ISSI, Integrated Silicon Solution Inc IS64LF12836EC-7.5B3LA3
- Part Number:
- IS64LF12836EC-7.5B3LA3
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 3235436-IS64LF12836EC-7.5B3LA3
- Description:
- IC SRAM 4.5MBIT 7.5NS 165BGA
- Datasheet:
- IS64LF12836EC-7.5B3LA3
ISSI, Integrated Silicon Solution Inc IS64LF12836EC-7.5B3LA3 technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS64LF12836EC-7.5B3LA3.
- Factory Lead Time12 Weeks
- Mounting TypeSurface Mount
- Package / Case165-TBGA
- Surface MountYES
- Number of Pins165
- Operating Temperature-40°C~125°C TA
- PackagingTray
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations165
- ECCN Code3A991.B.2.A
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- TechnologySRAM - Synchronous, SDR
- Voltage - Supply3.135V~3.465V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)10
- Pin Count165
- Qualification StatusNot Qualified
- Power Supplies2.5/3.33.3V
- Supply Voltage-Min (Vsup)3.135V
- Memory Size4.5Mb 128K x 36
- Number of Ports4
- Nominal Supply Current185mA
- Memory TypeVolatile
- Clock Frequency117MHz
- Access Time7.5ns
- Memory FormatSRAM
- Memory InterfaceParallel
- Organization128KX36
- Output Characteristics3-STATE
- Memory Width36
- Address Bus Width17b
- Density4 Mb
- Standby Current-Max0.1A
- Screening LevelAEC-Q100
- I/O TypeCOMMON
- Sync/AsyncSynchronous
- Word Size36b
- Height Seated (Max)1.2mm
- Length15mm
- RoHS StatusROHS3 Compliant
IS64LF12836EC-7.5B3LA3 Overview
Moisture Sensitivity Level (MSL) is a measure of how sensitive electronic components are to moisture and how long they can be exposed to it before their performance is affected. In this case, the MSL is 3, which means that the component can withstand exposure to moisture for up to 168 hours. The Terminal Finish, which is the material used to coat the component's terminals, is Tin/Silver/Copper (Sn/Ag/Cu). The Technology used for this component is SRAM - Synchronous, SDR, which is a type of memory that can operate at high speeds. The Peak Reflow Temperature (Cel) is 260, indicating the maximum temperature at which the component can be soldered. The Pin Count is 165, referring to the number of pins on the component. The Qualification Status is Not Qualified, meaning that the component has not yet undergone testing to ensure its reliability. The Memory Size is 4.5Mb 128K x 36, indicating the total storage capacity of the component. The Density is 4 Mb, which is the amount of data that can be stored per unit area. The Standby Current-Max is 0.1A, which is the maximum amount of current that the component will consume when in standby mode. Finally, the Length of the component is 15mm, providing a measurement of its physical size. All of these specifications are important factors to consider when using this component in electronic devices.
IS64LF12836EC-7.5B3LA3 Features
Package / Case: 165-TBGA
165 Pins
I/O Type: COMMON
IS64LF12836EC-7.5B3LA3 Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS64LF12836EC-7.5B3LA3 Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
Moisture Sensitivity Level (MSL) is a measure of how sensitive electronic components are to moisture and how long they can be exposed to it before their performance is affected. In this case, the MSL is 3, which means that the component can withstand exposure to moisture for up to 168 hours. The Terminal Finish, which is the material used to coat the component's terminals, is Tin/Silver/Copper (Sn/Ag/Cu). The Technology used for this component is SRAM - Synchronous, SDR, which is a type of memory that can operate at high speeds. The Peak Reflow Temperature (Cel) is 260, indicating the maximum temperature at which the component can be soldered. The Pin Count is 165, referring to the number of pins on the component. The Qualification Status is Not Qualified, meaning that the component has not yet undergone testing to ensure its reliability. The Memory Size is 4.5Mb 128K x 36, indicating the total storage capacity of the component. The Density is 4 Mb, which is the amount of data that can be stored per unit area. The Standby Current-Max is 0.1A, which is the maximum amount of current that the component will consume when in standby mode. Finally, the Length of the component is 15mm, providing a measurement of its physical size. All of these specifications are important factors to consider when using this component in electronic devices.
IS64LF12836EC-7.5B3LA3 Features
Package / Case: 165-TBGA
165 Pins
I/O Type: COMMON
IS64LF12836EC-7.5B3LA3 Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS64LF12836EC-7.5B3LA3 Memory applications.
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
IS64LF12836EC-7.5B3LA3 More Descriptions
4Mb,Flowthrough,Sync with ECC,128K x 36,7.5ns,3.3v I/O,165 Ball BGA, Leadfree, Automotive temp
SRAM Chip Sync Quad 3.3V 4M-bit 128K x 36 7.5ns Automotive 165-Pin BGA
3.135V~3.465V 4.5Mbit TFBGA-165(13x15) SRAM ROHS
SRAM 4Mb, 3.3v, 7.5ns 128K x 36 Sync SRAM
IC SRAM 4.5M PARALLEL 165TFBGA
SRAM Chip Sync Quad 3.3V 4M-bit 128K x 36 7.5ns Automotive 165-Pin BGA
3.135V~3.465V 4.5Mbit TFBGA-165(13x15) SRAM ROHS
SRAM 4Mb, 3.3v, 7.5ns 128K x 36 Sync SRAM
IC SRAM 4.5M PARALLEL 165TFBGA
The three parts on the right have similar specifications to IS64LF12836EC-7.5B3LA3.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Pin CountQualification StatusPower SuppliesSupply Voltage-Min (Vsup)Memory SizeNumber of PortsNominal Supply CurrentMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceOrganizationOutput CharacteristicsMemory WidthAddress Bus WidthDensityStandby Current-MaxScreening LevelI/O TypeSync/AsyncWord SizeHeight Seated (Max)LengthRoHS StatusSupply Voltage-Max (Vsup)Write Cycle Time - Word, PageMemory DensityAccess Time (Max)WidthAdditional FeatureHTS CodeSupply Current-MaxStandby Voltage-MinView Compare
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IS64LF12836EC-7.5B3LA312 WeeksSurface Mount165-TBGAYES165-40°C~125°C TATraye1Active3 (168 Hours)1653A991.B.2.ATin/Silver/Copper (Sn/Ag/Cu)SRAM - Synchronous, SDR3.135V~3.465VBOTTOM26013.3V1mm10165Not Qualified2.5/3.33.3V3.135V4.5Mb 128K x 364185mAVolatile117MHz7.5nsSRAMParallel128KX363-STATE3617b4 Mb0.1AAEC-Q100COMMONSynchronous36b1.2mm15mmROHS3 Compliant----------
-
10 WeeksSurface Mount36-TFBGAYES36-40°C~125°C TATape & Reel (TR)-Active3 (168 Hours)36--SRAM - Asynchronous2.4V~3.6VBOTTOMNOT SPECIFIED13V0.75mmNOT SPECIFIED---2.4V2Mb 256K x 8--Volatile--SRAMParallel256KX8-8-------1.2mm8mmROHS3 Compliant3.6V10ns2097152 bit10 ns6mm----
-
10 WeeksSurface Mount44-TSOP (0.400, 10.16mm Width)YES44-40°C~125°C TATraye3Active3 (168 Hours)443A991.B.2.ATINSRAM - Asynchronous2.4V~3.6VDUAL26013.3V0.8mm1044Not Qualified2.5/3.3V2.4V2Mb 256K x 8--Volatile--SRAMParallel256KX83-STATE8--0.015AAEC-Q100COMMON--1.2mm18.41mmROHS3 Compliant3.6V10ns2097152 bit10 ns10.16mmPIPELINED ARCHITECTURE8542.32.00.410.05mA2V
-
10 WeeksSurface Mount36-TFBGAYES36-40°C~125°C TATraye1Active3 (168 Hours)363A991.B.2.ATIN SILVER COPPERSRAM - Asynchronous2.4V~3.6VBOTTOM26013.3V0.75mm1036Not Qualified2.5/3.3V2.4V2Mb 256K x 8--Volatile--SRAMParallel256KX83-STATE8--0.015AAEC-Q100COMMON--1.2mm8mmROHS3 Compliant3.6V10ns2097152 bit10 ns6mmPIPELINED ARCHITECTURE8542.32.00.410.05mA2V
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