, which converts digital signals into analog signals. It is also RoHS compliant, meaning that it is free from hazardous substances and is environmentally friendly.

LTC2000CY-14#PBF Features
BGA package
170 pins


LTC2000CY-14#PBF Applications
There are a lot of Analog Devices, Inc.
LTC2000CY-14#PBF Digital to Analog Converters (DAC) applications.


Display Electronics
Data Acquisition Systems
Calibration
Motor Control
Data Distribution System
Digital Potentiometer
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications: