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IDT, Integrated Device Technology Inc ICS853111AYLFT

Part Number:

ICS853111AYLFT

Manufacturer:

IDT, Integrated Device Technology Inc

Ventron No:

2975392-ICS853111AYLFT

Description:

IC CLK BUFFER 2:10 3GHZ 32TQFP

ECAD Model:

Datasheet:

ICS853111

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Part Overview

Description
The ICS853111A is a low skew, highperformance 1to10 Differentialto2.5V/3.3V LVPECL/ECL Fanout Buffer. It is a member of the HiPerClockS family of High Performance Clock Solutions from IDT. The ICS853111A is characterized to operate from either a 2.5V, 3.3V, or a 5V power supply. Guaranteed output and parttopart skew characteristics make the ICS853111A ideal for clock distribution applications demanding welldefined performance and repeatability.

Features
Ten differential LVPECL outputs
Two selectable differential LVPECL PCLK/nPCLK clock inputs
PCLK, nPCLK pairs can accept the following differential input levels: LVPECL, LVDS, CML, SSTL
Maximum output frequency: >3GHz
Translates any singleended input signal to 3.3V LVPECL levels with resistor bias on nPCLK input
Additive phase jitter, RMS: <0.3ps (typical)
Output skew: 23ps (typical)
Parttopart skew: 85ps (typical)
Propagation delay: 705ps (typical)
LVPECL mode operating voltage supply range: VCC 2.375V to 5.25V, VEE = 0V
ECL mode operating voltage supply range: VCC 0V, VEE = 5.25V to 2.375V
40°C to 85°C ambient operating temperature
Available in both standard (RoHS 5) and leadfree (RoHS 6) packages

Applications
Clock distribution
Networking
Telecommunications
Test and measurement
Highspeed data processing

Specifications

IDT, Integrated Device Technology Inc ICS853111AYLFT technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc ICS853111AYLFT.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    32-LQFP
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Voltage - Supply
    2.375V~5.25V
  • Base Part Number
    ICS853111
  • Output
    ECL, LVPECL
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Frequency (Max)
    3GHz
  • Input
    CML, LVDS, LVPECL, SSTL
  • Ratio - Input:Output
    2:10
  • Differential - Input:Output
    Yes/Yes

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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