United Chemi-Con ESMH251VNN102MA40T

Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Voltage - Rated refers to the maximum voltage that an electronic component can withstand without being damaged. It is typically specified in volts (V) and is an important parameter to consider when selecting components for a circuit. Exceeding the rated voltage can lead to component failure, so it is important to ensure that the voltage applied to a component does not exceed its rated voltage.

Capacitance is the ability of a component to store electrical charge. It is measured in farads (F). A capacitor is a passive electronic component that consists of two conductors separated by an insulator. When a voltage is applied across the capacitor, charge builds up on the conductors. The amount of charge that can be stored depends on the capacitance of the capacitor. Capacitors are used in a variety of electronic circuits, including filters, timing circuits, and energy storage devices.

Lead spacing refers to the distance between the centers of two adjacent leads on an electronic component. It is typically measured in millimeters (mm) or inches (in). Lead spacing is an important parameter to consider when designing printed circuit boards (PCBs), as it determines the size and layout of the board. Proper lead spacing ensures that the component can be properly mounted and soldered onto the PCB, and that there is sufficient clearance between the leads to prevent short circuits.

Test Frequency refers to the frequency at which an electronic component is tested to ensure it meets its specified performance parameters. It is typically expressed in Hertz (Hz) and represents the frequency range over which the component is tested. This parameter is important for ensuring the component's reliability and performance under different operating conditions.

Polarization in electronic components refers to the orientation of the electric field within the component. It is a measure of the component's ability to store electrical energy. A polarized component has a positive and a negative terminal, and the electric field is oriented from the positive to the negative terminal. When a polarized component is connected to a voltage source, the electric field is established and the component stores electrical energy.

Dissipation Factor (DF) is a measure of the energy lost in a capacitor due to its internal resistance. It is expressed as a percentage of the total energy stored in the capacitor. A low DF indicates a high-quality capacitor with low energy loss, while a high DF indicates a low-quality capacitor with significant energy loss. DF is important in applications where energy efficiency is crucial, such as power factor correction and filtering circuits.