Lattice Semiconductor Corporation LFSCM3GA15EP1-7FN256C
- Part Number:
- LFSCM3GA15EP1-7FN256C
- Manufacturer:
- Lattice Semiconductor Corporation
- Ventron No:
- 3635703-LFSCM3GA15EP1-7FN256C
- Description:
- IC FPGA 139 I/O 256FBGA
- Datasheet:
- Lattice SC/M Family
Lattice Semiconductor Corporation LFSCM3GA15EP1-7FN256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFSCM3GA15EP1-7FN256C.
- Factory Lead Time8 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-BGA
- Number of Pins256
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2008
- SeriesSCM
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply0.95V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)40
- Base Part NumberLFSCM3GA15
- Pin Count256
- Number of Outputs139
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Power Supplies1.21.2/3.32.5V
- Number of I/O139
- RAM Size128.8kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells15000
- Total RAM Bits1054720
- Max Frequency700MHz
- Number of LABs/CLBs3750
- Number of CLBs56
- Number of Logic Cells15200
- Height Seated (Max)2.1mm
- Length17mm
- Width17mm
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
LFSCM3GA15EP1-7FN256C Overview
The LFSCM3GA15 is a 256-BGA package with a Surface Mount mount type. It is compliant with JESD-609 code e1 and is also Pbfree, making it an environmentally friendly option. The terminal position is located at the bottom of the package, providing easy access for assembly and soldering. The peak reflow temperature for this package is 250 degrees Celsius, ensuring proper melting and bonding of the solder. With a terminal pitch of 1mm and a maximum reflow temperature of 40 seconds, the LFSCM3GA15 is a convenient and efficient choice for electronic components. This package also boasts 139 outputs, making it suitable for a wide range of applications.
LFSCM3GA15EP1-7FN256C Features
139 I/Os
Up to 1054720 RAM bits
256 LABs/CLBs
LFSCM3GA15EP1-7FN256C Applications
There are a lot of Lattice Semiconductor Corporation LFSCM3GA15EP1-7FN256C FPGAs applications.
Space Applications
Military DSP
Voice recognition
ADAS
Data center search engines
Audio
Security systems
Solar Energy
Software-defined radios
Device controllers
The LFSCM3GA15 is a 256-BGA package with a Surface Mount mount type. It is compliant with JESD-609 code e1 and is also Pbfree, making it an environmentally friendly option. The terminal position is located at the bottom of the package, providing easy access for assembly and soldering. The peak reflow temperature for this package is 250 degrees Celsius, ensuring proper melting and bonding of the solder. With a terminal pitch of 1mm and a maximum reflow temperature of 40 seconds, the LFSCM3GA15 is a convenient and efficient choice for electronic components. This package also boasts 139 outputs, making it suitable for a wide range of applications.
LFSCM3GA15EP1-7FN256C Features
139 I/Os
Up to 1054720 RAM bits
256 LABs/CLBs
LFSCM3GA15EP1-7FN256C Applications
There are a lot of Lattice Semiconductor Corporation LFSCM3GA15EP1-7FN256C FPGAs applications.
Space Applications
Military DSP
Voice recognition
ADAS
Data center search engines
Audio
Security systems
Solar Energy
Software-defined radios
Device controllers
LFSCM3GA15EP1-7FN256C More Descriptions
Field Programmable Gate Arrays - FPGAs 15.2K LUTs MACO 3G SERDES 1.2V -7 Spd
IC FPGA 139 I/O 256FBGA
IC FPGA 139 I/O 256FBGA
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