ISSI, Integrated Silicon Solution Inc IS61DDPB22M18A-400M3L
- Part Number:
- IS61DDPB22M18A-400M3L
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 3237120-IS61DDPB22M18A-400M3L
- Description:
- IC SDRAM 36MBIT 400MHZ 165BGA
- ECAD Model:
-
- Datasheet:
- IS61DDPB22M18A-400M3L
ISSI, Integrated Silicon Solution Inc IS61DDPB22M18A-400M3L technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61DDPB22M18A-400M3L.
- Factory Lead Time12 Weeks
- Mounting TypeSurface Mount
- Package / Case165-LBGA
- Surface MountYES
- Number of Pins165
- Operating Temperature0°C~70°C TA
- PackagingTray
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations165
- ECCN Code3A991.B.2.A
- Terminal FinishTIN SILVER COPPER
- Additional FeaturePIPELINED ARCHITECTURE
- HTS Code8542.32.00.41
- TechnologySRAM - Synchronous, DDR IIP
- Voltage - Supply1.71V~1.89V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch1mm
- Time@Peak Reflow Temperature-Max (s)40
- Pin Count165
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)1.89V
- Power Supplies1.8V
- Supply Voltage-Min (Vsup)1.71V
- Memory Size36Mb 2M x 18
- Memory TypeVolatile
- Clock Frequency400MHz
- Supply Current-Max0.75mA
- Memory FormatSRAM
- Memory InterfaceParallel
- Organization2MX18
- Output Characteristics3-STATE
- Memory Width18
- Standby Current-Max0.32A
- Memory Density37748736 bit
- Access Time (Max)0.45 ns
- I/O TypeCOMMON
- Standby Voltage-Min1.7V
- Height Seated (Max)1.4mm
- Length17mm
- Width15mm
- RoHS StatusROHS3 Compliant
IS61DDPB22M18A-400M3L Overview
The package or case for this particular electronic component is a 165-LBGA, which stands for Land Grid Array. It is a type of surface mount packaging that has an array of pins on the bottom of the package. The packaging comes in the form of a tray, which is a convenient way to store and transport the component. The terminal finish, which is the coating on the pins, is TIN SILVER COPPER, providing a durable and corrosion-resistant surface. The terminal position is located at the bottom of the package for easy connection to a circuit board. This component has 1 function and requires a supply voltage of 1.8V. The memory size is 36Mb, with a 2M x 18 configuration, meaning it has 2 million addressable locations and each location can store 18 bits of data. The memory width is also 18, indicating the number of bits that can be accessed at once. The length of the package is 17mm and the width is 15mm, making it a compact and space-saving option for electronic designs.
IS61DDPB22M18A-400M3L Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
IS61DDPB22M18A-400M3L Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61DDPB22M18A-400M3L Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The package or case for this particular electronic component is a 165-LBGA, which stands for Land Grid Array. It is a type of surface mount packaging that has an array of pins on the bottom of the package. The packaging comes in the form of a tray, which is a convenient way to store and transport the component. The terminal finish, which is the coating on the pins, is TIN SILVER COPPER, providing a durable and corrosion-resistant surface. The terminal position is located at the bottom of the package for easy connection to a circuit board. This component has 1 function and requires a supply voltage of 1.8V. The memory size is 36Mb, with a 2M x 18 configuration, meaning it has 2 million addressable locations and each location can store 18 bits of data. The memory width is also 18, indicating the number of bits that can be accessed at once. The length of the package is 17mm and the width is 15mm, making it a compact and space-saving option for electronic designs.
IS61DDPB22M18A-400M3L Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: COMMON
IS61DDPB22M18A-400M3L Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61DDPB22M18A-400M3L Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
IS61DDPB22M18A-400M3L More Descriptions
SRAM Chip Sync Single 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin LFBGA
1.71V~1.89V 36Mbit FBGA-165(15x17) SRAM ROHS
IC SRAM 36MBIT PARALLEL 165LFBGA
SRAM 36Mb 400Mhz 2Mx18 DDR IIP Sync SRAM
36Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 2M X 18, 2.5 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61DDPB22M18A-400M3L
1.71V~1.89V 36Mbit FBGA-165(15x17) SRAM ROHS
IC SRAM 36MBIT PARALLEL 165LFBGA
SRAM 36Mb 400Mhz 2Mx18 DDR IIP Sync SRAM
36Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 2M X 18, 2.5 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61DDPB22M18A-400M3L
The three parts on the right have similar specifications to IS61DDPB22M18A-400M3L.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Pin CountQualification StatusSupply Voltage-Max (Vsup)Power SuppliesSupply Voltage-Min (Vsup)Memory SizeMemory TypeClock FrequencySupply Current-MaxMemory FormatMemory InterfaceOrganizationOutput CharacteristicsMemory WidthStandby Current-MaxMemory DensityAccess Time (Max)I/O TypeStandby Voltage-MinHeight Seated (Max)LengthWidthRoHS StatusReach Compliance CodeJESD-30 CodeAccess TimeView Compare
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IS61DDPB22M18A-400M3L12 WeeksSurface Mount165-LBGAYES1650°C~70°C TATraye1yesActive3 (168 Hours)1653A991.B.2.ATIN SILVER COPPERPIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, DDR IIP1.71V~1.89VBOTTOM26011.8V1mm40165Not Qualified1.89V1.8V1.71V36Mb 2M x 18Volatile400MHz0.75mASRAMParallel2MX183-STATE180.32A37748736 bit0.45 nsCOMMON1.7V1.4mm17mm15mmROHS3 Compliant---- -
12 WeeksSurface Mount165-LBGAYES1650°C~70°C TATray--Active3 (168 Hours)1653A991.B.2.A-PIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, DDR II1.71V~1.89VBOTTOMNOT SPECIFIED11.8V1mmNOT SPECIFIED165-1.89V-1.71V72Mb 4M x 18Volatile250MHz-SRAMParallel4MX18-18-75497472 bit0.45 ns--1.4mm17mm15mmROHS3 Compliant---
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12 WeeksSurface Mount165-LBGAYES1650°C~70°C TATray--Active3 (168 Hours)1653A991.B.2.A-PIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, DDR II1.71V~1.89VBOTTOMNOT SPECIFIED11.8V1mmNOT SPECIFIED165-1.89V-1.71V72Mb 4M x 18Volatile300MHz-SRAMParallel4MX18-18-75497472 bit0.45 ns--1.4mm17mm15mmROHS3 Compliant---
-
-Surface Mount165-LBGAYES--40°C~85°C TATray--Last Time Buy3 (168 Hours)1653A991.B.2.A-PIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, DDR II1.71V~1.89VBOTTOM-11.8V1mm-165-1.89V-1.71V72Mb 4M x 18Volatile300MHz-SRAMParallel4MX18-18-75497472 bit---1.4mm17mm15mm-compliantR-PBGA-B1651.48ns
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ISSI, Integrated Silicon Solution Inc
5V V Surface Mount 32 Pin Memory IC 4 Mb kb 20.75mm mm 15mA mA 8b b
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