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Texas Instruments LM4050AEM3-5.0

Part Number:

LM4050AEM3-5.0

Manufacturer:

Texas Instruments

Ventron No:

3751567-LM4050AEM3-5.0

Description:

IC VREF SHUNT 5V SOT23-3

ECAD Model:

Datasheet:

LM4050AEM3-5.0

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Delivery:

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Unit Price

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  • 1

    $2.3368

    $2.34

  • 200

    $0.9053

    $181.06

  • 500

    $0.8728

    $436.40

  • 1000

    $0.8574

    $857.40

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Part Overview

Description
The LM4050-N is a precision micropower shunt voltage reference designed for space-critical applications. It is available in a sub-miniature SOT-23 surface-mount package and eliminates the need for an external stabilizing capacitor. The LM4050-N is stable with any capacitive load, making it easy to use. It is available in several fixed reverse breakdown voltages: 2.048V, 2.500V, 4.096V, 5.000V, 8.192V, and 10.000V. The minimum operating current increases from 60 μA for the LM4050-N-2.0 to 100 μA for the LM4050-N-10.0. All versions have a maximum operating current of 15 mA.

Features
Small SOT-23 package
No output capacitor required
Tolerates capacitive loads
Fixed reverse breakdown voltages of 2.048V, 2.500V, 4.096V, 5.000V, 8.192V, and 10.000V
Low output noise (10 Hz to 10 kHz): 41 μVrms (typ)
Wide operating current range: 60 μA to 15 mA
Industrial temperature range: -40°C to 85°C
Extended temperature range: -40°C to 125°C
Low temperature coefficient: 50 ppm/°C (max)

Applications
Portable, battery-powered equipment
Data acquisition systems
Instrumentation
Process control
Energy management
Product testing
Automotive
Precision audio components

Specifications

Texas Instruments LM4050AEM3-5.0 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments LM4050AEM3-5.0.

  • Lifecycle Status
    NRND (Last Updated: 2 days ago)
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    TO-236-3, SC-59, SOT-23-3
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    3
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~125°C TA
  • Packaging
    Tape & Reel (TR)
  • Tolerance

    Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

    ±0.1%
  • JESD-609 Code
    e0
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    3
  • ECCN Code
    EAR99
  • Temperature Coefficient

    Temperature Coefficient (TC) measures the relative change in a component's value due to temperature variations. It is expressed as a percentage change per degree Celsius (°C). A positive TC indicates an increase in value with increasing temperature, while a negative TC indicates a decrease. TC is crucial for ensuring stable circuit performance over a range of temperatures. It helps designers compensate for temperature-induced changes and maintain desired component characteristics.

    50ppm/°C
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Subcategory
    Voltage References
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    BIPOLAR
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Terminal Pitch
    0.95mm
  • Base Part Number
    LM4050
  • Pin Count
    3
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    1
  • Output Voltage

    Output Voltage is the voltage level produced by an electronic component when it is operating. It is typically measured in volts (V) and can be either positive or negative. The output voltage of a component is determined by its design and the input voltage applied to it. For example, a voltage regulator will produce a fixed output voltage regardless of the input voltage, while an amplifier will produce an output voltage that is proportional to the input voltage.

    5V
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    Fixed
  • Max Output Current
    15mA
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    1
  • Trim/Adjustable Output
    NO
  • Analog IC - Other Type
    TWO TERMINAL VOLTAGE REFERENCE
  • Max Output Voltage
    5V
  • Reference Type

    Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

    Shunt
  • Min Output Voltage
    5V
  • Temp Coef of Voltage-Max
    50 ppm/°C
  • Current - Cathode
    90μA
  • Noise - 10Hz to 10kHz
    93μVrms
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    1.22mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    2.92mm
  • Width
    1.3mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    1mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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