Bergquist GF4000-00-240-50CC
- Part Number:
- GF4000-00-240-50CC
- Manufacturer:
- Bergquist
- Ventron No:
- 2508534-GF4000-00-240-50CC
- Description:
- GAP FILLER 4000 50CC CARTRIDGE
- ECAD Model:
-
- Datasheet:
- GF4000-00-240-50CC
Bergquist GF4000-00-240-50CC technical specifications, attributes, parameters and parts with similar specifications to Bergquist GF4000-00-240-50CC.
- Factory Lead Time10 Weeks
- SeriesGap Filler 4000
- Published2013
- Size / Dimension50cc Cartridge
- Part StatusActive
- Moisture Sensitivity Level (MSL)Not Applicable
- ColorBlue
- Shelf Life5 Months
- Storage/Refrigeration Temperature77°F 25°C
- Shelf Life StartDate of Manufacture
- Thermal Conductivity4.00W/m-K
- Usable Temperature Range-76°F~392°F -60°C~200°C
- Material Flammability RatingUL94 V-0
- RoHS StatusROHS3 Compliant
GF4000-00-240-50CC Description
BERGQUIST GAP FILLER TGF 4000 is a two-part, high thermal conductivity, liquid gap-filling material. The mixed system will cure at room temperature and can be accelerated with the addition of heat. BERGQUIST GAP FILLER TGF 4000 offers an extended working time to allow greater flexibility in the customer’s assembly process. Liquid-dispensed thermal materials offer infinite thickness variations and impart little to no stress on sensitive components during assembly. BERGQUIST GAP FILLER TGF 4000 exhibits low-level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.
GF4000-00-240-50CC Features
Thermal Conductivity: 4.0 W/m-K Extended working time for manufacturing flexibility Ultra-conforming, with excellent wet-out 100% solids - no cure by-products Excellent low and high-temperature mechanical and chemical stability
GF4000-00-240-50CC Applications
Automotive electronics (HEV, NEV, batteries) Computer and peripherals Between any heat-generating semiconductor and a heat sink Telecommunications
BERGQUIST GAP FILLER TGF 4000 is a two-part, high thermal conductivity, liquid gap-filling material. The mixed system will cure at room temperature and can be accelerated with the addition of heat. BERGQUIST GAP FILLER TGF 4000 offers an extended working time to allow greater flexibility in the customer’s assembly process. Liquid-dispensed thermal materials offer infinite thickness variations and impart little to no stress on sensitive components during assembly. BERGQUIST GAP FILLER TGF 4000 exhibits low-level natural tack characteristics and is intended for use in applications where a strong structural bond is not required.
GF4000-00-240-50CC Features
Thermal Conductivity: 4.0 W/m-K Extended working time for manufacturing flexibility Ultra-conforming, with excellent wet-out 100% solids - no cure by-products Excellent low and high-temperature mechanical and chemical stability
GF4000-00-240-50CC Applications
Automotive electronics (HEV, NEV, batteries) Computer and peripherals Between any heat-generating semiconductor and a heat sink Telecommunications
GF4000-00-240-50CC More Descriptions
Thermal Interface Products Gap Filler, 2-Part, No Spacer Beads, Pot Life=240m, 50cc, TGF4000/4000
GAP FILLER 4000 50CC CARTRIDGE
Gap Filler 4000 50 CC
GAP FILLER 50CC DUAL CART
GAP FILLER 4000 50CC CARTRIDGE
Gap Filler 4000 50 CC
GAP FILLER 50CC DUAL CART
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