IS61VPS204836B-250B3LI
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ISSI, Integrated Silicon Solution Inc IS61VPS204836B-250B3LI

Part Number:
IS61VPS204836B-250B3LI
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Ventron No:
3723664-IS61VPS204836B-250B3LI
Description:
IC SRAM 72MBIT 250MHZ 165BGA
ECAD Model:
Datasheet:
IS61VPS204836B-250B3LI
Payment:
Payment
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Specifications
ISSI, Integrated Silicon Solution Inc IS61VPS204836B-250B3LI technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61VPS204836B-250B3LI.
  • Factory Lead Time
    12 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    165-TBGA
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    165
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tray
  • JESD-609 Code
    e1
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    165
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.32.00.41
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    SRAM - Synchronous, SDR
  • Voltage - Supply
    2.375V~2.625V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    2.5V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    10
  • Pin Count
    165
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    2.625V
  • Power Supplies
    2.5V
  • Supply Voltage-Min (Vsup)
    2.375V
  • Memory Size
    72Mb 2M x 36
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Volatile
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    250MHz
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    2.8ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    SRAM
  • Memory Interface
    Parallel
  • Organization
    2MX36
  • Output Characteristics
    3-STATE
  • Memory Width
    36
  • Memory Density
    75497472 bit
  • I/O Type
    COMMON
  • Standby Voltage-Min
    2.38V
  • Height Seated (Max)
    1.2mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    15mm
  • Width
    13mm
  • RoHS Status
    ROHS3 Compliant
Description
IS61VPS204836B-250B3LI Overview
The product has 165 pins and can operate in a temperature range of -40°C to 85°C. Its part status is active and the maximum time at peak reflow temperature is 10 seconds. The maximum supply voltage is 2.625V and the minimum supply voltage is 2.375V. It has a memory size of 72Mb, specifically 2M x 36, and is a volatile type of memory. The clock frequency is 250MHz and the width of the product is 13mm.

IS61VPS204836B-250B3LI Features
Package / Case: 165-TBGA
165 Pins
I/O Type: COMMON


IS61VPS204836B-250B3LI Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61VPS204836B-250B3LI Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
IS61VPS204836B-250B3LI More Descriptions
SRAM Chip Sync Quad 2.5V 72M-Bit 2M x 36 165-Pin TFBGA
Cache SRAM, 2MX36, 2.6ns, CMOS, PBGA165
IC SRAM 72MBIT PARALLEL 165TFBGA
72Mb,pipeline,sync,2Mb X 36,250Mhz,2.5V I/O,165 Ball Bga,rohs |Integrated Silicon Solution (Issi) IS61VPS204836B-250B3LI
Product Comparison
The three parts on the right have similar specifications to IS61VPS204836B-250B3LI.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Organization
    Output Characteristics
    Memory Width
    Memory Density
    I/O Type
    Standby Voltage-Min
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Additional Feature
    Access Time (Max)
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Number of Ports
    Nominal Supply Current
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Radiation Hardening
    Reach Compliance Code
    JESD-30 Code
    View Compare
  • IS61VPS204836B-250B3LI
    IS61VPS204836B-250B3LI
    12 Weeks
    Surface Mount
    165-TBGA
    YES
    165
    -40°C~85°C TA
    Tray
    e1
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    Tin/Silver/Copper (Sn/Ag/Cu)
    8542.32.00.41
    SRAM - Synchronous, SDR
    2.375V~2.625V
    BOTTOM
    260
    1
    2.5V
    1mm
    10
    165
    Not Qualified
    2.625V
    2.5V
    2.375V
    72Mb 2M x 36
    Volatile
    250MHz
    2.8ns
    SRAM
    Parallel
    2MX36
    3-STATE
    36
    75497472 bit
    COMMON
    2.38V
    1.2mm
    15mm
    13mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61DDB24M18A-300M3L
    12 Weeks
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    -
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    -
    8542.32.00.41
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    -
    1.89V
    -
    1.71V
    72Mb 4M x 18
    Volatile
    300MHz
    -
    SRAM
    Parallel
    4MX18
    -
    18
    75497472 bit
    -
    -
    1.4mm
    17mm
    15mm
    ROHS3 Compliant
    PIPELINED ARCHITECTURE
    0.45 ns
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61C25616AL-10KLI-TR
    8 Weeks
    Surface Mount
    44-BSOJ (0.400, 10.16mm Width)
    -
    44
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    Active
    2 (1 Year)
    -
    -
    -
    -
    SRAM - Asynchronous
    4.5V~5.5V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    4Mb 256K x 16
    Volatile
    -
    10ns
    SRAM
    Parallel
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    44-SOJ
    85°C
    -40°C
    5V
    Parallel
    5.5V
    4.5V
    1
    50mA
    10ns
    18b
    4 Mb
    Asynchronous
    16b
    No
    -
    -
  • IS61DDB44M18A-300M3I
    -
    Surface Mount
    165-LBGA
    YES
    -
    -40°C~85°C TA
    Tray
    -
    Last Time Buy
    3 (168 Hours)
    165
    3A991.B.2.A
    -
    8542.32.00.41
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    -
    1
    1.8V
    1mm
    -
    165
    -
    1.89V
    -
    1.71V
    72Mb 4M x 18
    Volatile
    300MHz
    1.48ns
    SRAM
    Parallel
    4MX18
    -
    18
    75497472 bit
    -
    -
    1.4mm
    17mm
    15mm
    -
    PIPELINED ARCHITECTURE
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    compliant
    R-PBGA-B165
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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