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Linear Technology LT6233IS6#TRMPBF

Part Number:

LT6233IS6#TRMPBF

Manufacturer:

Linear Technology

Ventron No:

3689126-LT6233IS6#TRMPBF

Description:

IC OPAMP GP 60MHZ RRO TSOT23-6

Datasheet:

LT6233IS6#TRMPBF

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Part Overview

Description
The LT6233/LT6234/LT6235 are single/dual/quad low-noise, rail-to-rail output, unity-gain stable op amps. They feature:
Low noise voltage: 1.9nV/√Hz
Low supply current: 1.2mA/amp max
Low offset voltage: 350µV max
Gain-bandwidth product:
LT6233: 60MHz; Ay ≥ 1
LT6233-10: 375MHz; Ay ≥ 10
Wide supply range: 3V to 12.6V
Output swings rail-to-rail
Common mode rejection ratio: 115dB typ
Output current: 30mA
Operating temperature range: -40°C to 85°C
LT6233 shutdown to 10μA maximum
LT6233/LT6233-10 in a low profile (1mm) ThinSOT™ package
Dual LT6234 in 8-pin SO and tiny DFN packages
LT6235 in a 16-pin SSOP package

Features
Low noise voltage: 1.9nV/√Hz
Low supply current: 1.2mA/amp max
Low offset voltage: 350µV max
Gain-bandwidth product:
LT6233: 60MHz; Ay ≥ 1
LT6233-10: 375MHz; Ay ≥ 10
Wide supply range: 3V to 12.6V
Output swings rail-to-rail
Common mode rejection ratio: 115dB typ
Output current: 30mA
Operating temperature range: -40°C to 85°C
LT6233 shutdown to 10μA maximum
LT6233/LT6233-10 in a low profile (1mm) ThinSOT™ package
Dual LT6234 in 8-pin SO and tiny DFN packages
LT6235 in a 16-pin SSOP package

Applications
Ultrasound amplifiers
Low noise, low power signal processing
Active filters
Driving A/D converters
Rail-to-rail buffer amplifiers

Specifications

Linear Technology LT6233IS6#TRMPBF technical specifications, attributes, parameters and parts with similar specifications to Linear Technology LT6233IS6#TRMPBF.

  • Lifecycle Status
    PRODUCTION (Last Updated: 2 weeks ago)
  • Factory Lead Time
    8 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    SOT-23-6 Thin, TSOT-23-6
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    6
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2005
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    6
  • ECCN Code
    EAR99
  • Terminal Finish
    Matte Tin (Sn)
  • Subcategory
    Operational Amplifier
  • Packing Method
    TAPE AND REEL
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    BIPOLAR
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Terminal Pitch
    0.95mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    LT6233
  • Pin Count
    6
  • Qualification Status
    Not Qualified
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    Rail-to-Rail
  • Number of Elements
    1
  • Power Supplies
    3.3/5/ -5V
  • Operating Supply Current

    Operating Supply Current is the amount of current drawn by an electronic component when it is operating under normal conditions. It is typically measured in milliamps (mA) or microamps (µA). The operating supply current is important because it can affect the power consumption of the component and the overall system. A higher operating supply current will result in higher power consumption, which can lead to overheating and reduced battery life.

    1.15mA
  • Slew Rate

    Slew rate is a measure of how quickly an electronic component's output voltage can change in response to a change in its input voltage. It is typically expressed in volts per microsecond (V/µs). A higher slew rate indicates that the component can respond more quickly to changes in its input voltage, which can be important in applications where fast signal processing is required.

    17V/μs
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    VOLTAGE-FEEDBACK
  • Amplifier Type

    Amplifier Type refers to the classification of amplifiers based on their circuit configuration and the type of transistors or other active devices used.

    General Purpose
  • Common Mode Rejection Ratio
    90 dB
  • Current - Input Bias
    1.5μA
  • Voltage - Supply, Single/Dual (±)
    3V~12.6V ±1.5V~6.3V
  • Output Current per Channel
    55mA
  • Input Offset Voltage (Vos)

    Input Offset Voltage (Vos) is a parameter that specifies the voltage difference between the non-inverting and inverting inputs of an operational amplifier (op-amp) when the output voltage is zero. It represents the amount of voltage that must be applied to the inputs to bring the output to zero. Vos is caused by mismatches in the internal transistors of the op-amp and can vary with temperature and other factors. A low Vos is desirable for precision applications where accurate signal processing is required.

    500μV
  • Gain Bandwidth Product
    60MHz
  • Neg Supply Voltage-Nom (Vsup)
    -5V
  • Unity Gain BW-Nom
    60000 kHz
  • Voltage Gain
    102.92dB
  • Average Bias Current-Max (IIB)
    4μA
  • Power Supply Rejection Ratio (PSRR)
    90dB
  • Low-Offset
    YES
  • Frequency Compensation
    YES
  • Voltage - Input Offset
    100μV
  • Low-Bias
    NO
  • Micropower
    NO
  • Bias Current-Max (IIB) @25C
    3μA
  • Programmable Power
    NO
  • Nominal Gain Bandwidth Product
    375MHz
  • Wideband
    NO
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    2.9mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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