Cornell Dubilier Electronics (CDE) LP332M063H3P3

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Lead spacing refers to the distance between the centers of two adjacent leads on an electronic component. It is typically measured in millimeters (mm) or inches (in). Lead spacing is an important parameter to consider when designing printed circuit boards (PCBs), as it determines the size and layout of the board. Proper lead spacing ensures that the component can be properly mounted and soldered onto the PCB, and that there is sufficient clearance between the leads to prevent short circuits.

Test Frequency refers to the frequency at which an electronic component is tested to ensure it meets its specified performance parameters. It is typically expressed in Hertz (Hz) and represents the frequency range over which the component is tested. This parameter is important for ensuring the component's reliability and performance under different operating conditions.

Polarization in electronic components refers to the orientation of the electric field within the component. It is a measure of the component's ability to store electrical energy. A polarized component has a positive and a negative terminal, and the electric field is oriented from the positive to the negative terminal. When a polarized component is connected to a voltage source, the electric field is established and the component stores electrical energy.

Dissipation Factor (DF) is a measure of the energy lost in a capacitor due to its internal resistance. It is expressed as a percentage of the total energy stored in the capacitor. A low DF indicates a high-quality capacitor with low energy loss, while a high DF indicates a low-quality capacitor with significant energy loss. DF is important in applications where energy efficiency is crucial, such as power factor correction and filtering circuits.