IS61NLP25636A-200B3I

ISSI, Integrated Silicon Solution Inc IS61NLP25636A-200B3I

Part Number:
IS61NLP25636A-200B3I
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Ventron No:
3236148-IS61NLP25636A-200B3I
Description:
IC SRAM 9MBIT 200MHZ 165BGA
ECAD Model:
Datasheet:
IS61N(LP,VP)yyyyyA

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Specifications
ISSI, Integrated Silicon Solution Inc IS61NLP25636A-200B3I technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61NLP25636A-200B3I.
  • Mounting Type
    Surface Mount
  • Package / Case
    165-TFBGA
  • Surface Mount
    YES
  • Number of Pins
    165
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Last Time Buy
  • Moisture Sensitivity Level (MSL)
    2 (1 Year)
  • Number of Terminations
    165
  • ECCN Code
    3A991.B.2.A
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Additional Feature
    PIPELINED ARCHITECTURE
  • Technology
    SRAM - Synchronous, SDR
  • Voltage - Supply
    3.135V~3.465V
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1mm
  • Pin Count
    165
  • Operating Supply Voltage
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Memory Size
    9Mb 256K x 36
  • Number of Ports
    4
  • Memory Type
    Volatile
  • Clock Frequency
    200MHz
  • Supply Current-Max
    0.28mA
  • Access Time
    3.1ns
  • Memory Format
    SRAM
  • Memory Interface
    Parallel
  • Organization
    256KX36
  • Output Characteristics
    3-STATE
  • Memory Width
    36
  • Address Bus Width
    18b
  • Density
    9 Mb
  • Standby Current-Max
    0.05A
  • I/O Type
    COMMON
  • Height Seated (Max)
    1.2mm
  • Length
    15mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
IS61NLP25636A-200B3I Overview
The mounting type for this memory is surface mount, meaning that it can be easily attached to a circuit board without the need for through-hole soldering. It has a moisture sensitivity level (MSL) of 2, indicating that it can withstand exposure to moderate levels of moisture for up to one year. The minimum supply voltage (Vsup) required for this memory is 3.135V, ensuring reliable and stable performance. With a memory size of 9Mb and a volatile memory type, this device is capable of storing and retrieving large amounts of data quickly. The maximum supply current is 0.28mA, making it energy efficient. The address bus width is 18b, allowing for efficient data transfer. This memory has a maximum seated height of 1.2mm and a length of 15mm, making it compact and suitable for various applications. It is also important to note that this product is non-RoHS compliant.

IS61NLP25636A-200B3I Features
Package / Case: 165-TFBGA
165 Pins
Operating Supply Voltage:3.3V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON


IS61NLP25636A-200B3I Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61NLP25636A-200B3I Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
IS61NLP25636A-200B3I More Descriptions
SRAM Chip Sync Quad 3.3V 9M-Bit 256K x 36 3.1ns 165-Pin BGA
IC SRAM 9MBIT PARALLEL 165TFBGA
SRAM 8M (256Kx36) 200MHz Sync SRAM 3.3v
Product Comparison
The three parts on the right have similar specifications to IS61NLP25636A-200B3I.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Technology
    Voltage - Supply
    Terminal Position
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Pin Count
    Operating Supply Voltage
    Supply Voltage-Min (Vsup)
    Memory Size
    Number of Ports
    Memory Type
    Clock Frequency
    Supply Current-Max
    Access Time
    Memory Format
    Memory Interface
    Organization
    Output Characteristics
    Memory Width
    Address Bus Width
    Density
    Standby Current-Max
    I/O Type
    Height Seated (Max)
    Length
    Radiation Hardening
    RoHS Status
    Factory Lead Time
    HTS Code
    Peak Reflow Temperature (Cel)
    Time@Peak Reflow Temperature-Max (s)
    Supply Voltage-Max (Vsup)
    Memory Density
    Access Time (Max)
    Width
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Nominal Supply Current
    Write Cycle Time - Word, Page
    Sync/Async
    Word Size
    View Compare
  • IS61NLP25636A-200B3I
    IS61NLP25636A-200B3I
    Surface Mount
    165-TFBGA
    YES
    165
    -40°C~85°C TA
    Tray
    e0
    no
    Last Time Buy
    2 (1 Year)
    165
    3A991.B.2.A
    Tin/Lead (Sn/Pb)
    PIPELINED ARCHITECTURE
    SRAM - Synchronous, SDR
    3.135V~3.465V
    BOTTOM
    1
    3.3V
    1mm
    165
    3.3V
    3.135V
    9Mb 256K x 36
    4
    Volatile
    200MHz
    0.28mA
    3.1ns
    SRAM
    Parallel
    256KX36
    3-STATE
    36
    18b
    9 Mb
    0.05A
    COMMON
    1.2mm
    15mm
    No
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61DDB24M18A-250M3L
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    -
    -
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    -
    PIPELINED ARCHITECTURE
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    1
    1.8V
    1mm
    165
    -
    1.71V
    72Mb 4M x 18
    -
    Volatile
    250MHz
    -
    -
    SRAM
    Parallel
    4MX18
    -
    18
    -
    -
    -
    -
    1.4mm
    17mm
    -
    ROHS3 Compliant
    12 Weeks
    8542.32.00.41
    NOT SPECIFIED
    NOT SPECIFIED
    1.89V
    75497472 bit
    0.45 ns
    15mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61DDB24M18A-300M3L
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    -
    -
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    -
    PIPELINED ARCHITECTURE
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    1
    1.8V
    1mm
    165
    -
    1.71V
    72Mb 4M x 18
    -
    Volatile
    300MHz
    -
    -
    SRAM
    Parallel
    4MX18
    -
    18
    -
    -
    -
    -
    1.4mm
    17mm
    -
    ROHS3 Compliant
    12 Weeks
    8542.32.00.41
    NOT SPECIFIED
    NOT SPECIFIED
    1.89V
    75497472 bit
    0.45 ns
    15mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61C25616AL-10KLI-TR
    Surface Mount
    44-BSOJ (0.400, 10.16mm Width)
    -
    44
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    -
    Active
    2 (1 Year)
    -
    -
    -
    -
    SRAM - Asynchronous
    4.5V~5.5V
    -
    -
    -
    -
    -
    5V
    -
    4Mb 256K x 16
    1
    Volatile
    -
    -
    10ns
    SRAM
    Parallel
    -
    -
    -
    18b
    4 Mb
    -
    -
    -
    -
    No
    ROHS3 Compliant
    8 Weeks
    -
    -
    -
    -
    -
    -
    -
    44-SOJ
    85°C
    -40°C
    Parallel
    5.5V
    4.5V
    50mA
    10ns
    Asynchronous
    16b
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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