IS64LF12836EC-7.5B3LA3

ISSI, Integrated Silicon Solution Inc IS64LF12836EC-7.5B3LA3

Part Number:
IS64LF12836EC-7.5B3LA3
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Ventron No:
3235436-IS64LF12836EC-7.5B3LA3
Description:
IC SRAM 4.5MBIT 7.5NS 165BGA
ECAD Model:
Datasheet:
IS64LF12836EC-7.5B3LA3

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Specifications
ISSI, Integrated Silicon Solution Inc IS64LF12836EC-7.5B3LA3 technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS64LF12836EC-7.5B3LA3.
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    165-TBGA
  • Surface Mount
    YES
  • Number of Pins
    165
  • Operating Temperature
    -40°C~125°C TA
  • Packaging
    Tray
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    165
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Technology
    SRAM - Synchronous, SDR
  • Voltage - Supply
    3.135V~3.465V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    10
  • Pin Count
    165
  • Qualification Status
    Not Qualified
  • Power Supplies
    2.5/3.33.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Memory Size
    4.5Mb 128K x 36
  • Number of Ports
    4
  • Nominal Supply Current
    185mA
  • Memory Type
    Volatile
  • Clock Frequency
    117MHz
  • Access Time
    7.5ns
  • Memory Format
    SRAM
  • Memory Interface
    Parallel
  • Organization
    128KX36
  • Output Characteristics
    3-STATE
  • Memory Width
    36
  • Address Bus Width
    17b
  • Density
    4 Mb
  • Standby Current-Max
    0.1A
  • Screening Level
    AEC-Q100
  • I/O Type
    COMMON
  • Sync/Async
    Synchronous
  • Word Size
    36b
  • Height Seated (Max)
    1.2mm
  • Length
    15mm
  • RoHS Status
    ROHS3 Compliant
Description
IS64LF12836EC-7.5B3LA3 Overview
Moisture Sensitivity Level (MSL) is a measure of how sensitive electronic components are to moisture and how long they can be exposed to it before their performance is affected. In this case, the MSL is 3, which means that the component can withstand exposure to moisture for up to 168 hours. The Terminal Finish, which is the material used to coat the component's terminals, is Tin/Silver/Copper (Sn/Ag/Cu). The Technology used for this component is SRAM - Synchronous, SDR, which is a type of memory that can operate at high speeds. The Peak Reflow Temperature (Cel) is 260, indicating the maximum temperature at which the component can be soldered. The Pin Count is 165, referring to the number of pins on the component. The Qualification Status is Not Qualified, meaning that the component has not yet undergone testing to ensure its reliability. The Memory Size is 4.5Mb 128K x 36, indicating the total storage capacity of the component. The Density is 4 Mb, which is the amount of data that can be stored per unit area. The Standby Current-Max is 0.1A, which is the maximum amount of current that the component will consume when in standby mode. Finally, the Length of the component is 15mm, providing a measurement of its physical size. All of these specifications are important factors to consider when using this component in electronic devices.

IS64LF12836EC-7.5B3LA3 Features
Package / Case: 165-TBGA
165 Pins
I/O Type: COMMON


IS64LF12836EC-7.5B3LA3 Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS64LF12836EC-7.5B3LA3 Memory applications.


servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
IS64LF12836EC-7.5B3LA3 More Descriptions
4Mb,Flowthrough,Sync with ECC,128K x 36,7.5ns,3.3v I/O,165 Ball BGA, Leadfree, Automotive temp
SRAM Chip Sync Quad 3.3V 4M-bit 128K x 36 7.5ns Automotive 165-Pin BGA
3.135V~3.465V 4.5Mbit TFBGA-165(13x15) SRAM ROHS
SRAM 4Mb, 3.3v, 7.5ns 128K x 36 Sync SRAM
IC SRAM 4.5M PARALLEL 165TFBGA
Product Comparison
The three parts on the right have similar specifications to IS64LF12836EC-7.5B3LA3.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Power Supplies
    Supply Voltage-Min (Vsup)
    Memory Size
    Number of Ports
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Organization
    Output Characteristics
    Memory Width
    Address Bus Width
    Density
    Standby Current-Max
    Screening Level
    I/O Type
    Sync/Async
    Word Size
    Height Seated (Max)
    Length
    RoHS Status
    Supply Voltage-Max (Vsup)
    Write Cycle Time - Word, Page
    Memory Density
    Access Time (Max)
    Width
    Additional Feature
    HTS Code
    Supply Current-Max
    Standby Voltage-Min
    View Compare
  • IS64LF12836EC-7.5B3LA3
    IS64LF12836EC-7.5B3LA3
    12 Weeks
    Surface Mount
    165-TBGA
    YES
    165
    -40°C~125°C TA
    Tray
    e1
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    Tin/Silver/Copper (Sn/Ag/Cu)
    SRAM - Synchronous, SDR
    3.135V~3.465V
    BOTTOM
    260
    1
    3.3V
    1mm
    10
    165
    Not Qualified
    2.5/3.33.3V
    3.135V
    4.5Mb 128K x 36
    4
    185mA
    Volatile
    117MHz
    7.5ns
    SRAM
    Parallel
    128KX36
    3-STATE
    36
    17b
    4 Mb
    0.1A
    AEC-Q100
    COMMON
    Synchronous
    36b
    1.2mm
    15mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS64WV2568EDBLL-10BLA3-TR
    10 Weeks
    Surface Mount
    36-TFBGA
    YES
    36
    -40°C~125°C TA
    Tape & Reel (TR)
    -
    Active
    3 (168 Hours)
    36
    -
    -
    SRAM - Asynchronous
    2.4V~3.6V
    BOTTOM
    NOT SPECIFIED
    1
    3V
    0.75mm
    NOT SPECIFIED
    -
    -
    -
    2.4V
    2Mb 256K x 8
    -
    -
    Volatile
    -
    -
    SRAM
    Parallel
    256KX8
    -
    8
    -
    -
    -
    -
    -
    -
    -
    1.2mm
    8mm
    ROHS3 Compliant
    3.6V
    10ns
    2097152 bit
    10 ns
    6mm
    -
    -
    -
    -
  • IS64WV2568EDBLL-10CTLA3
    10 Weeks
    Surface Mount
    44-TSOP (0.400, 10.16mm Width)
    YES
    44
    -40°C~125°C TA
    Tray
    e3
    Active
    3 (168 Hours)
    44
    3A991.B.2.A
    TIN
    SRAM - Asynchronous
    2.4V~3.6V
    DUAL
    260
    1
    3.3V
    0.8mm
    10
    44
    Not Qualified
    2.5/3.3V
    2.4V
    2Mb 256K x 8
    -
    -
    Volatile
    -
    -
    SRAM
    Parallel
    256KX8
    3-STATE
    8
    -
    -
    0.015A
    AEC-Q100
    COMMON
    -
    -
    1.2mm
    18.41mm
    ROHS3 Compliant
    3.6V
    10ns
    2097152 bit
    10 ns
    10.16mm
    PIPELINED ARCHITECTURE
    8542.32.00.41
    0.05mA
    2V
  • IS64WV2568EDBLL-10BLA3
    10 Weeks
    Surface Mount
    36-TFBGA
    YES
    36
    -40°C~125°C TA
    Tray
    e1
    Active
    3 (168 Hours)
    36
    3A991.B.2.A
    TIN SILVER COPPER
    SRAM - Asynchronous
    2.4V~3.6V
    BOTTOM
    260
    1
    3.3V
    0.75mm
    10
    36
    Not Qualified
    2.5/3.3V
    2.4V
    2Mb 256K x 8
    -
    -
    Volatile
    -
    -
    SRAM
    Parallel
    256KX8
    3-STATE
    8
    -
    -
    0.015A
    AEC-Q100
    COMMON
    -
    -
    1.2mm
    8mm
    ROHS3 Compliant
    3.6V
    10ns
    2097152 bit
    10 ns
    6mm
    PIPELINED ARCHITECTURE
    8542.32.00.41
    0.05mA
    2V
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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