Fairchild/ON Semiconductor FPF2G120BF07ASP
- Part Number:
- FPF2G120BF07ASP
- Manufacturer:
- Fairchild/ON Semiconductor
- Ventron No:
- 2493294-FPF2G120BF07ASP
- Description:
- IC LOAD SWITCH
- Datasheet:
- FPF2G120BF07ASP
Fairchild/ON Semiconductor FPF2G120BF07ASP technical specifications, attributes, parameters and parts with similar specifications to Fairchild/ON Semiconductor FPF2G120BF07ASP.
- Factory Lead Time46 Weeks
- MountThrough Hole
- Mounting TypeThrough Hole
- Package / CaseModule
- Number of Pins17
- Weight45g
- Operating Temperature-40°C~150°C TJ
- Published2014
- Pbfree Codeyes
- Part StatusLast Time Buy
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- ECCN CodeEAR99
- HTS Code8542.39.00.01
- Max Power Dissipation156W
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
- Configuration3 Independent
- Power - Max156W
- InputStandard
- Collector Emitter Voltage (VCEO)2.2V
- Max Collector Current40A
- Current - Collector Cutoff (Max)250μA
- Collector Emitter Breakdown Voltage650V
- Isolation Voltage2.5kV
- Vce(on) (Max) @ Vge, Ic2.2V @ 15V, 40A
- IGBT TypeField Stop
- NTC ThermistorYes
- RoHS StatusROHS3 Compliant
FPF2G120BF07ASP Description
The 3ch boost architecture of the FPF2G120BF07ASP offers an ideal option for the multi-string solar application. Additionally, the integrated SiC diodes and high-speed field-stop IGBTs offer lower conduction and switching losses. Additionally, the pre-applied PCM does not need to go through the printing procedure for the thermal interface material. The screw clamp also offers a dependable and quick installation option.
FPF2G120BF07ASP Features
? High Performance
? Minimal Switching and Conduction Losses
? IGBT High Speed Field Stop
? SBD for Boost Diode in SiC
? Internal NTC for Monitoring Temperature
FPF2G120BF07ASP Applications
Inverter solar
The 3ch boost architecture of the FPF2G120BF07ASP offers an ideal option for the multi-string solar application. Additionally, the integrated SiC diodes and high-speed field-stop IGBTs offer lower conduction and switching losses. Additionally, the pre-applied PCM does not need to go through the printing procedure for the thermal interface material. The screw clamp also offers a dependable and quick installation option.
FPF2G120BF07ASP Features
? High Performance
? Minimal Switching and Conduction Losses
? IGBT High Speed Field Stop
? SBD for Boost Diode in SiC
? Internal NTC for Monitoring Temperature
FPF2G120BF07ASP Applications
Inverter solar
FPF2G120BF07ASP More Descriptions
HPM(High Power Module) - HPM F2 PKG, 32LD, SOLDERING TERMINAL, 3CH BOOST MODULE, PCM
Power Integrated Module (PIM), F2, SiC Diode IGBT, 650 V, 40 A with pre-applied thermal interface material
Insulated Gate Bipolar Transistor, 40A I(C), 650V V(BR)CES, N-Channel
Trans IGBT Module N-CH 650V 40A 17-Pin Case F2
IGBT Modules High Power Module
The FPF2G120BF07ASP is the 3ch boost topology which is providing an optimized solution for the multi-string solar application. And the integrated high speed field stop IGBTs and SiC diodes are providing lower conduction and switching losses. And the pre-applied PCM requires no additional process of the thermal interface material printing. Furthermore, the screwclamp provides a fast and reliable mounting method.
Power Integrated Module (PIM), F2, SiC Diode IGBT, 650 V, 40 A with pre-applied thermal interface material
Insulated Gate Bipolar Transistor, 40A I(C), 650V V(BR)CES, N-Channel
Trans IGBT Module N-CH 650V 40A 17-Pin Case F2
IGBT Modules High Power Module
The FPF2G120BF07ASP is the 3ch boost topology which is providing an optimized solution for the multi-string solar application. And the integrated high speed field stop IGBTs and SiC diodes are providing lower conduction and switching losses. And the pre-applied PCM requires no additional process of the thermal interface material printing. Furthermore, the screwclamp provides a fast and reliable mounting method.
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