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IS61DDB22M36A-300M3L

ISSI, Integrated Silicon Solution Inc IS61DDB22M36A-300M3L

Part Number:
IS61DDB22M36A-300M3L
Manufacturer:
ISSI, Integrated Silicon Solution Inc
Ventron No:
3237435-IS61DDB22M36A-300M3L
Description:
IC SDRAM 72MBIT 300MHZ 165BGA
ECAD Model:
Datasheet:
IS61DDB22M36A-300M3L

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Specifications
ISSI, Integrated Silicon Solution Inc IS61DDB22M36A-300M3L technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS61DDB22M36A-300M3L.
  • Factory Lead Time
    12 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    165-LBGA
  • Surface Mount
    YES
  • Number of Pins
    165
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    165
  • ECCN Code
    3A991.B.2.A
  • Additional Feature
    PIPELINED ARCHITECTURE
  • HTS Code
    8542.32.00.41
  • Technology
    SRAM - Synchronous, DDR II
  • Voltage - Supply
    1.71V~1.89V
  • Terminal Position
    BOTTOM
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Pin Count
    165
  • Supply Voltage-Max (Vsup)
    1.89V
  • Supply Voltage-Min (Vsup)
    1.71V
  • Memory Size
    72Mb 2M x 36
  • Memory Type
    Volatile
  • Clock Frequency
    300MHz
  • Memory Format
    SRAM
  • Memory Interface
    Parallel
  • Organization
    2MX36
  • Memory Width
    36
  • Memory Density
    75497472 bit
  • Access Time (Max)
    0.45 ns
  • Height Seated (Max)
    1.4mm
  • Length
    17mm
  • Width
    15mm
  • RoHS Status
    ROHS3 Compliant
Description
IS61DDB22M36A-300M3L Overview
The Moisture Sensitivity Level (MSL) of this specific electronic component is 3, with a time limit of 168 hours. This means that it can withstand moderate levels of moisture for a period of 168 hours before it becomes sensitive. With a total of 165 terminations, this component is designed to handle a variety of functions with ease. Its technology, SRAM - Synchronous, DDR II, allows for high-speed data transfer and efficient performance. The voltage supply range of 1.71V to 1.89V ensures stable and reliable operation. With a clock frequency of 300MHz, this component can handle complex tasks efficiently. Its organization of 2MX36 allows for a large amount of data storage. Measuring 17mm in length and 15mm in width, this component is compact and space-saving. Additionally, it is also ROHS3 compliant, making it environmentally friendly.

IS61DDB22M36A-300M3L Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE


IS61DDB22M36A-300M3L Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS61DDB22M36A-300M3L Memory applications.


Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
IS61DDB22M36A-300M3L More Descriptions
SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin LFBGA
1.71V~1.89V 72Mbit FBGA-165(15x17) SRAM ROHS
IC SRAM 72MBIT PARALLEL 165LFBGA
SRAM 72Mb 300Mhz 2Mx36 DDR-II Sync SRAM
72Mb, Ddr Ii (Burst Of 2) Cio, Sync Sram, 2M X 36, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61DDB22M36A-300M3L
Product Comparison
The three parts on the right have similar specifications to IS61DDB22M36A-300M3L.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Additional Feature
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Pin Count
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Memory Size
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Memory Density
    Access Time (Max)
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Number of Ports
    Nominal Supply Current
    Access Time
    Write Cycle Time - Word, Page
    Address Bus Width
    Density
    Sync/Async
    Word Size
    Radiation Hardening
    View Compare
  • IS61DDB22M36A-300M3L
    IS61DDB22M36A-300M3L
    ISSI, Integrated Silicon Solution Inc
    12 Weeks
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    72Mb 2M x 36
    Volatile
    300MHz
    SRAM
    Parallel
    2MX36
    36
    75497472 bit
    0.45 ns
    1.4mm
    17mm
    15mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IS61DDB24M18A-250M3L
    IS61DDB24M18A-250M3L
    ISSI, Integrated Silicon Solution Inc
    12 Weeks
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    72Mb 4M x 18
    Volatile
    250MHz
    SRAM
    Parallel
    4MX18
    18
    75497472 bit
    0.45 ns
    1.4mm
    17mm
    15mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    IS61DDB22M36A-300M3L vs IS61DDB24M18A-250M3L
  • IS61DDB24M18A-300M3L
    IS61DDB24M18A-300M3L
    ISSI, Integrated Silicon Solution Inc
    12 Weeks
    Surface Mount
    165-LBGA
    YES
    165
    0°C~70°C TA
    Tray
    Active
    3 (168 Hours)
    165
    3A991.B.2.A
    PIPELINED ARCHITECTURE
    8542.32.00.41
    SRAM - Synchronous, DDR II
    1.71V~1.89V
    BOTTOM
    NOT SPECIFIED
    1
    1.8V
    1mm
    NOT SPECIFIED
    165
    1.89V
    1.71V
    72Mb 4M x 18
    Volatile
    300MHz
    SRAM
    Parallel
    4MX18
    18
    75497472 bit
    0.45 ns
    1.4mm
    17mm
    15mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    IS61DDB22M36A-300M3L vs IS61DDB24M18A-300M3L
  • IS61C25616AL-10KLI-TR
    IS61C25616AL-10KLI-TR
    ISSI, Integrated Silicon Solution Inc
    8 Weeks
    Surface Mount
    44-BSOJ (0.400, 10.16mm Width)
    -
    44
    -40°C~85°C TA
    Tape & Reel (TR)
    Active
    2 (1 Year)
    -
    -
    -
    -
    SRAM - Asynchronous
    4.5V~5.5V
    -
    -
    -
    -
    -
    -
    -
    -
    -
    4Mb 256K x 16
    Volatile
    -
    SRAM
    Parallel
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    44-SOJ
    85°C
    -40°C
    5V
    Parallel
    5.5V
    4.5V
    1
    50mA
    10ns
    10ns
    18b
    4 Mb
    Asynchronous
    16b
    No
    IS61DDB22M36A-300M3L vs IS61C25616AL-10KLI-TR
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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