ISSI, Integrated Silicon Solution Inc IS25WP032D-JLLE
- Part Number:
- IS25WP032D-JLLE
- Manufacturer:
- ISSI, Integrated Silicon Solution Inc
- Ventron No:
- 3232292-IS25WP032D-JLLE
- Description:
- 32MB QPI/QSPI WSON ET
- Datasheet:
- IS25WP032D-JLLE
ISSI, Integrated Silicon Solution Inc IS25WP032D-JLLE technical specifications, attributes, parameters and parts with similar specifications to ISSI, Integrated Silicon Solution Inc IS25WP032D-JLLE.
- Factory Lead Time8 Weeks
- Mounting TypeSurface Mount
- Package / Case8-WDFN Exposed Pad
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyFLASH - NOR
- Voltage - Supply1.65V~1.95V
- Memory Size32Mb 4M x 8
- Memory TypeNon-Volatile
- Clock Frequency133MHz
- Memory FormatFLASH
- Memory InterfaceSPI - Quad I/O, QPI, DTR
- Write Cycle Time - Word, Page800μs
- RoHS StatusROHS3 Compliant
IS25WP032D-JLLE Overview
The mounting type for this particular electronic component is surface mount, making it easy to install on a variety of surfaces. The package or case is 8-WDFN exposed pad, providing a compact and secure housing for the component. It is designed to operate within a wide temperature range of -40°C to 105°C TA, making it suitable for use in various environments. The part status is active, indicating that it is currently in production and readily available. It has a moisture sensitivity level of 3, meaning it can withstand exposure to moisture for up to 168 hours. This component has a memory size of 32Mb 4M x 8 and is non-volatile, ensuring that data is retained even when power is turned off. It utilizes a FLASH memory format and has a SPI - Quad I/O, QPI, DTR interface for efficient data transfer. Additionally, it is compliant with the ROHS3 standards for environmentally-friendly materials.
IS25WP032D-JLLE Features
Package / Case: 8-WDFN Exposed Pad
IS25WP032D-JLLE Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS25WP032D-JLLE Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The mounting type for this particular electronic component is surface mount, making it easy to install on a variety of surfaces. The package or case is 8-WDFN exposed pad, providing a compact and secure housing for the component. It is designed to operate within a wide temperature range of -40°C to 105°C TA, making it suitable for use in various environments. The part status is active, indicating that it is currently in production and readily available. It has a moisture sensitivity level of 3, meaning it can withstand exposure to moisture for up to 168 hours. This component has a memory size of 32Mb 4M x 8 and is non-volatile, ensuring that data is retained even when power is turned off. It utilizes a FLASH memory format and has a SPI - Quad I/O, QPI, DTR interface for efficient data transfer. Additionally, it is compliant with the ROHS3 standards for environmentally-friendly materials.
IS25WP032D-JLLE Features
Package / Case: 8-WDFN Exposed Pad
IS25WP032D-JLLE Applications
There are a lot of ISSI, Integrated Silicon Solution Inc
IS25WP032D-JLLE Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
IS25WP032D-JLLE More Descriptions
Serial Flash Memory with 133MHz Multi I/O SPI & Quad I/O QPI DTR Interface 32Mb 4Mx8 1.8V 8-Pin WSON Tray
NOR Flash 32M QPI/QSPI, WSON ET
IC FLASH 32MBIT SPI/QUAD 8WSON
NOR Flash 32M QPI/QSPI, WSON ET
IC FLASH 32MBIT SPI/QUAD 8WSON
The three parts on the right have similar specifications to IS25WP032D-JLLE.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusSurface MountNumber of PinsJESD-609 CodeNumber of TerminationsTerminal FinishTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)InterfaceOperating ModeMemory WidthMemory DensityProgramming VoltageLengthHeight Seated (Max)WidthPeak Reflow Temperature (Cel)Time@Peak Reflow Temperature-Max (s)JESD-30 CodeOrganizationParallel/SerialOperating Supply VoltageSupply Current-MaxOutput CharacteristicsAddress Bus WidthDensityStandby Current-MaxSerial Bus TypeEnduranceData Retention Time-MinWrite ProtectionAlternate Memory WidthPage SizeView Compare
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IS25WP032D-JLLE8 WeeksSurface Mount8-WDFN Exposed Pad-40°C~105°C TATrayActive3 (168 Hours)FLASH - NOR1.65V~1.95V32Mb 4M x 8Non-Volatile133MHzFLASHSPI - Quad I/O, QPI, DTR800μsROHS3 Compliant-------------------------------------
-
-Surface Mount8-SOIC (0.154, 3.90mm Width)-40°C~105°C TATubeDiscontinued3 (168 Hours)FLASH - NOR2.3V~3.6V2Mb 256K x 8Non-Volatile80MHzFLASHSPI - Quad I/O400μsROHS3 CompliantYES8e38Tin (Sn)DUAL13V1.27mm3.6V2.3VSPI, SerialSYNCHRONOUS82097152 bit3V4.9mm1.75mm3.9mm-----------------
-
8 WeeksSurface Mount8-WDFN Exposed Pad-40°C~105°C TATape & Reel (TR)Active3 (168 Hours)FLASH - NOR2.3V~3.6V256Mb 32M x 8Non-Volatile133MHzFLASHSPI - Quad I/O, QPI, DTR800μsROHS3 CompliantYES--8-DUAL13V1.27mm3.6V2.3V-SYNCHRONOUS8268435456 bit3V8mm0.85mm6mmNOT SPECIFIEDNOT SPECIFIEDR-PDSO-N832MX8SERIAL------------
-
8 WeeksSurface Mount8-SOIC (0.209, 5.30mm Width)-40°C~105°C TATape & Reel (TR)Active3 (168 Hours)FLASH - NOR2.3V~3.6V128Mb 16M x 8Non-Volatile133MHzFLASHSPI - Quad I/O, QPI1msROHS3 CompliantYES8-8-DUAL13V1.27mm3.6V2.7VSPI, SerialSYNCHRONOUS8---2.16mm------3V0.014mA3-STATE24b128 Mb0.000065A4-WIRE100000 Write/Erase Cycles20HARDWARE/SOFTWARE1256B
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