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Home > Products > Integrated Circuits (ICs) > Clock/Timing - Clock Buffers, Drivers > IDT74FCT3807APY8
IDT74FCT3807APY8
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IDT, Integrated Device Technology Inc IDT74FCT3807APY8

Part Number:

IDT74FCT3807APY8

Manufacturer:

IDT, Integrated Device Technology Inc

Ventron No:

2975608-IDT74FCT3807APY8

Description:

IC CLK BUFFER 1:10 100MHZ 20SSOP

ECAD Model:

Datasheet:

IDT74FCT3807(A)

Payment:

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Delivery:

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Part Overview

Description
The IDT74FCT3807/A is a 3.3V clock driver built using advanced dual metal CMOS technology. It offers a 1:10 fanout, reducing loading on the preceding driver and providing an efficient clock distribution network. The device features low capacitance inputs with hysteresis for improved noise margins, and multiple power and grounds to reduce noise.

Features
0.5micron CMOS technology
Guaranteed low skew (<350ps max.)
Very low duty cycle distortion (<350ps max.)
High speed: propagation delay <3ns (max.)
Very low CMOS power levels
TTL compatible inputs and outputs
1:10 fanout
Maximum output rise and fall time <1.5ns (max.)
Low input capacitance: 4.5pF typical
Vcc = 3.3V ± 0.3V
Inputs can be driven from 3.3V or 5V components
Available in SSOP, SOIC, and QSOP packages

Applications
Clock and signal distribution

Specifications

IDT, Integrated Device Technology Inc IDT74FCT3807APY8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc IDT74FCT3807APY8.

  • Mount
    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    SSOP
  • Packaging
    Tape & Reel (TR)
  • Published
    2009
  • JESD-609 Code
    e0
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1
  • Number of Terminations
    20
  • Max Operating Temperature
    70°C
  • Min Operating Temperature
    0°C
  • Additional Feature
    MAX PART TO PART SKEW = 0.75NS
  • Subcategory
    Clock Drivers
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    30
  • Pin Count
    20
  • JESD-30 Code
    R-PDSO-G20
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    3.6V
  • Power Supplies
    3.3V
  • Temperature Grade
    COMMERCIAL
  • Supply Voltage-Min (Vsup)
    3V
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Load Capacitance

    Load Capacitance (CL) is a parameter that specifies the maximum capacitance that can be connected to the output of an electronic component without affecting its performance. It is typically measured in picofarads (pF) or nanofarads (nF). A high load capacitance can cause the output voltage to drop or the output current to increase, which can lead to instability or damage to the component.

    50pF
  • Frequency (Max)
    100MHz
  • Family
    FCT
  • Output Characteristics
    3-STATE
  • Input
    LVTTL
  • Logic IC Type
    LOW SKEW CLOCK DRIVER
  • Max I(ol)
    0.024 A
  • Propagation Delay (tpd)
    4.3 ns
  • Same Edge Skew-Max (tskwd)
    0.35 ns
  • Number of True Outputs
    10
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    7.2mm
  • Width
    5.3mm
  • RoHS Status
    RoHS Compliant

Product Comparison

The three parts on the right have similar specifications to IDT74FCT3807APY8.
  • Image
    Part Number
    Manufacturer
    Mount
    Package / Case
    Packaging
    Published
    JESD-609 Code
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Max Operating Temperature
    Min Operating Temperature
    Additional Feature
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Pin Count
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Temperature Grade
    Supply Voltage-Min (Vsup)
    Number of Circuits
    Load Capacitance
    Frequency (Max)
    Family
    Output Characteristics
    Input
    Logic IC Type
    Max I(ol)
    Propagation Delay (tpd)
    Same Edge Skew-Max (tskwd)
    Number of True Outputs
    Length
    Width
    RoHS Status
    Mounting Type
    Operating Temperature
    Series
    Part Status
    Voltage - Supply
    Base Part Number
    Output
    Ratio - Input:Output
    Differential - Input:Output
    Reach Compliance Code
    Supplier Device Package
    View Compare
  • IDT74FCT3807APY8
    IDT74FCT3807APY8
    IDT, Integrated Device Technology Inc
    Surface Mount
    SSOP
    Tape & Reel (TR)
    2009
    e0
    1
    20
    70°C
    0°C
    MAX PART TO PART SKEW = 0.75NS
    Clock Drivers
    CMOS
    DUAL
    GULL WING
    225
    1
    3.3V
    0.65mm
    30
    20
    R-PDSO-G20
    Not Qualified
    3.6V
    3.3V
    COMMERCIAL
    3V
    1
    50pF
    100MHz
    FCT
    3-STATE
    LVTTL
    LOW SKEW CLOCK DRIVER
    0.024 A
    4.3 ns
    0.35 ns
    10
    7.2mm
    5.3mm
    RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • IDT74FCT3807ASOI8
    IDT74FCT3807ASOI8
    IDT, Integrated Device Technology Inc
    -
    20-SOIC (0.295, 7.50mm Width)
    Tape & Reel (TR)
    -
    -
    1 (Unlimited)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1
    -
    100MHz
    -
    -
    LVTTL
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    Surface Mount
    -40°C~85°C
    74FCT
    Obsolete
    3V~3.6V
    IDT74FCT3807
    CMOS, TTL
    1:10
    No/No
    -
    -
    IDT74FCT3807APY8 vs IDT74FCT3807ASOI8
  • IDT74FCT807CTPY8
    IDT74FCT807CTPY8
    IDT, Integrated Device Technology Inc
    Surface Mount
    SSOP
    Tape & Reel (TR)
    2009
    e0
    1
    20
    70°C
    0°C
    MAX PART TO PART SKEW = 0.75NS
    Clock Drivers
    CMOS
    DUAL
    GULL WING
    225
    1
    5V
    0.65mm
    30
    20
    R-PDSO-G20
    Not Qualified
    5.25V
    5V
    COMMERCIAL
    4.75V
    1
    50pF
    100MHz
    FCT
    -
    TTL
    LOW SKEW CLOCK DRIVER
    0.048 A
    3.5 ns
    0.35 ns
    10
    7.2mm
    5.3mm
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    not_compliant
    -
    IDT74FCT3807APY8 vs IDT74FCT807CTPY8
  • IDT74FCT3807SOI8
    IDT74FCT3807SOI8
    IDT, Integrated Device Technology Inc
    -
    20-SOIC (0.295, 7.50mm Width)
    Tape & Reel (TR)
    -
    -
    1 (Unlimited)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    1
    -
    100MHz
    -
    -
    LVTTL
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    Surface Mount
    -40°C~85°C
    74FCT
    Obsolete
    3V~3.6V
    IDT74FCT3807
    CMOS, TTL
    1:10
    No/No
    -
    20-SOIC
    IDT74FCT3807APY8 vs IDT74FCT3807SOI8

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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