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NXP USA Inc. HTMS8201FTK/AF,115

Part Number:

HTMS8201FTK/AF,115

Manufacturer:

NXP USA Inc.

Ventron No:

4409766-HTMS8201FTK/AF,115

Description:

RFID HTAG SOT899-1

Datasheet:

HTMS8201FTK/AF,115

Payment:

Payment

Delivery:

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Specifications

NXP USA Inc. HTMS8201FTK/AF,115 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. HTMS8201FTK/AF,115.

  • Factory Lead Time
    16 Weeks
  • Packaging
    Tape & Reel (TR)
  • Published
    2010
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    HITAG™
  • Size / Dimension
    3.00mmx2.00mmx0.85mm
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    Passive
  • Style

    Style in the context of electronic components refers to the physical form or design of the component. It encompasses various aspects such as the shape, size, mounting method, and packaging. The style of a component is crucial for determining its compatibility with specific applications and circuit board designs. It ensures proper fit, functionality, and ease of assembly. Common styles include through-hole, surface mount, axial, radial, and various specialized form factors tailored to specific applications.

    Encapsulated
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    100kHz~150kHz
  • Pin Count
    2
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Read/Write
  • Standards
    ISO 11784, ISO 11785
  • Source Url Status Check Date
    2013-10-15 00:00:00
  • Writable Memory
    1.76kb (User)
  • RoHS Status
    ROHS3 Compliant

Description

Images are for reference only.See Product Specifications for product details.If you are interested to buy NXP Semiconductors / Freescale HTMS8201FTK/AF,115.
HTMS8201FTK/AF,115 More Descriptions
Hitag (Iso14223) And (Iso11784/85) Transponder Ic Rohs Compliant: Yes |Nxp HTMS8201FTK/AF,115
NFC/RFID Tag and Transponder IC 100kHz to 150kHz 1760bit 2-Pin HVSON EP Tape and Reel
HITAG Transponder 2-Pin HVSON EP T/R
LF TAG IC, 1760BIT, 280PF, HVSON2
LF TAG IC, 1760BIT, 280PF, HVSON2; Frequency Min: 100kHz; Frequency Max: 150kHz; RFID IC Type: Read, Write; Programmable Memory: 1KB; Output Power: -; RF IC Case Style: SON; No. of Pins: 2Pins; Supply Voltage Min: 4V; Supply Vol

Product Comparison

The three parts on the right have similar specifications to HTMS8201FTK/AF,115.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Packaging
    Published
    Series
    Size / Dimension
    Part Status
    Moisture Sensitivity Level (MSL)
    Technology
    Style
    Frequency
    Pin Count
    Memory Type
    Standards
    Source Url Status Check Date
    Writable Memory
    RoHS Status
    Operating Temperature
    Reach Compliance Code
    View Compare
  • HTMS8201FTK/AF,115
    HTMS8201FTK/AF,115
    16 Weeks
    Tape & Reel (TR)
    2010
    HITAG™
    3.00mmx2.00mmx0.85mm
    Active
    1 (Unlimited)
    Passive
    Encapsulated
    100kHz~150kHz
    2
    Read/Write
    ISO 11784, ISO 11785
    2013-10-15 00:00:00
    1.76kb (User)
    ROHS3 Compliant
    -
    -
    -
  • HTMS1301FUG/AM,005
    -
    -
    2010
    -
    -
    Obsolete
    1 (Unlimited)
    Passive
    Encapsulated
    100kHz~150kHz
    -
    Read/Write
    -
    -
    -
    -
    -40°C~85°C
    -
  • HTMS1101FUG/AM,005
    -
    -
    2011
    -
    -
    Obsolete
    1 (Unlimited)
    Passive
    Encapsulated
    100kHz~150kHz
    -
    Read/Write
    -
    -
    -
    -
    -40°C~85°C
    -
  • HTMS1101FTK/AF,115
    -
    Tape & Reel (TR)
    2011
    HITAG® µ
    1.45mmx1.00mmx0.50mm
    Obsolete
    1 (Unlimited)
    Passive
    Encapsulated
    100kHz~150kHz
    2
    Read/Write
    ISO 11784, ISO 11785
    2013-10-15 00:00:00
    1.76kb (User)
    ROHS3 Compliant
    -
    unknown

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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