Inphi Corporation HPCS3487C.B0-998974

HPCS3487C.B0-998974 Overview
The mounting type for this particular product is surface mount, meaning it is designed to be placed directly onto a surface rather than being inserted into a socket. The package or case for this product is a 1369-BGA, which refers to the type of ball grid array used in the packaging. This product is packaged in trays, which are used to hold and transport electronic components. However, it is important to note that this product is now considered obsolete and is no longer being produced. The moisture sensitivity level (MSL) for this product is 4, indicating that it can withstand exposure to moisture for up to 72 hours. Finally, the interface for this product is Interlaken, XAUI, which refers to the type of communication protocol used for data transfer.

HPCS3487C.B0-998974 Features
Available in the 1369-BGA package

HPCS3487C.B0-998974 Applications
There are a lot of Inphi Corporation HPCS3487C.B0-998974 Telecom applications.

DSLAMs
High speed data transmission line cards
Frame Relay Switches and Access Devices (FRADS)
ATM equipment with integrated DS1 interfaces
T1 Rates PCM Line Interface
PBX interfaces
Fiber
Central office (CO)
Wireless base stations
Central office