ISSI, Integrated Silicon Solution Inc IS42RM32160C-75BL
- Part Number:
- IS42RM32160C-75BL
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 3245493-IS42RM32160C-75BL
- Description:
- IC SDRAM 512MBIT 133MHZ 90BGA
- Datasheet:
- IS42SM32160C, IS42RM32160C
ISSI, Integrated Silicon Solution Inc IS42RM32160C-75BL technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS42RM32160C-75BL.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case90-LFBGA
- Number of Pins90
- Operating Temperature0°C~70°C TA
- PackagingTray
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusDiscontinued
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations90
- ECCN CodeEAR99
- Terminal FinishTIN SILVER COPPER
- Additional FeatureAUTO/SELF REFRESH
- HTS Code8542.32.00.28
- TechnologySDRAM - Mobile
- Voltage - Supply2.3V~3V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage2.5V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)40
- Pin Count90
- Operating Supply Voltage2.5V
- Supply Voltage-Max (Vsup)2.7V
- Supply Voltage-Min (Vsup)2.3V
- Memory Size512Mb 16M x 32
- Number of Ports1
- Nominal Supply Current170mA
- Memory TypeVolatile
- Clock Frequency133MHz
- Access Time5.4ns
- Memory FormatDRAM
- Memory InterfaceParallel
- Data Bus Width32b
- Organization16MX32
- Output Characteristics3-STATE
- Memory Width32
- Address Bus Width15b
- Density512 Mb
- Standby Current-Max0.00004A
- I/O TypeCOMMON
- Refresh Cycles8192
- Sequential Burst Length1248FP
- Interleaved Burst Length1248
- Height Seated (Max)1.4mm
- Length13mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
IS42RM32160C-75BL Overview
The package or case of the electronic component is 90-LFBGA, which indicates that it has a 90-ball grid array and a low profile design. The JESD-609 code for this component is e1, which signifies that it has been tested and meets the industry standards for electrical and thermal performance. The Moisture Sensitivity Level (MSL) for this component is 3, meaning that it can withstand exposure to moisture for up to 168 hours without any adverse effects. The peak reflow temperature for this component is 260 degrees Celsius, indicating the maximum temperature it can withstand during the soldering process. It has 1 function, operates at a supply voltage of 2.5V, and has 1 port. The address bus width is 15 bits, and it has a refresh cycle of 8192. Additionally, it has an interleaved burst length of 1248, which refers to the number of data bits that can be transferred in a single burst. All of these specifications make this component suitable for a variety of electronic applications.
IS42RM32160C-75BL Features
Package / Case: 90-LFBGA
90 Pins
Operating Supply Voltage:2.5V
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
IS42RM32160C-75BL Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS42RM32160C-75BL Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The package or case of the electronic component is 90-LFBGA, which indicates that it has a 90-ball grid array and a low profile design. The JESD-609 code for this component is e1, which signifies that it has been tested and meets the industry standards for electrical and thermal performance. The Moisture Sensitivity Level (MSL) for this component is 3, meaning that it can withstand exposure to moisture for up to 168 hours without any adverse effects. The peak reflow temperature for this component is 260 degrees Celsius, indicating the maximum temperature it can withstand during the soldering process. It has 1 function, operates at a supply voltage of 2.5V, and has 1 port. The address bus width is 15 bits, and it has a refresh cycle of 8192. Additionally, it has an interleaved burst length of 1248, which refers to the number of data bits that can be transferred in a single burst. All of these specifications make this component suitable for a variety of electronic applications.
IS42RM32160C-75BL Features
Package / Case: 90-LFBGA
90 Pins
Operating Supply Voltage:2.5V
Additional Feature:AUTO/SELF REFRESH
I/O Type: COMMON
IS42RM32160C-75BL Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS42RM32160C-75BL Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
IS42RM32160C-75BL More Descriptions
512M, 2.5V, MOBILE SDRAM, 16MX32, 133MHZ, 90 BALL BGA (8MMX1
IC DRAM 512MBIT PARALLEL 90WBGA
OEMs, CMs ONLY (NO BROKERS)
IC DRAM 512MBIT PARALLEL 90WBGA
OEMs, CMs ONLY (NO BROKERS)
The three parts on the right have similar specifications to IS42RM32160C-75BL.
-
ImagePart NumberManufacturerMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Pin CountOperating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeNumber of PortsNominal Supply CurrentMemory TypeClock FrequencyAccess TimeMemory FormatMemory InterfaceData Bus WidthOrganizationOutput CharacteristicsMemory WidthAddress Bus WidthDensityStandby Current-MaxI/O TypeRefresh CyclesSequential Burst LengthInterleaved Burst LengthHeight Seated (Max)LengthRadiation HardeningRoHS StatusLead FreeSurface MountQualification StatusPower SuppliesOperating ModeSupply Current-MaxReach Compliance CodeMemory DensitySupplier Device PackageMax Operating TemperatureMin Operating TemperatureFrequencyInterfaceMax Supply VoltageMin Supply VoltageMax FrequencyView Compare
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IS42RM32160C-75BLSurface MountSurface Mount90-LFBGA900°C~70°C TATraye1yesDiscontinued3 (168 Hours)90EAR99TIN SILVER COPPERAUTO/SELF REFRESH8542.32.00.28SDRAM - Mobile2.3V~3VBOTTOM26012.5V0.8mm40902.5V2.7V2.3V512Mb 16M x 321170mAVolatile133MHz5.4nsDRAMParallel32b16MX323-STATE3215b512 Mb0.00004ACOMMON81921248FP12481.4mm13mmNoROHS3 CompliantLead Free----------------
-
-Surface Mount54-TFBGA54-40°C~85°C TATray--Discontinued3 (168 Hours)54--AUTO/SELF REFRESH-SDRAM - Mobile2.3V~3VBOTTOM-12.5V0.8mm---3V2.3V256Mb 16M x 161-Volatile166MHz5.5nsDRAMParallel16b16MX163-STATE16--0.00001ACOMMON81921248FP12481.2mm8mm-ROHS3 Compliant-YESNot Qualified2.5VSYNCHRONOUS0.09mA----------
-
-Surface Mount86-TFSOP (0.400, 10.16mm Width)860°C~70°C TATraye0-Obsolete2 (1 Year)86EAR99Tin/Lead (Sn/Pb)AUTO/SELF REFRESH8542.32.00.24SDRAM3V~3.6VDUALNOT SPECIFIED13.3V0.5mmNOT SPECIFIED86-3.6V3V256Mb 8M x 321-Volatile143MHz5.5nsDRAMParallel32b8MX32-32--0.002ACOMMON40961248FP12481.2mm22.22mm-Non-RoHS Compliant-YESNot Qualified3.3VSYNCHRONOUS0.27mAnot_compliant268435456 bit--------
-
-Surface Mount90-TFBGA900°C~70°C TATape & Reel (TR)--Obsolete2 (1 Year)-----SDRAM3V~3.6V----------256Mb 8M x 32--Volatile166MHz5.5nsDRAMParallel32b-------------RoHS Compliant--------90-TFBGA (8x13)70°C0°C166MHzParallel3.6V3V166MHz
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