Altera EPM7192EGI160-20

EPM7192EGI160-20 Overview
The package or case for this particular electronic component is a 160-BPGA, which stands for Ball Grid Array Package. This type of package is commonly used in integrated circuits and offers a high level of reliability and performance. The JESD-609 code for this component is e0, indicating that it is a standard package size and shape. However, the part status is now obsolete, meaning that it is no longer being manufactured. This package has a total of 160 terminations, which are used to connect the component to a circuit board. The ECCN code for this package is EAR99, which means it is not controlled for export. One of the additional features of this package is its configurable I/O operation, which can be set to either 3.3V or 5V. The technology used in this package is CMOS, which stands for Complementary Metal-Oxide-Semiconductor. The peak reflow temperature for this package is 220 degrees Celsius, indicating the maximum temperature it can withstand during assembly. This package also has a clock frequency of 83.3MHz, and a total of 12 logic elements or blocks.

EPM7192EGI160-20 Features
160-BPGA package
124 I/Os
The operating temperature of -40°C~85°C TA
3.3/55V power supplies

EPM7192EGI160-20 Applications
There are a lot of Intel EPM7192EGI160-20 CPLDs applications.

Random logic replacement
PULSE WIDTH MODULATION (PWM)
Parity generators
Digital systems
Multiple DIP Switch Replacement
Software Configuration of Add-In Boards
White goods (Washing, Cold, Aircon ,...)
Pattern recognition
Discrete logic functions
TIMERS/COUNTERS