IDT, Integrated Device Technology Inc ICS954227CGLFT

ICS954227CGLFT Overview
The Mount surface mount technology has revolutionized the packaging and assembly of electronic components. One such example is the TFSOP package, which stands for Thin Small Outline Package. This package, also known as a case, is designed to be compact and lightweight, making it ideal for a variety of applications. The TFSOP package is commonly used in high-frequency circuits, as it has a maximum operating frequency of 400MHz. In addition, this package is RoHS compliant, meaning it meets the strict environmental standards set in 2013. Its operating temperature range of 0°C to 70°C makes it suitable for a wide range of environments. The TFSOP package is typically supplied in Tape & Reel packaging, making it convenient for automated assembly processes. With its single circuit design and absence of a PLL (Phase Locked Loop), the TFSOP package offers a cost-effective solution for electronic systems.

ICS954227CGLFT Features
Mounting Type: Surface Mount
Include 1 Circuits
run the output at th range of Clock


ICS954227CGLFT Applications
There are a lot of Renesas Electronics America Inc.
ICS954227CGLFT application specific timer applications.


Network Attached Storage
Multi-function Printer
Wireless Access Point
Routers
Ethernet switch/router
PCI Express 2.0/3.0
Broadcast video/audio timing
Processor and FPGA clocking
Any-frequency clock conversion
MSAN/DSLAM/PON