Microsemi Corporation LE58083ABGCT

LE58083ABGCT Overview
The mounting type for this device is surface mount, meaning it can be easily attached to a circuit board without the need for any additional hardware. The package or case for this device is 121-LFBGA, which refers to the size and shape of the component. The supplier device package is also 121-LFBGA (10x10), indicating that it has a 10x10 grid of pins for connection. This device has an operating temperature range of -40°C to 85°C, making it suitable for use in a variety of environments. It is packaged in tape and reel (TR) format, which is a common method for storing and transporting electronic components. However, it is important to note that this part is now obsolete and no longer in production. It has a moisture sensitivity level (MSL) of 3, meaning it can withstand 168 hours of exposure to moisture without damage. The voltage supply for this device is 3.3V, and its interface is PCI, indicating that it is designed to communicate with other devices using the PCI protocol. It is also worth mentioning that this device is not compliant with RoHS regulations.

LE58083ABGCT Features
Available in the 121-LFBGA package

LE58083ABGCT Applications
There are a lot of Microsemi Corporation LE58083ABGCT Telecom applications.

T1/E1/J1 Multiplexer and Channel Banks
E1 Multiplexer
CSU/DSU E1 Interface
Digital Access Cross-connect System (DACs)
NIU
Cable Modem
Multichannel DS1 Test Equipment
Cross Connects
Hybrid fiber coax (HFC)
Fiber to the Home (FTTH)